2001 Joint International Meeting - the 200th Meeting of The Electrochemical Society, Inc. and the 52nd Annual Meeting of the International Society of Electrochemistry - San Francisco, California

September 2-7, 2001


E1 - Electrochemical Deposition and Dissolution

ECS Cosponsors - Electrodeposition/Industrial Electrolysis and Electrochemical Engineering; ISE Cosponsors - Corrosion, Electrodeposition and Surface Treatment

Monday, September 3, 2001

Yosemite Room B, Ballroom Level

Co-Chairs: D. Landolt and L.T. Romankiw

10:45642 Microscopic Studies of Molecular Adsorption on Silid Metal Electrode Surfaces - A.J. Arvia (Universidad Nacional de La Pata) PDF
11:30643 Electrochemical Preparation of Semiconducting and Magnetic Metal Oxide Films - M. Izaki (Osaka Municipal Technical Research Institute) PDF

Co-Chairs: J.W. Schultze and M. Izaki

2:00644 Influence of Additives on the Electrodeposition of Copper - R. Chandrasekaran, B. Jayaraman, M. S., and R. N.G. (Central ElectroChemical Research Institute) PDF
2:15645 Influence of Organic Additives on the Electrodeposition of Cu/Co Multilayers - E. Chassaing (CNRS) PDF
2:30646 Comparative Study of Organic Acids as Complexing Agents in Copper Electrodeposition - S. Brouard, S. Rode, and M. Matlosz (ENSIC-Nancy) PDF
2:45647 Influence of 3-N,N-Dimethyldithiocarbamoyl-1-Propanesulfonic Acid on the Kinetics and Morphology During Copper Deposition - I. Tabakovic, S. Riemer, E. Rydholm, J. Rice, and J. Ness (Seagate Technology) PDF
3:00648 Electrode Response During Low and High Frequency Pulse Plating of Copper at a Rotating Disc Electrode - N. Tantavichet and M. Pritzker (University of Waterloo) PDF
3:15649 Corrosion of Copper in Acid-Sulfate Plating Baths - D. Barkey and D. Hua (University of New Hampshire) PDF
3:30650 Nanoscale Deposition of Electroless Alloy Films to Prevent Cu Diffusion and Migration - C.J. Sambucetti (IBM T.J.Watson Research Center) PDF
3:45 Fifteen-Minute Intermission
4:00651 Equilibrium and Non–equilibrium Structures in Electrodeposited Cu–Sn Aloys - M. Bestetti, A. Vicenzo, and P.L. Cavallotti (Politecnico di Milano) PDF
4:15652 Effect of Additives on the Diffusion Co-efficient of Nickel Electrodeposition - S. Renganathan, V. Seshachalam, M. S., and R. Gopalan (Central ElectroChemical Research Institute) PDF
4:30653 Electrodeposition of Ni-P: Evolution of Morphology, Microstructure and Composition of Deposits - A. Kurowski, G. Staikov, and J.W. Schultze (Heinrich-Heine-Universitaet Duesseldorf) PDF
4:45654 Pulse Plating of Ni-Mo Alloys from a Citrate Bath - A. Marlot and D. Landolt (Ecole Polytechnique Federale de Lausanne) PDF
5:00655 Electrodeposited Ni-Mo Cathodes for Hydrogen Evolution - S. Meguro, T. Sasaki (Tohoku Institute of Technology), K. Asami (Tohoku University), T. Sakaki (Tosoh Co.), and K. Hashimoto (Tohoku Institute of Technology) PDF
5:15656 Electrochemical Deposition of Two Ni-M Alloys - W. Liu (Shanghai University) PDF
5:30657 Effects of Deposition Variables on the Morphologies and Composition of Nickel-Cobalt Deposits Prepared by Cyclic Voltammetry - A. Bai and C.-C. Hu (National Chung Cheng University) PDF
5:45658 Effect of Solution Constituents on ElectrolessDdeposition of Ni-based Alloys - G. Lu and G. Zangari (The University of Alabama) PDF

