Co-Chairs: D. Landolt and L.T. Romankiw
| Time | Abs# | Title | View |
|---|---|---|---|
| 10:45 | 642 | Microscopic Studies of Molecular Adsorption on Silid Metal Electrode Surfaces - A.J. Arvia (Universidad Nacional de La Pata) | |
| 11:30 | 643 | Electrochemical Preparation of Semiconducting and Magnetic Metal Oxide Films - M. Izaki (Osaka Municipal Technical Research Institute) |
Co-Chairs: J.W. Schultze and M. Izaki
| Time | Abs# | Title | View |
|---|---|---|---|
| 2:00 | 644 | Influence of Additives on the Electrodeposition of Copper - R. Chandrasekaran, B. Jayaraman, M. S., and R. N.G. (Central ElectroChemical Research Institute) | |
| 2:15 | 645 | Influence of Organic Additives on the Electrodeposition of Cu/Co Multilayers - E. Chassaing (CNRS) | |
| 2:30 | 646 | Comparative Study of Organic Acids as Complexing Agents in Copper Electrodeposition - S. Brouard, S. Rode, and M. Matlosz (ENSIC-Nancy) | |
| 2:45 | 647 | Influence of 3-N,N-Dimethyldithiocarbamoyl-1-Propanesulfonic Acid on the Kinetics and Morphology During Copper Deposition - I. Tabakovic, S. Riemer, E. Rydholm, J. Rice, and J. Ness (Seagate Technology) | |
| 3:00 | 648 | Electrode Response During Low and High Frequency Pulse Plating of Copper at a Rotating Disc Electrode - N. Tantavichet and M. Pritzker (University of Waterloo) | |
| 3:15 | 649 | Corrosion of Copper in Acid-Sulfate Plating Baths - D. Barkey and D. Hua (University of New Hampshire) | |
| 3:30 | 650 | Nanoscale Deposition of Electroless Alloy Films to Prevent Cu Diffusion and Migration - C.J. Sambucetti (IBM T.J.Watson Research Center) | |
| 3:45 | Fifteen-Minute Intermission | ||
| 4:00 | 651 | Equilibrium and Non–equilibrium Structures in Electrodeposited Cu–Sn Aloys - M. Bestetti, A. Vicenzo, and P.L. Cavallotti (Politecnico di Milano) | |
| 4:15 | 652 | Effect of Additives on the Diffusion Co-efficient of Nickel Electrodeposition - S. Renganathan, V. Seshachalam, M. S., and R. Gopalan (Central ElectroChemical Research Institute) | |
| 4:30 | 653 | Electrodeposition of Ni-P: Evolution of Morphology, Microstructure and Composition of Deposits - A. Kurowski, G. Staikov, and J.W. Schultze (Heinrich-Heine-Universitaet Duesseldorf) | |
| 4:45 | 654 | Pulse Plating of Ni-Mo Alloys from a Citrate Bath - A. Marlot and D. Landolt (Ecole Polytechnique Federale de Lausanne) | |
| 5:00 | 655 | Electrodeposited Ni-Mo Cathodes for Hydrogen Evolution - S. Meguro, T. Sasaki (Tohoku Institute of Technology), K. Asami (Tohoku University), T. Sakaki (Tosoh Co.), and K. Hashimoto (Tohoku Institute of Technology) | |
| 5:15 | 656 | Electrochemical Deposition of Two Ni-M Alloys - W. Liu (Shanghai University) | |
| 5:30 | 657 | Effects of Deposition Variables on the Morphologies and Composition of Nickel-Cobalt Deposits Prepared by Cyclic Voltammetry - A. Bai and C.-C. Hu (National Chung Cheng University) | |
| 5:45 | 658 | Effect of Solution Constituents on ElectrolessDdeposition of Ni-based Alloys - G. Lu and G. Zangari (The University of Alabama) |
Co-Chairs: W. Plieth and T. Osaka
| Time | Abs# | Title | View |
|---|---|---|---|
| 8:30 | 659 | Study of Nano Nickel Plating using Pulse Technic - M. Byungseung, C. Wonsub (Pusan National University), K. Ingon (Dongeui University), and J. Seunghoon (Pusan National University) | |
