199th Meeting - Washington, DC

March 25-30, 2001


L2 - Molecular Structure of the Solid-Liquid Interface and Its Relationship to Electrodeposition III

Electrodeposition Division/Physical Electrochemistry Division

Monday, March 26, 2001

Room 2, Meeting Room Level

Co-Chairs: D.M. Kolb and R.C. Alkire

10:00 Introductory Remarks by D.M. Kolb
10:05351 The Under Potential Deposition of Antimony on the Low Index Planes of Copper - L. Ward and J. Stickney (University of Georgia) PDF
10:30352 Recent Advances in the Modeling of Underpotential Deposition and Related Phenomena - M.G. Del Popolo, M.C. Gimenez, C. Sanchez, S.A. Dassie, M.I. Rojas, and E.P.M. Leiva (Universidad Nacional de Cordoba) PDF
10:55353 Electrochemical, in-situ STM, and in-situ FTIR Studies of Anomalous Phosphate Adsorption Induced on Zn UPD at Au Electrodes in the Presence of Halides - A. Aramata, S. Takahashi, M. Nakamura, and T. Habu (Hokkaido University) PDF
11:15354 The Initial Stages of Pt Deposition on Au(hkl) - H.-F. Waibel, M. Kleinert, and D.M. Kolb (University of Ulm) PDF
11:35355 Nanostructuring of Cu Overlayers on Pt Single Crystal Electrodes - X. Xiao, P. Berenz, and H. Baltruschat (University of Bonn) PDF

Co-Chairs: R.C. Alkire and H. Meyer

2:00356 PHYSICAL ELECTROCHEMISTRY DIVISION D.C. GRAHAME AWARD ADDDESS- In Situ Spectroscopy: From Highly Controlled Interfaces to Actual Operating Devices - D.A. Scherson (Case Western Reserve University) PDF
3:00 Ten-Minute Intermission
3:10357 Role of Surface States in Pb Electrodeposition on n-Ge - C. Ehlers, G. Staikov, and J.W. Schultze (Heinrich-Heine-Universitat Dusseldorf) PDF
3:40358 Interaction of Water and Other Solvents with Bare and Cation-Modified Gold Surfaces - A. Gewirth, R. Yamada, T.Y.B. Leung, N. Ikemiya, and S. Si (University of Illinois at Urbana-Champaign) PDF
4:10359 Sum Frequency Generation Study on Molecular Structure of Solid Surfaces Modified with Organic Molecular Layers in Electrolyte Solutions - K. Uosaki, S. Ye, S. Nihonyanagi, D. Miyamoto, and K. Fujishima (Hokkaido University) PDF
4:35360 Self-Assembly of Benzenethiol on Au(111) and Au(322): A Comparative Study of Vacuum and Liquid Phase Adsorption - C. Barnes (Dublin City University) PDF

Tuesday, March 27, 2001

Co-Chairs: G. Staikov and D.M. Kolb

8:30361 New Probes of the Electrochemical Interface: "Atomic" EXAFS and Fano Resonances in X-ray Absorption Spectroscopy - W. O'Grady (Naval Research Laboratory) and D. Ramaker (George Washington University) PDF
8:55362 X-ray In-Situ Studies of Semiconductor/Electrolyte Interfaces - J. Zegenhagen (European Synchrotron Radiation Facility) PDF
9:20363 The Application of the Quartz Microbalance for the Investigation of Primary Processes of Electrodeposition - A. Bund and W. Plieth (Technische Universitaet Dresden) PDF
9:45364 Dynamics of Metastable Nanoscale Island Growth and Dissolution at Electrochemical Interfaces by Time-Resolved STM - Y. He and E. Borguet (University of Pittsburgh) PDF
10:05 Ten-Minute Intermission
10:15365 Phase Field Modeling of Electrodeposition - J.E. Guyer, W.J. Boettinger, and J.A. Warren (National Institute of Standards and Technology) PDF
10:35366 Impedance Spectroscopy of Copper Films Deposited Electrochemically on 5MHz Quartz Oscillators - T. Kussner, M. Wunsche, and R. Schumacher (Atotech Deutschland GmbH) PDF
10:55367 Electrochemistry in the Presence of Convective Flow Generated by Acoustic Streaming from a Focudrd Ultrasonic Source - I. Stefan, Y. Mo (Case Western Reserve University), C. Zanelli (Intec Research Corporation), and D. Scherson (Case Western Reserve University) PDF
11:20368 Au Nanoparticle Nucleation and Growth on Si(111) - I. Suni, R. Srinivasan, and Y. Tian (Clarkson University) PDF
11:40369 Electrodeposition of Metal Nanowires - M. Zach, H. Liu, and R. Penner (University of California) PDF

Co-Chairs: W. Plieth and I. Suni

2:00370 Galvanostatic Pulse Plating of Cu-Al Alloy from the Lewis Acidic Aluminum Chloride-1-Ethyl-3-methylimidazolium Chloride Melt - C. Hussey and Q. Zhu (The University of Mississippi) PDF
2:25371 In situ EC-STM studies at the interface electrode/electrolyte in molten salts - F. Endres (University of Karlsruhe) PDF
2:50372 Dependence of Sub-micron Integrated Circuit Feature Superfilling on Cu Electrolyte and Additive Properties - J. Reid (Novellus Systems) PDF
3:15 Fifteen-Minute Intermission
3:30373 Surface Microstructure and the Growth Form of Electrodeposited Copper - D. Barkey (University of New Hampshire) PDF
4:00374 Superconformal Electrodeposition of Copper in 500-90 nm Features - T. Moffat, J. Bonevich, W. Huber (NIST), A. Stanishevsky (University of Maryland), D. Kelly, G. Stafford, and D. Josell (NIST) PDF
4:30375 Effect of Some Organic Additives on the Copper Deposition onto Au(111) - M. Petri, D.M. Kolb (University of Ulm), and H. Meyer (Atotech Deutschland GmbH) PDF