Tuesday, September 4, 2001

Co-Chairs: W. Plieth and T. Osaka

8:30659 Study of Nano Nickel Plating using Pulse Technic - M. Byungseung, C. Wonsub (Pusan National University), K. Ingon (Dongeui University), and J. Seunghoon (Pusan National University) PDF
8:45660 Fabrication of Ionic Polymer Metal Composites by Electroless Plating of Pt - J. Pak, S.-E. Cha, H.-J. Ahn (Korea University), and S.-K. Lee (Dankook University) PDF
9:00661 Structure and Properties of Electrodeposited Ag-Sn Alloys - A. Vicenzo, M. Bestetti, F. Pirovano, and P.L. Cavallotti (Politecnico di Milano) PDF
9:15662 Substrate(Ni)-Catalyzed Electroless Gold Deposition from a Non-Cyanide Bath Containing Thiosulfate and Sulfite - M. Kato (Kanto Chemical Corporation), J. Sato, H. Otani, T. Homma, Y. Okinaka, T. Osaka (Waseda University), and O. Yoshioka (Hitachi Cable Corporation) PDF
9:30663 Structure and Properties of ACD Ni-P/Immersion Gold Finish for Lead-free Solder Joints - P.L. Cavallotti (Politecnico di Milano), A. Genovese, L. Lombardi (Celestica Italia), L. Magagnin (Politecnico di Milano), and V. Sirtori (Celestica Italia) PDF
9:45664 Magnetic Properties of High Bs CoNiFeB Soft Magnetic Thin Films Prepared by Electroless Deposition - T. Yokoshima, M. Sobue, D. Kaneko, T. Osaka (Waseda University), S. Takefusa, and A. Tanaka (Fujitsu Laboratory Ltd.) PDF
10:00 Forty-Five Minute Intermission
10:45665 Effect of Electrolyte Composition on Magnetic Properties and Structure of Electrodeposited Co-Fe-Ni Alloys - X. Liu and G. Zangari (The University of Alabama) PDF
11:00666 Electrodeposition of Hard Magnetic Layers of CoPtW - M. Bestetti (Politecnico di Milano), P.L. Cavallotti (Politecnico di MilanoDipartimento di Chimica), S. Franz, L. Gobbato (Politecnico di Milano), J.M. Machado da Silva, and M.A. Sa (Universidade do Porto) PDF
11:15667 Magnetic Proerties of Nanostructured CoNiP Electrodeposits - D.-Y. Park, N.V. Myung, M. Schwartz, and K. Nobe (University of California-Los Angeles) PDF
11:30668 Unusual Stability of Electrodeposited Magnetic Nanostructures - P. Hugelmann and W. Schindler (University of Karlsruhe) PDF
11:45669 The Effect of Substrate Orientation on the Magnetic Properties of Electrodeposited Thin Films Grown on N-GaAs - P. Evans, C. Scheck, R. Schad, and G. Zangari (University of Alabama) PDF

Co-Chairs: L.T. Romankiw and S. Roy

2:00670 Kinetics and Mechanism of Alloy Deposition; Special Consideration of Formation of Intermetallic Compounds - W. Plieth (Technische Universitaet Dresden) PDF
2:30671 Kinetic Analysis of Electrochemical Copper Deposition in Etched Ion Track Membranes - I.U. Schuchert, D. Dobrev (Gesellschaft fur Schwerionenforschung), M. Martin (RTWH Aachen), M.E. Toimil Molares, and J. Vetter (Gesellschaft fur Schwerionenforschung) PDF
2:45672 Kinetic Study of FeCoNi Ternary Alloy Deposition - Y. Zhuang and E. Podlaha (Louisiana State University) PDF
3:00673 A Feasible Strategy for the Collection of Kinetic Data for Complex Electrochemical Systems such as Hard Chromium Plating. - A. Hubin, S. Bare, C. Dan, B. Van Den Bossche, and J. Deconinck (Vrije Universiteit Brussel) PDF
3:15674 Dissolution of Co from Electrodeposited Cu/Co and Cu/Ni-Co Sandwiches - S. Dulal, A. Charles, and S. Roy (University of Newcastle) PDF
3:30675 Anodic Dissolution of Zinc in Organic Solutions of Chlorides - J. Swiatowska-Mrowiecka and J. Banas (University of Mining and Metallurgy) PDF
3:45 Fifteen-Minute Intermission
4:00676 First Observation of Anomalous Scaling in Electrodeposited Films - J. Mallett and W. Schwarzacher (University of Bristol) PDF
4:15677 Electrochemistry of AlCl_3-based Melts in UHV - M. Johnston, J.-J. Lee (Case Western Reserve University), K. Wheeler (Delaware State University.), G. Chottiner, B. Miller, and D. Scherson (Case Western Reserve University) PDF
4:30678 Non-Linear Effects During Electrolytic Deposition of Copper - K. Cooper, Y. Solomentsev, J. Flake (Motorola), and J. Cooper (Advanced Micro Devices) PDF
4:45679 Anomalous Magnetic Behavior in Electrodeposited Chromium Thin Films - L. Feliciano, A. de Oliveira, and E. Pereira (Universidade Federal de Sao Carlos) PDF
5:00680 Nanocrystalline and Amorphous Rare Earth - Iron Group Alloy Electrodeposits - N. Myung, M. Schwartz, and K. Nobe (University California, Los Angeles) PDF
5:15681 Study of Mechanical and Technological Aspects of Metal-Polymer-Soft Metal-Ceramics Coatings - V. Basenuk, M. Kireystev, and A. Federavichus (National Academy of Sciences of Belarus) PDF
5:30682 Investigation of Mechanical Properties of CrC-A1203-A1 Composite Coating and Technological Aspects - V. Basenuk and M. Kireystev (National Academy of Sciences of Belarus) PDF
5:45683 Electrodeposition of Tin Alloys. Effect of Ligands and Surface-Active Substances - A. Survila, Z. Mockus, and S. Kanapeckaite (Institute of Chemistry) PDF