| 8:45 | 660 | Fabrication of Ionic Polymer Metal Composites by Electroless Plating of Pt - J. Pak, S.-E. Cha, H.-J. Ahn (Korea University), and S.-K. Lee (Dankook University) | |
| 9:00 | 661 | Structure and Properties of Electrodeposited Ag-Sn Alloys - A. Vicenzo, M. Bestetti, F. Pirovano, and P.L. Cavallotti (Politecnico di Milano) | |
| 9:15 | 662 | Substrate(Ni)-Catalyzed Electroless Gold Deposition from a Non-Cyanide Bath Containing Thiosulfate and Sulfite - M. Kato (Kanto Chemical Corporation), J. Sato, H. Otani, T. Homma, Y. Okinaka, T. Osaka (Waseda University), and O. Yoshioka (Hitachi Cable Corporation) | |
| 9:30 | 663 | Structure and Properties of ACD Ni-P/Immersion Gold Finish for Lead-free Solder Joints - P.L. Cavallotti (Politecnico di Milano), A. Genovese, L. Lombardi (Celestica Italia), L. Magagnin (Politecnico di Milano), and V. Sirtori (Celestica Italia) | |
| 9:45 | 664 | Magnetic Properties of High Bs CoNiFeB Soft Magnetic Thin Films Prepared by Electroless Deposition - T. Yokoshima, M. Sobue, D. Kaneko, T. Osaka (Waseda University), S. Takefusa, and A. Tanaka (Fujitsu Laboratory Ltd.) | |
| 10:00 | Forty-Five Minute Intermission | ||
| 10:45 | 665 | Effect of Electrolyte Composition on Magnetic Properties and Structure of Electrodeposited Co-Fe-Ni Alloys - X. Liu and G. Zangari (The University of Alabama) | |
| 11:00 | 666 | Electrodeposition of Hard Magnetic Layers of CoPtW - M. Bestetti (Politecnico di Milano), P.L. Cavallotti (Politecnico di MilanoDipartimento di Chimica), S. Franz, L. Gobbato (Politecnico di Milano), J.M. Machado da Silva, and M.A. Sa (Universidade do Porto) | |
| 11:15 | 667 | Magnetic Proerties of Nanostructured CoNiP Electrodeposits - D.-Y. Park, N.V. Myung, M. Schwartz, and K. Nobe (University of California-Los Angeles) | |
| 11:30 | 668 | Unusual Stability of Electrodeposited Magnetic Nanostructures - P. Hugelmann and W. Schindler (University of Karlsruhe) | |
| 11:45 | 669 | The Effect of Substrate Orientation on the Magnetic Properties of Electrodeposited Thin Films Grown on N-GaAs - P. Evans, C. Scheck, R. Schad, and G. Zangari (University of Alabama) |
Co-Chairs: L.T. Romankiw and S. Roy
| Time | Abs# | Title | View |
|---|---|---|---|
| 2:00 | 670 | Kinetics and Mechanism of Alloy Deposition; Special Consideration of Formation of Intermetallic Compounds - W. Plieth (Technische Universitaet Dresden) | |
| 2:30 | 671 | Kinetic Analysis of Electrochemical Copper Deposition in Etched Ion Track Membranes - I.U. Schuchert, D. Dobrev (Gesellschaft fur Schwerionenforschung), M. Martin (RTWH Aachen), M.E. Toimil Molares, and J. Vetter (Gesellschaft fur Schwerionenforschung) | |
| 2:45 | 672 | Kinetic Study of FeCoNi Ternary Alloy Deposition - Y. Zhuang and E. Podlaha (Louisiana State University) | |
| 3:00 | 673 | A Feasible Strategy for the Collection of Kinetic Data for Complex Electrochemical Systems such as Hard Chromium Plating. - A. Hubin, S. Bare, C. Dan, B. Van Den Bossche, and J. Deconinck (Vrije Universiteit Brussel) | |
| 3:15 | 674 | Dissolution of Co from Electrodeposited Cu/Co and Cu/Ni-Co Sandwiches - S. Dulal, A. Charles, and S. Roy (University of Newcastle) | |
