Co-Chair: M. Alodan
| Time | Abs# | Title | View |
|---|---|---|---|
| o | 638 | Electrodeposition of Copper on Porous Reticular Cathode - K.H. Lee, H.Y. Lee, and W.Y. Jeung (Korea Institute of Science and Technology) | |
| o | 639 | In-Situ FTIR Investigation of Sulfate Adsorbed on Cu(111) - M. Arenz, M. Lennartz, P. Broekmann, E. Vogler, and K. Wandelt (University Bonn) | |
| o | 640 | Underpotential Deposition of Lead on Cu(111) - M. Duisberg, P. Wahl, Z. Park, C. Bach, C. Stuhlmann, and K. Wandelt (Universitaet Bonn) | |
| o | 641 | Effect of Gravitational Levels on Electrodeposition of Copper in a Cavity - Y. Konishi, Y. Fukunaka, K. Tsukada, K. Hanasaki (Kyoto University), and K. Kuribayashi (Institute of Space and Astronoutical Science) | |
| o | 642 | Kinetics and STM Studies of Copper Electrodeposition on Iodine-Modified Au(111) in Sulfuric Acid Solution - A. Martinez-Ruiz, J. Valenzuela-Benavides, L. Morales de la G, M. Palomar-Pardave, and N. Batina (UABC) |
Co-Chair: M. Alodan
| Time | Abs# | Title | View |
|---|---|---|---|
| 10:00 | 643 | The Role of Chloride, Oxygen and Additives in Copper Deposition on Low-Index Copper Surfaces - D. Barkey (University of New Hampshire) | |
| 10:30 | 644 | Superconformal Electrodeposition of Copper in 500-75 nm Features - T. Moffat, J. Bonevich, W. Huber (NIST), A. Stanishevsky (University of Maryland), D. Kelly, G. Stafford, and D. Josell (NIST) | |
| 11:00 | 645 | Anomalous Scaling of the Surface Roughness during Cu Electrodeposition - S. Huo and W. Schwarzacher (University of Bristol) | |
| 11:30 | 646 | In-Situ Atomic Scale Studies of the Dynamics of Copper Dissolution and Deposition by Video-STM - L. Zitzler, B. Gleich, O. Magnussen, and J. Behm (University Ulm) |
Co-Chair: J. Lipkowski
| Time | Abs# | Title | View |
|---|---|---|---|
| 1:45 | 647 | Electrodeposition of Copper onto Si(111) with Controlled Surface Structure - C. Ji, G. Oskam, and P. Searson (Johns Hopkins University) | |
| 2:05 | 648 | The Effect of Additives on Copper Deposition from Copper Sulfate Bath - A. Radisic and P. Searson (The Johns Hopkins University) | |
| 2:25 | 649 | Interference Effect of Adjacent Patterns - Copper Electrodeposition - K. Kondo (Okayama University), K. Fukui (Himeji Institute of Technology), and S. Maruyama (Okayama University) | |
| 2:45 | 650 | In Situ Electrochemical AFM, EXAFS, and Optical Monitoring of Electrodeposition of Cu on p-GaAs(001) Electrodes - K. Uosaki, M. Koinuma, K. Tamura, and T. Kondo (Hokkaido University) | |
| 3:05 | Twenty-Five-Minute Intermission | ||
| 3:30 | 651 | Electrochemical Deposition of Copper in Microstructures - S. Soukane, S. Sen, and T. Cale (Rensselaer Polytechnic Institute) | |
| 3:50 | 652 | Multiscale Modeling of Electrochemical Deposition and Microloading Effects - M. Bloomfield (Interconnects for Gigascale Integration), K. Jansen (Rensselaer Polytechnic Institute), and T. Cale (Interconnects for Gigascale Integration) | |
| 4:10 | 653 | Influence of Additives on the Shape Evolution of Cu Electrodeposits on Planar and Trenched Surfaces - A.A. Gewirth, M. Kang, T.Y.B. Leung, and M.E. Biggin (University of Illinois) |
Co-Chair: G.S. Frankel
| Time | Abs# | Title | View |
|---|---|---|---|