Continental Ballrooms 4,5,6, Ballroom Level

Poster Session

Co-Chairs: D. Landolt and W. Schwarzacher

o684 Effect of Some Cation Impurities on the Electro Refined of Copper at Low Temperatures - A.E. Saba, S.E. Afifi, and A.E. Elsherief (Institute(CMRDI)) PDF
o685 Electrochemical Deposition of Cobalt Onto Single and Polycrystalline Gold Electrodes - L.H. Mendoza-Huizar, J. Robles-Garcia (Universidad de Guanajuato), and M. Palomar-Pardave (Universidad Autonoma Metropolitana Azcapotzalco) PDF
o686 Thermodynamic Characteristics and Mechanism of Copper Monolayer Electrocrystallization from Sulphate Solution - N.P. Yurchenko and V.V. Trofimenko (Dnepropetrovsk National University) PDF
o687 Theory on the Correlation of Localized Corrosion and Macroscopic Oscillatory Behavior at Si Electrodes - J. Grzanna, H.-J. Lewerenz, and H. Jungblut (Hahn-Meitner-Institut Berlin GmbH) PDF
o688 Electroadsorption Characteristics and Orientation Models of Thiophene and 3.Methyl Thiophene on Smooth Platinum Electrode in Acidic Media - I. Becerik (Istanbul Technical University) PDF
o689 Investigation of Dissolution and Deposition of Copper in the Solid Electrolyte RbCu4Cl3I2 - G. Ostapenko (Russian Academy of Sciences) PDF
o690 Electrodeposition of CdTe Semiconductor Thin Films On Single Crytal n-Silicon (100) Substrates - R. Henriquez, G. Riveros, R. Schrebler, H. Gómez (Universidad Católica de Valparaíso), and E.A. Dalchiele (Instituto de Física) PDF
o691 Microgravimetric Studies Of Anion Effects In The Underpotential Deposition Of Copper On Platinum - S.A.S. Machado, D.W. Miwa, M.C. Santos, and L.A. Avaca (Universidade de Sao Paulo) PDF
o692 Electroreduction of Palladium(II) from Glycinate Electrolyte - V. Kublanovsky, V. Nikitenko, and N. Chernenkaya (Institute of General & Inorganic Chemistry) PDF
o693 Transition from an Anomalous to a Normal Electrodeposition Mechanism of Zn-Co Alloys by the Effect of BA - G. Trejo, R. Ortega Borges, Y. Meas (Centro de Investigacion y Desarrrollo Tecnologico en Electroquímica S.C.), E. Chainet, P. Ozil, and B. Nguyen (Ecole Nationale Superiere de electrochimie et Electrometallurgie de Grenoble) PDF
o694 Electrochemical Study of the Formation of Passive Layers on Lead-base Alloys Immersed in an Aqueous Solution with High Sulphate Contents - L. Espinoza-Ramos, J. Hallen-López, C. Ramírez, E. Arce (Instituto Politecnico Nacional-ESIQIE), M. Romero-Romo, and M. Palomar-Pardavé (Universidad Autonoma Metropolitana-Azcapotzalco) PDF
o695 Electrodeposition of Chromium from Chromium(III) Sulphate Solutions - M. Eguchi, Y. Komagine, and Y. Momose (Ibaraki University) PDF
o696 Pd/GaAs Schottky Diodes Fabricated by Electroless Plating - H.-I. Chen, Y.-I. Chou, and C.-K. Hsiung (NCKU) PDF
o697 Electrolessly Deposited CoZnWP Films Having High Coercivity and High Corrosion Resistance - S. Yae, T. Kanki, J. Matsumoto, and H. Matsuda (Himeji Institute of Technology) PDF
