199th Meeting - Washington, DC

March 25-30, 2001

PROGRAM INFORMATION

J1 - Morphological Evolution in Electrodeposition

Electrodeposition Division

Monday, March 26, 2001

Room 3, Meeting Room Level

Fundamentals

Co-Chairs: D.P. Barkey and J.B. Talbot

TimeAbs#TitleView
10:00 Opening Remarks by K. Kondo
10:05276 The Effect of Additives on Morphology Evolution During Electrodeposition - R. Alkire (University of Illinois) PDF
10:45277 The Role of Viscosity on Ion Transport in Thin-layer Electrodeposition - G. Gonzalez, G. Marshall (UBA), F. Molina (INQUIMAE), S. Dengra, and H. Sanchez (UBA) PDF
11:00278 Dynamical Analysis of Dense Morphologies in Thin Cell Electrodeposition - F. Argoul, C. Leger, and J. Elezgaray (Centre de Recherche Pascal) PDF
11:15279 Morphology Evolution in the Formation of CdTe using Electrochemical Atomic Layer Epitaxy (EC-ALE) - K. Varazo, M. Lay, T. Sorenson, U. Happek, and J. Stickney (University of Georgia) PDF
11:30280 Feedback Control of Morphology Evolution in Metal Electrodeposition by Optical Means - B. Bozzini, L. Corradini, and C. Lenardi (Universita' di Lecce) PDF

Shape Evolution

Co-Chairs: K. Kondo and F. Argoul

TimeAbs#TitleView
2:00281 Morphology Evolution in Bumping - K. Kondo, E. Munehiro, and T. Matsumoto (Unversity of Okayama) PDF
2:15282 Localized Electrochemical Deposition of Copper Microstructures (I): Modeling of Structure Formation - R. Said and M. Hussein (United Arab Emirates University) PDF
2:30283 Localized Electrochemical Deposition of Copper Microstructures (II): Artifacts of Electrode-Tip Geometry - R. Said (United Arab Emirates University) PDF
2:45284 Localized Electrochemical Deposition of Copper Microstructures (III): Factors Influencing Shape Formation - R. Said (United Arab Emirates University) PDF
3:00285 The Effect of Current Waveform on The Surface Morphology and Texture of Copper Electrodeposits for ULSI - H.-J. Lee, D.N. Lee (Seoul National University), and Y.J. Jeon (Cosam Inc.) PDF
3:15286 Effect Of Additives On Copper Electroplating In Damascene Trenches - M. Kang, T.Y.B. Leung (University of Illinois at Urbana-Champaign), M. Gross (Bell Laboratories, Lucent Technologies), and A. Gewirth (University of Illinois at Urbana-Champaign) PDF
3:30 Fifteen-Minute Intermission

Crystal Habits and Dendrites

Co-Chairs: J.C. Bradley and T. Watanabe

TimeAbs#TitleView
3:45287 Dendritic Growth of Electrodeposited Copper and Tin in Well Supported Solution - D. Barkey (University of New Hampshire) PDF
4:00288 Epitaxial Growth to Thin Films Formation of Cu2O by Electrodeposition - J. Lee, U. Janakiraman (Fritz-Haber-Institut der Max-Planck-Gesellschaft), T.-G. Noh, and Y. Tak (Inha University) PDF
4:15289 Fabrication of Uniform Magnetic Nanoparticles in Ordered Aluminum Oxide Templates - M. Sun, G. Zangari, and R. Metzger (The University of Alabama) PDF
4:30290 In Situ Simultaneous Electrochemical and Optical Measurements for Characterization of CaCO3 Electrodeposit - H. Cachet, O. Devos, G. Folcher, C. Gabrielli, H. Perrot, and B. Tribollet (Univ. P. et M. Curie) PDF
4:45291 Effects of Organic Additives on Morphological Evolution of Electrodeposited Au and Au Alloys - B. Bozzini (INFM), P.L. Cavallotti (Politecnico di Milano), and G. Giovannelli (Universita' di Roma I) PDF
5:00292 Electroless Formation of Gold Deposits under Organized Monolayers - S. Ravaine, R. Saliba, C. Mingotaud, and F. Argoul (Centre de Recherche Paul Pascal - C.N.R.S.) PDF
5:15293 Spatially Coupled Bipolar Electrodeposition in Thin-Layer Cells under Periodic Voltage Control - V. D'Angelo, G. Marshall (UBA), J.-C. Bradley (Drexel University), F.V. Molina (INQUIMAE), G. Gonzalez, C. Iemmi (UBA), and S. Babu (Drexel University) PDF
5:30294 Morphology of Electrodeposited Palladium on Graphite Powder under Pulsed Bipolar Conditions - J.-C. Bradley, S. Babu, A. Mittal, P. Ndungu, B. Carroll, and B. Samuel (Drexel University) PDF
5:45295 Formation of Nanostructured Copper Filaments in Electrochemical Deposition - M. Wang, S. Zhong, X.-B. Yin, J.-M. Zhu, R.-W. Peng, Y. Wang, and N.-B. Ming (Nanjing University) PDF

Tuesday, March 27, 2001

Morphology

Co-Chairs: F. Argoul and J. Said

TimeAbs#TitleView
9:30296 Proposal for a New Theory of Structure Control of Electrodeposited Films - T. Watanabe (Tokyo Metropolitan University) PDF
10:00297 Microstructural Study of Gradient Copper- Alumina Films Electrocodeposited Using a Rotating Cylinder Electrode - D. Wang and J. Talbot (University of California, San Diego) PDF
10:15298 Morphology of CdTe Electrodeposited from Ammoniacal Basic Aqueous Solutions - K. Murase, T. Hirato, and Y. Awakura (Kyoto University) PDF
10:30 Fifteen-Minute Intermission
10:45299 Effects for Process Conditions on Film Properties of Electrochemically Deposited Sn-Ag-Cu Solder Alloys - B. Kim, M. Funk, and T. Ritzdorf (Semitool. Inc,) PDF
11:00300 Structure and Morphology of Manganese Electrodeposits - J. Gong and G. Zangari (University of Alabama) PDF
11:15301 Soft, High Moment Fe-Co-Ni Alloys Electroplated by Pulsed-Current Method - X. Liu and G. Zangari (The University of Alabama) PDF
11:30302 Morphology and the Electrochemical Properties of Electrochemically Synthesized Binary Oxides Systems - Promising Cathode Materials for Lithium Chemical Power Sources - E. Shembel, V. Nagirny, R. Apostolova, P. Lytvyn, A. Kwasha (Ukrainian State Chemical Technology University), and P. Novak (OnPower Battery SRL) PDF
11:45303 Time Effect on FeNi Thin Films Deposited by Electroless Polyol Method - H. Yin and G.M. Chow (National University of Singapore) PDF
12:00 Concluding Remarks by D.P. Barkey