| 8:00 | 654 | The Chemical-Mechanical Polishing of Copper with Model Slurries - B.-C. Lee, D.J. Duquette, and R.J. Gutmann (Rensselaer Polytechnic Institute) | |
| 8:30 | 655 | The Effects of Mechanical Parameters on CMP Characteristics Analyzed by Direct Measurement of Friction Force - Y. Homma, K. Fukushima, S. Kondo, and N. Sakuma (Hitachi, Ltd.) | GIF |
| 9:00 | 656 | Structures and Dynamics of Copper-Electrolyte-Interfaces Studied by in-situ STM and IRRAS - P. Broekmann, M. Wilms, A. Spaenig, J. Hommrich, M. Anastasescu, W. Lisowski, and K. Wandelt (University of Bonn) | |
| 9:30 | Thirty-Minute Intermission | ||
| 10:00 | 657 | The Effect of Additives on the Microstructure of Electroless Copper - C. Weber (EPCOS), H. Pickering, and K. Weil (Penn State University) | |
| 10:30 | 658 | High Resolution Imaging of Porosity of Ultrathin Diamond-Like Carbon Films on Copper and Other Metal Substrates - J. Evyu and W. Smyrl (UMN) | |
| 11:00 | 659 | Kinetics of Oxygen Reduction on Cu(hkl) in Perchloric and Sulfuric Acid Solutions: RRDE Study - G. Brisard, N. Bertrand, V. Trepanier (Universite de Sherbrooke), P.N. Ross, and N.M. Markovic (Lawrence Brekeley National Laboratory) | |
| 11:30 | 660 | In situ EC-STM and QCM Study of Copper Dissolution and Corrosion Inhibition Processes in Acidic Sulphate Containing Solutions - E. Kalman, A. Shaban, and E. Szocs (Chemical Research Center) | |
| 11:45 | 661 | Structure and Electrochemical Properties of Anodic Oxides on Copper - H.-H. Strehblow (Heinrich-Heine-Universitat Düsseldorf), V. Maurice, and P. Marcus (Universite Pierre et Marie Curie) |
Co-Chair: M. Alodan
| Time | Abs# | Title | View |
|---|---|---|---|
| 2:00 | 662 | Study of Oscillatory Phenomena During the Transpassive Electrodissolution of Copper in Phosphoric Acid - A. Eftekhari (K N Toosi University of Technology) | |
| 2:15 | 663 | Electropolishing Study for ULSI Planarization - R. Contolini, S. Mayer (Novellus Systems, Inc.), M. Ziomek-Moroz (Albany Research Center), E. Patton, and E. Broadbent (Novellus Systems, Inc.) | |
| 2:30 | 664 | Reversible Behaviour of Copper (II) in Presence of Aniline and Pyrrole Electropolymerization - L. Basaez and B.L. Rivas (Universidad de Concepcion) | |
| 2:45 | 665 | Thermal Oxidation Behavior of Copper Lead-Frame Alloys - G. Brown and K. Kobayashi (Keio University) | |
| 3:00 | Thirty-Minute Intermission | ||
| 3:30 | 666 | The Effect of Gas-Phase Mass Transport on the Atmospheric Sulfidation of Copper - J. Braithwaite, R. Larson, H. Moffat, W. Breiland, R. Sorensen, and C. Barbour (Sandia National Laboratories) | |
| 3:45 | 667 | Mechanism of GOI Degradation Caused by Cu Deposits on the Surface of Si Wafer - N. Nakamura, Y. Nakagawa, M. Piao, T. Ebe, and K. Eguchi (MEMC Japan Ltd.) | |
| 4:00 | 668 | Electrical Resistivity of Electroless and Galvanic Copper Thin Films - E. Meulenkamp (Philips Research Laboratories) and E. Naburgh (Philips Centre for Industrial Technology) | |
| 4:15 | 669 | Electroless and Electrochemical Deposition of Copper on a H-Terminated Si(111) Surface - S. Ye, T. Ichihara, and K. Uosaki (Hokkaido University) | |
| 4:30 | 670 | Copper Electroless Deposition on Nonconductive Surfaces - M. Alodan (King Saud University) |