o698 Effect of PEG(Polyethylene glycol) on the Anodic Dissolution of Copper in Acid Copper Electrodeposition Baths - K.D. Song and K.B. Kim (Yonsei University) PDF
o699 Mechanisms and Molecular Aspects of Copper Electrodeposition - A.L. Portela, G.I. Lacconi, and M. Lopez Teijelo (Universidad Nacinal de Cordoba) PDF
o700 Nucleation and Growth of Zn, Ni and Zn-Ni Alloys from a Chloride Solution - L. Mascaro (Universidade Federal do Parana) and L. Teixeira (Universidade Federal de Sao Carlos) PDF
o701 Electrochemical Deposition of Copper-Based Nanocrystalline Composite Films - H. Deng and P. Fedkiw (North Carolina State University) PDF
o702 Analysis of Initial Stages of Electrocrystallization and Composition of Fe-Co Deposits - L. Mascaro, F. Bento, and E. Charipova (Universidade Federal do Parana) PDF
o703 Electrochemical Deposition of Organoceramic Materials - I. Zhitomirsky and A. Petric (McMaster University) PDF
o704 Dynamic Scaling in Electroless Cu Deposition - N. Hasan (Universidade de Sao Paulo), J. Mallett, W. Schwarzacher (University of Bristol), and S. Gomes dos Santos Filho (Universidade de Sao Paulo) PDF
o705 Studies of Se Deposition And H_2Se Electrocrystallisation on Pt Ultramicroelectrodes - L.A. Avaca and C. Barin (Universidade de Sao Paulo) PDF
o706 Tip Geometer Artifacts on the Shape of Copper Microstructures Fabricated by Localized Electrochemical Deposition - R. Said (United Arab Emirates University) PDF
o707 Determination of Shape Formation of Electrochemically Deposited Copper Microstructures by Progressive Boundary Update Method - R. Said (United Arab Emirates University) PDF
o708 Relationship Between the Electrochemical Properties and Electronic Structure and Structural Inhomogenity of High-Chromium Alloys - N. Mandich (HBM Electrochemical and Engeneering Corporation) and N. Vyazovikina (NAS of Ukraine) PDF
o709 Passivation of Aluminum and its Alloys by Strong Oxidizers - N. Vyazovikina (NAS of Ukraine) and N. Mandich (HBM Electrochemical and Engeneering Corporation) PDF
o710 Effect of Poly(o-aminophenol) Film on Silver Electrodeposition on Pt Electrode. - N. Hernandez, J.M. Ortega, M. Choy, and R. Ortiz (Universidad de Los Andes) PDF
o711 Large Area Electrodeposition of Scattered Nanowires Microlithographically Interconnected for Electrical Components - M. Lindeberg and K. Hjort (Uppsala University) PDF
o712 Analytical Determination of Small Concentrations of Zn and Cd in the Pb-Cd-Zn Alloy by ALSV Technique - R. Zejnilovic, N. Blagojevic, and V. Kastratovic (University of Montengro) PDF
o713 Nanocrystalline, Fibrous Structure of Electrodeposited Amorphous Alloys of W with Ni, Co and Fe - M. Donten, Z. Stojek (Warsaw University), and H. Cesiulis (Vilnius University) PDF
o714 Effect of Natural Convection on Metal Anodic Dissolution - A. Davydov (A.N.Frumkin Institute of Electrochemistry of Russian Academy of Sciences) PDF
