Co-Chairs: P.J. Hesketh and A.B. Frazier
| Time | Abs# | Title | View |
|---|---|---|---|
| 8:30 | 1123 | The Microfactory System Using Electrochemical Machining - M. Suda, K. Furuta, T. Sakuhara, and T. Akata (Seiko Insturuments Inc.) | |
| 9:00 | 1124 | Electroplated Nanocrystalline Nickel-Iron Alloys as a New Powerful Material for Microstructured Molding Tools - A. Fath, W. Leskopf, K. Bade, and W. Bacher (Forschungszentrum Karlsruhe) | |
| 9:20 | 1125 | Auto-Catalytic Co(W,P) Deposition in Micro-Tunnels - N. Petrov, N. Kalinichenko, and Y. Shacham-Diamand (Tel-Aviv University) | |
| 9:40 | 1126 | Active Surface Formation by Wet Chemical Pretreatment for Acceleration of Electroless Ni Deposition on Si(100) Wafers - N. Takano, D. Niwa, T. Yamada, and T. Osaka (Waseda University) | |
| 10:10 | Twenty-Minute Intermission | ||
| 10:30 | 1127 | Micro-Hydraulics Employing Non-wetting Fluids - P. Wapner (Air Force Research Laboratory) and W. Hoffman (Air Force Laboratory) | |
| 10:50 | 1128 | Lateral Etch Study of Thin Films using Hydrofluoric Acid Chemistries for MEMS Devices - G. Matamis (Motorola MOS-5), B. Gogoi (Motorola Sensor Products), and C.-C. Wang (University of Michigan) | |
| 11:10 | 1129 | Low Surface Tension Etching Solutions for Silicon Dioxide Removal in Microelectromechanical Systems - M.J. Parent, L. Zazzera, P. Rajtar, and F. Behr (3M) | |
| 11:30 | 1130 | Hybrid Micromachining and Surface Microstructuring of Alumina Ceramic - P. Mardilovich, D. Routkevitch, and A. Govyadinov (Nanomaterials Research Corp.) |
Co-Chairs: H.G. Hughes and D. Misra
| Time | Abs# | Title | View |
|---|---|---|---|
| 2:00 | 1131 | Micro Scale Purification Systems for Biological Sample Preparation - A.B. Frazier, T.L. Edwards (Georgia Institute of Technology), and B.K. Gale (Louisiana Tech University) | |
| 2:30 | 1132 | Challenges and Solutions for Packaging MEMS and Microsystems - J. Neysmith and D.F. Baldwin (Georgia Institute of Technology) | GIF |
| 3:00 | 1133 | Fabrication and Characterization of Plastic Microfluidic Devices Modified with Polyelectrolyte Multilayers - L. Locascio, S. Barker, D. Ross, E. Waddell, M. Tarlov, and M. Gaitan (NIST) | |
| 3:20 | 1134 | Bulk-Etched Integrated Mesoscopic Fluidic Interconnects for Fluidic Microdevices - J. Scalf, D. Liepmann, and A. Pisano (University of California, Berkeley) | |
| 3:40 | Ten-Minute Intermission | ||
| 3:50 | 1135 | Electro-Magnetically Actuated Diverting Valve Using LTCC Tapes - P. Espinoza-Vallejos, J. Santiago-Aviles (University of Pennsylvania), and L. Sola-Laguna (DuPont Electronics Materials) | |
| 4:10 | 1136 | MEMS Magnetic Bi-Stable Valve - D.S. Creyts, IV and P.J. Hesketh (Georgia Institute of Technology) | GIF |
| 4:30 | 1137 | Adhesive Bonding for Wafer Scale Packaging of Fluidic Microsystems - X. Ma, B. Gierhart, S. Collins, and R. Smith (University of California, Davis) |
Co-Chairs: W.E. Bailey and G. Hunter
| Time | Abs# | Title | View |
|---|---|---|---|
| 10:00 | 1138 | Intelligent Micromachines: Keys to the Next Silicon Revolution - P. McWhorter (Sandia National Laboratories) | |
| 10:40 | 1139 | Inertial Sensors: The Drive for Aspect Ratio - P. Bergstrom (Motorola SPS) | |
| 11:10 | 1140 | Residual Stress Effect and Improvement Method on the Performance of Diaphragm-Based Piezoelectric Microphones - M. Niu and E.S. Kim (University of Hawaii) | |
| 11:30 | 1141 | A Post-Processing Method for Suppressing the Residual Mechanical Stree in CMOS' Layers, for MEMS Applications - B. Ghodsian (The Titan Corporation) and V. Milanovic (Univerisity of California, Berkleley) | GIF |
Co-Chairs: B. Hughes and S.S. Ang
| Time | Abs# | Title | View |
|---|---|---|---|
| 2:00 | 1142 | Chemical Microsensors for Aerospace Applications - G. Hunter, P. Neudeck, G. Fralick (Nasa Glenn Research Center), C. Liu, Q. Wu, M. Sawayda, Z. Jin, J. Hammond (Case Western Reserve University), D. Makel (Makel Engineering), W. Rauch, M. Liu (Georgia Institute of Technology), and G. Hall (Nasa John F. Kennedy Space Center) | |
| 2:30 | 1143 | A MEMS Based Hybrid Preconcentrator/Chemiresistor Chemical Sensor - R. Hughes, S. Patel, and R. Manginell (Sandia National Labs) | |
