Co-Chairs: P.T. Brown and P. Gadgil
| Time | Abs# | Title | View |
|---|---|---|---|
| 1:40 | 200 | Orthogonal Experiment Application in C3F8 Chamber Clean Process - W.-J. Liu (Wei-Jen Liu) | |
| 2:00 | 201 | Comparison of PECVD Chamber Cleaning Processes (Environmental, Productivity, and Economic Considerations) - C. Allgood, M. Mocella, and S. Hsu (DuPont Fluoroproducts) | |
| 2:20 | 202 | Reduced Clean Time and PFC Emissions Reduction through Remote Plasma Clean for Lamp Heated CVD Chambers - L. Mendicino, C. Nauert, P.T. Brown (Motorola), A. Atherton, T. Nowak, D. Silvetti (Applied Materials), C. Hartz, A. Johnson, and P. Maroulis (Air Products and Chemicals) | |
| 2:40 | 203 | The Evaluation of Hexafluorobenzene as an Environmentally Benign Dielectric Etch Chemistry - R. Chatterjee, S. Karecki, R. Reif (MIT Microsystems Technology Laboratories), T. Sparks, V. Vartanian, and B. Goolsby (Motorola DigitalDNA Laboratories) | |
| 3:00 | 204 | Reactor Dependence of NF3/Hydrocarbon Chemistry for Global Warming Emissions Reduction in Dielectric Etching - L. Pruette, S. Karecki, R. Chatterjee, R. Reif (Massachusetts Institute of Technology), D. Cowles (Air Liquide America), and K. Kirmse (Texas Instruments) | |
| 3:20 | Twenty-Minute Intermission | ||
| 3:40 | 205 | Analysis of IPCC PFC Emissions Estimating Methodology - L. Beu, P.T. Brown, and J. Peterson (Motorola) | |
| 4:00 | 206 | Characterization of Implanter Effluent by FTIR and RGA Analysis - B. Goolsby, V. Vartanian, and L. Mendicino (Motorola) | |
| 4:20 | 207 | Characterization of Emissions in Plasma Ashing and Cleaning Applications - S. Banerjee, G. Hills (Gasonics), R. Ridgeway, R. Pearce, and T. Strencosky (Air Products and Chemicals Inc.) | |
| 4:40 | 208 | Characterization and Abatement of Emissions from Advanced CVD Processes - L. Mendicino, V. Vartanian, B. Goolsby, K. Reid, and P.T. Brown (Motorola) | |
| 5:00 | 209 | Fate of Fluorine Determination in Exhaust from NF3-Based CVD Chamber Cleans - V. Vartanian, L. Mendicino, B. Goolsby, P.T. Brown, and D. Babbitt (Motorola) |
Co-Chairs: L. Mendicino and L. Simpson
| Time | Abs# | Title | View |
|---|---|---|---|
| 10:00 | 210 | Spin Etch Planarization of Larger Copper Damascene Structures - D. DeBear (SEZ America, Inc.) and J. Levert (Honeywell Electronic Materials) | |
| 10:20 | 211 | RCA Clean Optimization - J. Molloy, B. Raley, and B. Taylor-Burton (Motorola Digital DNA Laboratories) | |
| 10:40 | 212 | Novel Wafer Cleaning Technologies Survey - S. Pawsat (International SEMATECH) | |
| 11:00 | 213 | ESH Aspects of Photo-resist Stripping with Ozonated Ultrapure Water - W. Worth and S. Burnett (International SEMATECH) | |
| 11:20 | 214 | Reducing Environmental Impact With Ozone Based Processes - S. Nelson (FSI International, Inc.) | |
| 11:40 | 215 | Cryogenic CO2 Cleaning Process Analysis in the Semiconductor Industry - K. Barbee and J.J. Lee (Motorola, Inc. Semiconductor Products Sector) |
Co-Chairs: L. Simpson and L. Mendicino
| Time | Abs# | Title | View |
|---|---|---|---|
| 2:00 | 216 | Creating Win-Win: Leveraging Insight Into Industrial Environmental Decision-Making - D. Bauer (EPA ORD NCER), N. Krishnan (UC Berkeley), and T. Francis (Applied Materials) | |
| 2:20 | 217 | Infrastructure Aging Issues in 200 mm Wafer Fabs - P.T. Brown, C. Nauert, J. Heironimus, and R. Reblin (Motorola) | |
| 2:40 | 218 | Safe Fluorine Gas Source for Semiconductor Materials Processing - J. Arno and E. Sturm (ATMI Inc.) | |
| 3:00 | 219 | Current Issues with Monitoring Arsine in the Semiconductor Industry - W.K. Barbee (Motorola - Semiconductor Products Sector, Austin, TX) | |
| 3:20 | Twenty-Minute Intermission | ||
| 3:40 | 220 | Methods and Apparatus for Reducing Waste Effluent from Chemical Mechanical Planarization (CMP) Processes - G. Olsen and M. Weldon (Speedfam-IPEC Corporation) | |
| 4:00 | 221 | Reduction of Waste Generation and Extension of Bath Life in Copper Electroplating Systems - J. Clark, O. Blachier, and J. Dickinson (BOC Edwards) | |
| 4:20 | 222 | Recycling of Solvents in Used Photoresist Strippers - D. Follweiler and D. Peters (Ashland-ACT) | |
| 4:40 | 223 | Management of W-CVD Effluent - Y. Gu, K. Grout (Vacuum Product Group, MKS Instruments, Inc.), and S. Haupt (IBM Corp.) |