o715 Electrosynthesis of PAni-Powder Using Anodized Aluminum - D. Huerta-Vilca and A. Motheo (Universidade de Sao Paulo) PDF
o716 A New Process for Silicon Field Emitter Arrays Fabrication Using HF Photoelectrochemical Etching - G. Barillaro, F. Pieri, and M. Piotto (Universita di Pisa) PDF
o717 Oxidation of J-ions in Propilencarbonat - V. Komnenic (University of Montenegro), S. Mentus (University of Belgrade), and V. Vojinovic (University of Montenegro) PDF
o718 Oxidation of J-Ions in Aqueous Solutions on Catalyzed and Non-catalyzed Ebonex Electrode - M. Pjescic, I. Draskovic-Boskovic (University of Montenegro), S. Mentus (University of Belgrade), N. Blagojevic (University of Montenegro), and V. Komnenic (Universiti of Montenegro) PDF
o719 Advanced Scanning Probe Instrumentation for Electrochemical Nanotechnology - W. Schindler (University of Karlsruhe) PDF
o720 Theoretical Formalism That Describes (I-t) Curves Where the Presence of Diffusion Limited 3D Nucleation and HER Appear Simultaneously - M. Palomar-Pardave (Universidad Autonoma Metropolitana-Azcapotzalco), B. Scharifker (Universidad Simon Bolivar), E. Arce (Instituto Plotecnico Nacional, ESIQUIE), I. Gonzalez (Universidad Autonoma Metropolitana-Iztapalapa), and M. Romero-Romo (Universidad Autonoma Metropolitana-Azcapotzalco) PDF
o721 Growth Kinetics of Anodic ALuminum Oxide Films Formed in Sulphamic Acid - K. D, V. Raj, M.P. Rajaram, and G. Balasubramanian (Central Electrochemical Research Institute) PDF
o722 A Two-Compartment Vertical Channel Cell for Electrowinning Studies - P.A. Adcock (Australian National University), S.B. Adeloju (University of Western Sydney), L.J. Power, and M. Newman (Pasminco Site Technical Support) PDF
o723 QCM Monitoring of CuCl Formation and Dissolution on Copper Surface - D. Soares (Universidade Estadual de Campinas), S. Wasle, K. Doblhofer (Fritz-Haber-Institut der Max-Planck Gesellschaft), and M. Tenan (Universidade de Mogi das Cruzes)
o724 Study of Bi, Re Adatomes on Polycrystalline Rhodium Electrode in Posphate Medium - M. Choy, J.M. Ortega, and M.I. Duala (Universidad de Los Andes) PDF
o725 Electrochemical Study of the Anodic Dissolution of Copper with Electrochemical Quartz Crystal Microbalance(EQCM) in Alkaline Solution - S. Choi and Y. Tak (Inha University) PDF
o726 The Investigation for the Behaviors of Surfactants Influenced Electroplating Through Polymeric Mask - S.T. Ke, M.D. Ger, Y. Sung, and L.M. Wang (Chung Cheng Institute of Technology) PDF
o727 Fabrication of Titania Nanostructures on Glass by Aluminum Anodizing and Sol-Gel Process - S.-Z. Chu, K. Wada, S. Inoue, and S.-I. Todoroki (National Institute for Materials Science) PDF
o728 Cu and Ag Deposition at Pt Single Crystal Electrodes: Nucleation, Structure and Nanostructuring - X. Xiao, P. Berenz, and H. Baltruschat (University of Bonn) PDF

