199th Meeting - Washington, DC

March 25-30, 2001


H2 - Fourth International Symposium on Environmental Issues with Materials and Processes for the Electronics and Semiconductor Industries

Dielectric Science and Technology Division/ Electronics Division

Tuesday, March 27, 2001

Room 4, Meeting Room Level

Co-Chairs: P.T. Brown and P. Gadgil

1:40200 Orthogonal Experiment Application in C3F8 Chamber Clean Process - W.-J. Liu (Wei-Jen Liu) PDF
2:00201 Comparison of PECVD Chamber Cleaning Processes (Environmental, Productivity, and Economic Considerations) - C. Allgood, M. Mocella, and S. Hsu (DuPont Fluoroproducts) PDF
2:20202 Reduced Clean Time and PFC Emissions Reduction through Remote Plasma Clean for Lamp Heated CVD Chambers - L. Mendicino, C. Nauert, P.T. Brown (Motorola), A. Atherton, T. Nowak, D. Silvetti (Applied Materials), C. Hartz, A. Johnson, and P. Maroulis (Air Products and Chemicals) PDF
2:40203 The Evaluation of Hexafluorobenzene as an Environmentally Benign Dielectric Etch Chemistry - R. Chatterjee, S. Karecki, R. Reif (MIT Microsystems Technology Laboratories), T. Sparks, V. Vartanian, and B. Goolsby (Motorola DigitalDNA Laboratories) PDF
3:00204 Reactor Dependence of NF3/Hydrocarbon Chemistry for Global Warming Emissions Reduction in Dielectric Etching - L. Pruette, S. Karecki, R. Chatterjee, R. Reif (Massachusetts Institute of Technology), D. Cowles (Air Liquide America), and K. Kirmse (Texas Instruments) PDF
3:20 Twenty-Minute Intermission
3:40205 Analysis of IPCC PFC Emissions Estimating Methodology - L. Beu, P.T. Brown, and J. Peterson (Motorola) PDF
4:00206 Characterization of Implanter Effluent by FTIR and RGA Analysis - B. Goolsby, V. Vartanian, and L. Mendicino (Motorola) PDF
4:20207 Characterization of Emissions in Plasma Ashing and Cleaning Applications - S. Banerjee, G. Hills (Gasonics), R. Ridgeway, R. Pearce, and T. Strencosky (Air Products and Chemicals Inc.) PDF
4:40208 Characterization and Abatement of Emissions from Advanced CVD Processes - L. Mendicino, V. Vartanian, B. Goolsby, K. Reid, and P.T. Brown (Motorola) PDF
5:00209 Fate of Fluorine Determination in Exhaust from NF3-Based CVD Chamber Cleans - V. Vartanian, L. Mendicino, B. Goolsby, P.T. Brown, and D. Babbitt (Motorola) PDF

Wednesday, March 28, 2001

Co-Chairs: L. Mendicino and L. Simpson

10:00210 Spin Etch Planarization of Larger Copper Damascene Structures - D. DeBear (SEZ America, Inc.) and J. Levert (Honeywell Electronic Materials) PDF
10:20211 RCA Clean Optimization - J. Molloy, B. Raley, and B. Taylor-Burton (Motorola Digital DNA Laboratories) PDF
10:40212 Novel Wafer Cleaning Technologies Survey - S. Pawsat (International SEMATECH) PDF
11:00213 ESH Aspects of Photo-resist Stripping with Ozonated Ultrapure Water - W. Worth and S. Burnett (International SEMATECH) PDF
11:20214 Reducing Environmental Impact With Ozone Based Processes - S. Nelson (FSI International, Inc.) PDF
11:40215 Cryogenic CO2 Cleaning Process Analysis in the Semiconductor Industry - K. Barbee and J.J. Lee (Motorola, Inc. Semiconductor Products Sector) PDF

Co-Chairs: L. Simpson and L. Mendicino

2:00216 Creating Win-Win: Leveraging Insight Into Industrial Environmental Decision-Making - D. Bauer (EPA ORD NCER), N. Krishnan (UC Berkeley), and T. Francis (Applied Materials) PDF
2:20217 Infrastructure Aging Issues in 200 mm Wafer Fabs - P.T. Brown, C. Nauert, J. Heironimus, and R. Reblin (Motorola) PDF
2:40218 Safe Fluorine Gas Source for Semiconductor Materials Processing - J. Arno and E. Sturm (ATMI Inc.) PDF
3:00219 Current Issues with Monitoring Arsine in the Semiconductor Industry - W.K. Barbee (Motorola - Semiconductor Products Sector, Austin, TX) PDF
3:20 Twenty-Minute Intermission
3:40220 Methods and Apparatus for Reducing Waste Effluent from Chemical Mechanical Planarization (CMP) Processes - G. Olsen and M. Weldon (Speedfam-IPEC Corporation) PDF
4:00221 Reduction of Waste Generation and Extension of Bath Life in Copper Electroplating Systems - J. Clark, O. Blachier, and J. Dickinson (BOC Edwards) PDF
4:20222 Recycling of Solvents in Used Photoresist Strippers - D. Follweiler and D. Peters (Ashland-ACT) PDF
4:40223 Management of W-CVD Effluent - Y. Gu, K. Grout (Vacuum Product Group, MKS Instruments, Inc.), and S. Haupt (IBM Corp.) PDF