198th Meeting - Phoenix, Arizona

October 22-27, 2000


K1 - Electrochemical Science and Technology of Copper

Electrodeposition Division/Dielectric Science and Technology Division/Physical Electrochemistry Division/Corrosion Division

Tuesday, October 24, 2000

Exhibit Hall D

Poster Session

Co-Chair: M. Alodan

o638 Electrodeposition of Copper on Porous Reticular Cathode - K.H. Lee, H.Y. Lee, and W.Y. Jeung (Korea Institute of Science and Technology) PDF
o639 In-Situ FTIR Investigation of Sulfate Adsorbed on Cu(111) - M. Arenz, M. Lennartz, P. Broekmann, E. Vogler, and K. Wandelt (University Bonn) PDF
o640 Underpotential Deposition of Lead on Cu(111) - M. Duisberg, P. Wahl, Z. Park, C. Bach, C. Stuhlmann, and K. Wandelt (Universitaet Bonn) PDF
o641 Effect of Gravitational Levels on Electrodeposition of Copper in a Cavity - Y. Konishi, Y. Fukunaka, K. Tsukada, K. Hanasaki (Kyoto University), and K. Kuribayashi (Institute of Space and Astronoutical Science) PDF
o642 Kinetics and STM Studies of Copper Electrodeposition on Iodine-Modified Au(111) in Sulfuric Acid Solution - A. Martinez-Ruiz, J. Valenzuela-Benavides, L. Morales de la G, M. Palomar-Pardave, and N. Batina (UABC) PDF

Wednesday, October 25, 2000

Yuma 27 & 32


Co-Chair: M. Alodan

10:00643 The Role of Chloride, Oxygen and Additives in Copper Deposition on Low-Index Copper Surfaces - D. Barkey (University of New Hampshire) PDF
10:30644 Superconformal Electrodeposition of Copper in 500-75 nm Features - T. Moffat, J. Bonevich, W. Huber (NIST), A. Stanishevsky (University of Maryland), D. Kelly, G. Stafford, and D. Josell (NIST) PDF
11:00645 Anomalous Scaling of the Surface Roughness during Cu Electrodeposition - S. Huo and W. Schwarzacher (University of Bristol) PDF
11:30646 In-Situ Atomic Scale Studies of the Dynamics of Copper Dissolution and Deposition by Video-STM - L. Zitzler, B. Gleich, O. Magnussen, and J. Behm (University Ulm) PDF

Electrodeposition (con't)

Co-Chair: J. Lipkowski

1:45647 Electrodeposition of Copper onto Si(111) with Controlled Surface Structure - C. Ji, G. Oskam, and P. Searson (Johns Hopkins University) PDF
2:05648 The Effect of Additives on Copper Deposition from Copper Sulfate Bath - A. Radisic and P. Searson (The Johns Hopkins University) PDF
2:25649 Interference Effect of Adjacent Patterns - Copper Electrodeposition - K. Kondo (Okayama University), K. Fukui (Himeji Institute of Technology), and S. Maruyama (Okayama University) PDF
2:45650 In Situ Electrochemical AFM, EXAFS, and Optical Monitoring of Electrodeposition of Cu on p-GaAs(001) Electrodes - K. Uosaki, M. Koinuma, K. Tamura, and T. Kondo (Hokkaido University) PDF
3:05 Twenty-Five-Minute Intermission
3:30651 Electrochemical Deposition of Copper in Microstructures - S. Soukane, S. Sen, and T. Cale (Rensselaer Polytechnic Institute) PDF
3:50652 Multiscale Modeling of Electrochemical Deposition and Microloading Effects - M. Bloomfield (Interconnects for Gigascale Integration), K. Jansen (Rensselaer Polytechnic Institute), and T. Cale (Interconnects for Gigascale Integration) PDF
4:10653 Influence of Additives on the Shape Evolution of Cu Electrodeposits on Planar and Trenched Surfaces - A.A. Gewirth, M. Kang, T.Y.B. Leung, and M.E. Biggin (University of Illinois) PDF