Wednesday, September 5, 2001

Yosemite Room B, Ballroom Level

Co-Chairs: J.M. Fenton and M. Musiani

8:30729 Nanocomposite Electroplating. Electrochemical Aspects, Structure and Properties. - L. Benea (Dunarea de Jos University of Galati), P.L. Bonora (Trento University), A. Borello (ENEA), F. Wenger, P. Ponthaux, and J. Galland (Ecole Centrale Paris) PDF
8:45730 Electrochemically Formed Films of Quaternary Pyridinium Compounds - J. Wong, V. Birss, and D. Cramb (University of Calgary) PDF
9:00731 Electrochemical Polymerization of Co (II)-4,4',4'', -tetracarboxyphthalocyanine4''' - S. Maranhao, I. Aoki, and I. Guedes (Escola Politecnica da Universidade de Sao Paulo) PDF
9:15732 Electrochemical Control of Whisker Growth on Electrodeposited Tin Coatings - A. Vicenzo, P.L. Cavallotti (Politecnico di Milano), and P. Crema (ST Microelectronics) PDF
9:30733 Formation of Zn Film using Electrochemical Plating - M. Maeda and Y. Nishio (Kanazawa Institute of Technology) PDF
9:45734 The Application of Pulsed Current to Sn-Pb Alloy Deposition onto a Rotating Disc Electrode - Y. Liu and M. Pritzker (University of Waterloo) PDF
10:00 Forty-Five Minute Intermission
10:45735 Structure and Electrochemical Preoperties of Layered Oxide Films Prepared by Electrophoretic Deposition - M. Koinuma, H. Seki, D. Matsuo, H. Nakashima, and Y. Matsumoto (Kumamoto University) PDF
11:00736 Electrodeposition Mechanism of PbSe and PbTe Epitaxial Films on InP Single Crystals - M. Froment, L. Beaunier, H. Cachet (Universite Paris VI), and A. Etcheberry (Universite de Versailles- St. Quentin en Yvelines) PDF
11:15737 Characteristics of Conductivity-improved Polypyrrole Deposited on Roughened Gold Substrate - Y.C. Liu (Van Nung Institute of Technology) and K.C. Chung (National Taiwan University of Science and Technology) PDF
11:30738 Electroplating Tin Oxide on Stainless Steel in Nitric Acid Solution - S.-T. Chang, I.-C. Leu, and M.-H. Hon (Nation Cheng Kung University) PDF
11:45739 Corrosion Behavior of Electroplated Tin/Zinc Deposits - K. Wang, K. Weil, and H. Pickering (The Pennsylvania State University) PDF

Co-Chairs: M. Froment and D. Schwartz

2:00740 Highly Resistive ZnO/Cu Multi-layered Film by Solution Chemical Processes - H. Takahashi and M. Izaki (NEC Toyama, Limited) PDF
2:15741 AFM Induced Nanoscale Electrochemical Deposition of Metals on Si (100) Surfaces. - L. Santinacci (Swiss Federal Institute of Technology Lausanne), T. Djenizian, and P. Schmuki (University of Erlangen) PDF
2:30742 Steady-state and Impedance Study of Nb Electrodissolution in Acid Fluoride Medium - S. Cattarin, M. Musiani (IPELP CNR), and B. Tribollet (CNRS UPR15 "Physique des Liquides et Electrochimie") PDF
2:45743 Electrodeposition of Cu/Ni(Cu) Multilayers from a Citrate Electrolyte in a Flow Cell - W. Meuleman, S. Roy (University of Newcastle), and L. Peter (Hungarian Academy of Sciences) PDF
3:00744 Effectiveness of Pulsed Cu ECD in Void Reduction in Feature Fills - S. Sen, S. Soukane, and T. Cale (Rensselaer Polytechnic Institute) PDF
3:15745 High Throwing Power Nickel Electroplating and its Application - T. Murakami (C. Uyemura & Co., Ltd.), D. Gudeczauskas, D. Liston, and M. Moffatt (Uyemura International Corporation) PDF
3:30746 Development of New Zn-Ni-Cd Coatings from Alkaline Solutions - H. Kim, A. Durairajan, and B.N. Popov (University of South Carolina) PDF
3:45 Fifteen-Minute Intermission
4:00747 Application of Computer-aided Design and Manufacturing Concepts to Electrochemical Fabrication - D. Schwartz, W. Wang, J. Whitaker, S. Green, M. Ganter, and D. Storti (University of Washington) PDF
4:30748 Formation of Complex, Three-Dimensional, Metallic Components Through a Removable-Template Electroplating Technique - C.M. Hagg, U. Schubert, A.H. Whitehead, and M. Schreiber (Funktionswerkstoffe F & E GmbH) PDF
4:45749 The Influence of Convection on the Anodic Oxide Formation of Aluminum Studied and Modeled in a Wall-Jet Electrode Reactor - I. De Graeve, H. Terryn, G. Nelissen (Free University of Brussels), and P. Vankeirsbilck (ElSyCa NV) PDF
5:00750 Electroless Ni-P Plating with Continuously Controlled Constituents - F. Matsui, S. Kawsaki, and H. Inagawa (C. Uyemura & Co., Ltd.) PDF
5:15751 Corrosion of Auxiliary Electrodes in Electrochemical Processes Using AC - L. Binder, S. Mitsche (Graz University of Technology), and D. Lang (Plansee AG) PDF
5:30752 Effect of Mass Transport on Si Electrodissolution in Aqueous Hydrazine - S. Cattarin, M. Musiani (IPELP CNR), and B. Tribollet (CNRS-UPR15) PDF
5:45753 Localized Nucleation and Growth of Pb Clusters on n-Si(111):H Surfaces - M. Hugelmann, P. Hugelmann, W. Wiesbeck, W. Lorenz, F. Kaertner, and W. Schindler (University of Karlsruhe) PDF