| 3:00 | 1144 | Development of a Multichannel Quartz Crystal Microbalance (MQCM) for Simultaneous Multicomponent Analysis - N. Oyama, Y. Ohtomo, O. Hatozaki (Tokyo University of Agriculture & Technology), K. Kitakizaki, Y. Watanabe, and M. Haba (Meidensha Corporation) | |
| 3:30 | Ten-Minute Intermission | ||
| 3:40 | 1145 | Micro-Hotplate, an Useful Concept for Gas Sensing, Fluidics and Space Applications - D. Briand, O. Guenat, B. van der Schoot, T. Hirata (University of Neuchatel), and N.F. de Rooij (Sumitomo Heavy Industries, Ltd.) | |
| 4:00 | 1146 | Development of Electrochemical Sensors Based on Microelectrode Arrays for Environmental Monitoring - C. Madore (CSEM) | |
| 4:20 | 1147 | MicroSystems Development - S. Collins and R. Smith (University of California, Davis) | |
| 4:40 | 1148 | FET Based pH and Nitrate Checkers for Acid-Rain Monitoring - S.-I. Wakida, M. Yamane, S. Takeda, Z. Siroma, Y. Tsujimura (Osaka National Research Institute), and J. Liu (Beijing University of Aeronautics and Astronautics) |
Co-Chairs: G. Maracas and P. Bergstrom
| Time | Abs# | Title | View |
|---|---|---|---|
| 9:00 | 1149 | Template-Prepared Bio/Nano Tubules for Chemical Separations and Analysis - C. Martin, S.B. Lee, M. Kang, E. Steinle (University of Florida), and B. Lakshmi (3M Company) | |
| 9:20 | 1150 | Microfabricated PMMA Structure for DNA Preconcentration and Electrophoresis - Y.-C. Lin, C.-K. Tseng, and S.-Q. Hou (National Cheng Kung University) | |
| 9:40 | 1151 | Immobilization of DNA Copolymers on Microhotplates for DNA Melting and Hybridization Reactions - T.H. Huang, R. Cavicchi, S. Barker, and M.J. Tarlov (National Institute of Standards and Technology) | |
| 10:00 | Twenty-Minute Intermission | ||
| 10:20 | 1152 | Increased Pseudoinductance in Paired Mixtures of Biopolymers is a Model for Twin Wire Mutual Inductance in RNA and DNA - M. Garnett and J.L. Remo (Garnett McKeen Laboratory, Inc.) | GIF |
| 10:40 | 1153 | Selective Deposition of Octasubstituted Phthalocyanine Materials Based on Hydrophobic/Hydrophilic Surface Interactions - R. Zangmeister and N. Armstrong (University of Arizona) | |
| 11:00 | 1154 | The Effects of Electron Bombardment on Organic Monolayers Adsorbed on Si(111) - T. Yamada, N. Takano, K. Yamada, S. Yoshitomi, T. Inoue, and T. Osaka (Waseda University) |
Co-Chairs: H. Denton and H.G. Hughes
| Time | Abs# | Title | View |
|---|---|---|---|
| 2:00 | 1155 | Evaluation of Organic Monolayers Formed on Si(111) Towards Nanometer Scale Fabrication - N. Takano, K. Yamada, S. Yoshitomi, T. Inoue, T. Yamada, and T. Osaka (Waseda University) | |
| 2:20 | 1156 | Nanomechanical Detection of Biomolecular Interactions - K. Hansen (Oak Ridge National Laboratory), G. Wu (University of California, Berkeley), H.-F. Ji, T. Thundat (Oak Ridge National Laboratory), R. Datar, R. Cote (University of Southern California), and A. Majumdar (University of California, Berkeley) | |
| 2:40 | 1157 | Ultra-Sensative Resonant Frequency Based Mass Detector - B. Ilic, D. Czaplewski, G. Craighead, C. Campagnolo, C. Batt (Cornell University), and P. Neuzil (Institute of Microelectronics) | GIF |
| 3:00 | 1158 | Developing A u-Fabrication Course: A Study in Multidisciplinary MEMS Curriculum Development - R.S. Evans and P.J. Hesketh (Georgia Institute of Technology) | GIF |
| 3:20 | Ten-Minute Intermission | ||
| 3:40 | 1159 | Microstructures for Monitoring Wafer Uniformity of Reactive Ion Etching - R. Leung, D. Howard, S. Collins, and R. Smith (University of California, Davis) | |
| 4:00 | 1160 | Water Dispersible Silanes for Wettability Modification of Polysilicon - A.M. Almanza-Workman, S. Raghavan, P. Deymier (University of Arizona), D. Monk, and R. Roop (Motorola Inc.) | |
| 4:20 | 1161 | Correlation of Metal Film Grain Size to Optical Measurement Results - T. Robinson (KLA-Tencor Corporation) and J. Sledziewski (Analog Devices Incorporated) | |
| 4:40 | 1162 | Measurement of MEMs Cantilever Curvature Using Spectroscopic Optical Techniques - T. Robinson (KLA-Tencor Corporation) and J. Sledziewski (Analog Devices Incorporated) |