Thursday, October 26, 2000


Co-Chair: G.S. Frankel

8:00654 The Chemical-Mechanical Polishing of Copper with Model Slurries - B.-C. Lee, D.J. Duquette, and R.J. Gutmann (Rensselaer Polytechnic Institute) PDF
8:30655 The Effects of Mechanical Parameters on CMP Characteristics Analyzed by Direct Measurement of Friction Force - Y. Homma, K. Fukushima, S. Kondo, and N. Sakuma (Hitachi, Ltd.) GIF
9:00656 Structures and Dynamics of Copper-Electrolyte-Interfaces Studied by in-situ STM and IRRAS - P. Broekmann, M. Wilms, A. Spaenig, J. Hommrich, M. Anastasescu, W. Lisowski, and K. Wandelt (University of Bonn) PDF
9:30 Thirty-Minute Intermission
10:00657 The Effect of Additives on the Microstructure of Electroless Copper - C. Weber (EPCOS), H. Pickering, and K. Weil (Penn State University) PDF
10:30658 High Resolution Imaging of Porosity of Ultrathin Diamond-Like Carbon Films on Copper and Other Metal Substrates - J. Evyu and W. Smyrl (UMN) PDF
11:00659 Kinetics of Oxygen Reduction on Cu(hkl) in Perchloric and Sulfuric Acid Solutions: RRDE Study - G. Brisard, N. Bertrand, V. Trepanier (Universite de Sherbrooke), P.N. Ross, and N.M. Markovic (Lawrence Brekeley National Laboratory) PDF
11:30660 In situ EC-STM and QCM Study of Copper Dissolution and Corrosion Inhibition Processes in Acidic Sulphate Containing Solutions - E. Kalman, A. Shaban, and E. Szocs (Chemical Research Center) PDF
11:45661 Structure and Electrochemical Properties of Anodic Oxides on Copper - H.-H. Strehblow (Heinrich-Heine-Universitat Düsseldorf), V. Maurice, and P. Marcus (Universite Pierre et Marie Curie) PDF

General (con't)

Co-Chair: M. Alodan

2:00662 Study of Oscillatory Phenomena During the Transpassive Electrodissolution of Copper in Phosphoric Acid - A. Eftekhari (K N Toosi University of Technology) PDF
2:15663 Electropolishing Study for ULSI Planarization - R. Contolini, S. Mayer (Novellus Systems, Inc.), M. Ziomek-Moroz (Albany Research Center), E. Patton, and E. Broadbent (Novellus Systems, Inc.) PDF
2:30664 Reversible Behaviour of Copper (II) in Presence of Aniline and Pyrrole Electropolymerization - L. Basaez and B.L. Rivas (Universidad de Concepcion) PDF
2:45665 Thermal Oxidation Behavior of Copper Lead-Frame Alloys - G. Brown and K. Kobayashi (Keio University) PDF
3:00 Thirty-Minute Intermission
3:30666 The Effect of Gas-Phase Mass Transport on the Atmospheric Sulfidation of Copper - J. Braithwaite, R. Larson, H. Moffat, W. Breiland, R. Sorensen, and C. Barbour (Sandia National Laboratories) PDF
3:45667 Mechanism of GOI Degradation Caused by Cu Deposits on the Surface of Si Wafer - N. Nakamura, Y. Nakagawa, M. Piao, T. Ebe, and K. Eguchi (MEMC Japan Ltd.) PDF
4:00668 Electrical Resistivity of Electroless and Galvanic Copper Thin Films - E. Meulenkamp (Philips Research Laboratories) and E. Naburgh (Philips Centre for Industrial Technology) PDF
4:15669 Electroless and Electrochemical Deposition of Copper on a H-Terminated Si(111) Surface - S. Ye, T. Ichihara, and K. Uosaki (Hokkaido University) PDF
4:30670 Copper Electroless Deposition on Nonconductive Surfaces - M. Alodan (King Saud University) PDF