Thursday, September 6, 2001

Co-Chairs: G. Evans and D.A. Scherson

8:30754 The Initial Stages of Electrochemical Metal Deposition - D.M. Kolb (University of Ulm) PDF
9:00755 Mechanism of the Electrodeposition of Ag and Ag-Au Alloys on N-Si(111) and Properties of the Deposits - K. Marquez, G. Staikov, and J.W. Schultze (Heinrich-Heine-Universitat Dusseldorf) PDF
9:15756 Deposition Process of Ni on Si(100) Surface in Aqueous Alkaline Solution - D. Niwa, N. Takano, T. Homma, and T. Osaka (Waseda University) PDF
9:30757 Role of Nucleation and Growth Phenomena in Metallization of Micro- and Nanostructures - G. Staikov (Heinrich-Heine-Universitat Dusseldorf) PDF
9:45758 In Situ Iridium LIII- Edge X-Ray Absorption Spectroscopy of Electrodeposited Iridium Oxide Films in Aqueous Electrolytes - Y. Mo, I. Stefan, and D. Scherson (Case Western Reserve University) PDF
10:00 Forty-Five Minute Intermission
10:45759 An In situ Surface X-Ray Diffraction Study on the Electrochemical Deposition of Ni on Au(111) - T. Nouar, C. Lucas, R. Nichols, J. Thornton, D. Johnson, and S. Medway (University of Liverpool) PDF
11:00760 In Situ Electrochemical Quartz Crystal Microbalance Study of the Dissolution of Gold Electrodes in Hydroxamic Acid Solution containing Nitric Ion - S. Shackleford, C. Boxall (University of Central Lancashire), G. Garnham, and R. Taylor (BNFL) PDF
11:15761 A Study on the Inhibition Behavior of Polyethylene Glycol (PEG) in Copper Electrodeposition using EQCM - K.D. Song and K.B. Kim (Yonsei University) PDF
11:30762 In Situ Monitoring of the Electroplating Process and Its Photocahodic Protection from Corrosion of Fe-Cr Alloy by the Use of Quartz Crystal Microbalance - S. Yoshihara, H. Yamato, T. Shirakashi (Utsunomiya University), N. Kudoh, and W. Oikawa (Nippon Platec) PDF
11:45763 Parameter Estimation and Multi-Scale Simulations of Surface Roughness Evolution During Copper Electrodeposition - T. Drews, R. Gunawan, J. Alameda, R. Braatz, and R. Alkire (University of Illinois) PDF

Co-Chairs: R.P Janek and K. Kondo

2:00764 Fundamental Aspects of Electrodeposition- zinc, Bumping and Via Filling - K. Kondo (University of Okayama) PDF
2:30765 Computer Model Prediction of Electrochemical Ni-P Deposition Thickness and Composition in Phosphorous Electrolytes - B. Van den Bossche, G. Nelissen, J. Deconinck (Vrije Universiteit Brussel), M. Roessler, and L. Henneken (Robert Bosch GmbH) PDF
2:45766 Microdefect Decoration in Monocrystalline Silicon: A Theoretical and Experimental Study - M. Kulkarni, J. Libbert, S. Keltner, and L. Mulestagno (MEMC Electronic Materials, Inc.) PDF
3:00767 Simulation of Pulse-Plating in High Aspect Ratio Trenches - D. Veyret and M. Georgiadou (Univ of Provence) PDF
3:15768 Computational Modeling of Electrodeposition in LIGA Microfabrication of MEMS Devices - K. Chen and G. Evans (Sandia National Laboratories) PDF
3:30769 Variation of Film Resistance During Electropaint Deposition - Y.-I. Suzuki, H. Fukui, K. Tsuchiya, S. Arita (C. Uyemura & Co.,Ltd.), and Y. H. Ogata (Kyoto University) PDF
3:45 Fifteen-Minute Intermission
4:00770 Electrodeposition of a Nano-Structured Ni-W Alloy and Charaterization of Electrocatalytic Properties - M. Miaomiao, V.S. Donepudi, J. Prakash (Illinois Institute of Technology), G. Sandi, G. Wiederrecht, and G. Wurtz (Argonne National Laboratory) PDF
4:15771 Characterization and Processing of Electroplated Materials for LIGA Micromachining - R. Janek, T. Buchheit, S. Prasad, and C. Vanecek (Sandia National Laboratories) PDF
4:30772 A New Method for the Evaluation of Electrodeposition Behavior for Electroplating Through Mask - Y. Sung, L.-M. Wang, M.-D. Ger, and S.T. Ke (National Defense University) PDF
4:45773 Through-mask Electrodeposition of Au Alloys - J. Kelly (Sandia National Laboratories) PDF
5:00774 Electron-Beam Induced Carbon Nanomasking for Selective Electrodeposition of Metals on Si(100) - T. Djenizian (University of Erlangen-Nuremberg), L. Santinacci (Swiss Federal Institute of Technology-Laussane), and P. Schmuki (University of Erlangen-Nuremberg) PDF
5:15775 Fabrication and Contacting of Single Wires by Ion Track Etching and Electrochemical Deposition - M.E. Toimil Molares, R. Neumann, I. Schuchert, Z. Siwy, and C. Trautmann (Gesellschaft fuer Schwerionenforschung) PDF
5:30776 Effect of Laser Irradiation Condition on the Fabrication of Microstructure on Aluminum via Anodizing, Laser Irradiation, and Electroplating - T. Kikuchi, M. Sakairi, H. Takahashi (Hokkaido University), Y. Abe, and N. Katayama (Hokkaido Industrial Research Institute) PDF
5:45777 Fabrication of Highly Ordered Structures Using Anodic Porous Alumina - K. Nishio (Tokyo Metropolitan University), M. Nakao, A. Yokoo, T. Tamamura (NTT), and H. Masuda (Tokyo Metropolitan University) PDF

Friday, September 7, 2001

Co-Chairs: T.P. Moffat and G.T. Staikov

8:30778 Superconformal Electrodeposition of Copper - T. Moffat, D. Wheeler, W. Huber, and D. Josell (National Institute of Standards and Technology) PDF
9:00779 Focused Ion Beam Sensitization for Selective Triggering of Electrochemical Dissolution and Deposition on Semiconductor Surfaces - P. Schmuki (University of Erlangen-Nuremberg), L.E. Erickson, and G. Champion (National Research Council of Canada (NRC)) PDF
9:15780 Controling Shape Formation of Copper Microstructures Fabricated by Localized Electrochemical Deposition - R. Said (United Arab Emirates University) PDF
9:30781 Effect of Organic Alcohol Additives on the Shape for Electrodeposited Ni Microprobes - M. Kawaminami, R. Sugimoto, T. Yokoshima (Waseda Univesity), F. Asa (Advanced Reserch Institute for Science and Technology), T. Momma (Kagami Memorial Laboratory for Materials Science and Technology), T. Osaka (Waseda Univesity), and H. Honma (Kanto Gakuin University) PDF
9:45782 Fabrication of Microabsorber Array for X-ray Microcalorimeter by Sn Electrodeposition - H. Sato, E. Goto, H. Kudo, T. Homma, T. Osaka, S. Shoji (Waseda University), T. Oshima, D. Audley, N. Iyomoto, R. Fujimoto, and K. Mitsuda (Institute of Space and Astronautic Science) PDF
10:00 Forty-Five Minute Intermission
10:45783 Titanium Electrochemical Micromachining using Laser Lithography on Oxide Film - P.-F. Chauvy and D. Landolt (Ecole Polytechnique Federale de Lausanne) PDF
11:00784 Metallization and Microstructuring of Insulating Polymers by the PLATO-Technique - T.T. Mai, G. Staikov, and J.W. Schultze (Heinrich-Heine-University of Dusseldorf) PDF
11:15785 The Electrochemical Deposition and Properties of H1-e Nanostructured Films of Palladium - P.N. Bartlett, S. Guerin, J. Marwan, and Y.M. Tan (University of Southampton) PDF
11:30786 Strategies for Etching Microcontact-printed Metal Substrates - M. Geissler, H. Schmid, A. Bietsch, E.J. O'Sullivan, B. Michel, and E. Delamarche (IBM Research) PDF

Copyright 1995 The Electrochemical Society, Inc.