| 3:30 | 675 | Anodic Dissolution of Zinc in Organic Solutions of Chlorides - J. Swiatowska-Mrowiecka and J. Banas (University of Mining and Metallurgy) | |
| 3:45 | Fifteen-Minute Intermission | ||
| 4:00 | 676 | First Observation of Anomalous Scaling in Electrodeposited Films - J. Mallett and W. Schwarzacher (University of Bristol) | |
| 4:15 | 677 | Electrochemistry of AlCl_3-based Melts in UHV - M. Johnston, J.-J. Lee (Case Western Reserve University), K. Wheeler (Delaware State University.), G. Chottiner, B. Miller, and D. Scherson (Case Western Reserve University) | |
| 4:30 | 678 | Non-Linear Effects During Electrolytic Deposition of Copper - K. Cooper, Y. Solomentsev, J. Flake (Motorola), and J. Cooper (Advanced Micro Devices) | |
| 4:45 | 679 | Anomalous Magnetic Behavior in Electrodeposited Chromium Thin Films - L. Feliciano, A. de Oliveira, and E. Pereira (Universidade Federal de Sao Carlos) | |
| 5:00 | 680 | Nanocrystalline and Amorphous Rare Earth - Iron Group Alloy Electrodeposits - N. Myung, M. Schwartz, and K. Nobe (University California, Los Angeles) | |
| 5:15 | 681 | Study of Mechanical and Technological Aspects of Metal-Polymer-Soft Metal-Ceramics Coatings - V. Basenuk, M. Kireystev, and A. Federavichus (National Academy of Sciences of Belarus) | |
| 5:30 | 682 | Investigation of Mechanical Properties of CrC-A1203-A1 Composite Coating and Technological Aspects - V. Basenuk and M. Kireystev (National Academy of Sciences of Belarus) | |
| 5:45 | 683 | Electrodeposition of Tin Alloys. Effect of Ligands and Surface-Active Substances - A. Survila, Z. Mockus, and S. Kanapeckaite (Institute of Chemistry) |
Co-Chairs: D. Landolt and W. Schwarzacher
| Time | Abs# | Title | View |
|---|---|---|---|
| o | 684 | Effect of Some Cation Impurities on the Electro Refined of Copper at Low Temperatures - A.E. Saba, S.E. Afifi, and A.E. Elsherief (Institute(CMRDI)) | |
| o | 685 | Electrochemical Deposition of Cobalt Onto Single and Polycrystalline Gold Electrodes - L.H. Mendoza-Huizar, J. Robles-Garcia (Universidad de Guanajuato), and M. Palomar-Pardave (Universidad Autonoma Metropolitana Azcapotzalco) | |
| o | 686 | Thermodynamic Characteristics and Mechanism of Copper Monolayer Electrocrystallization from Sulphate Solution - N.P. Yurchenko and V.V. Trofimenko (Dnepropetrovsk National University) | |
| o | 687 | Theory on the Correlation of Localized Corrosion and Macroscopic Oscillatory Behavior at Si Electrodes - J. Grzanna, H.-J. Lewerenz, and H. Jungblut (Hahn-Meitner-Institut Berlin GmbH) | |
| o | 688 | Electroadsorption Characteristics and Orientation Models of Thiophene and 3.Methyl Thiophene on Smooth Platinum Electrode in Acidic Media - I. Becerik (Istanbul Technical University) | |
| o | 689 | Investigation of Dissolution and Deposition of Copper in the Solid Electrolyte RbCu4Cl3I2 - G. Ostapenko (Russian Academy of Sciences) | |
| o | 690 | Electrodeposition of CdTe Semiconductor Thin Films On Single Crytal n-Silicon (100) Substrates - R. Henriquez, G. Riveros, R. Schrebler, H. Gómez (Universidad Católica de Valparaíso), and E.A. Dalchiele (Instituto de Física) | |
| o | 691 | Microgravimetric Studies Of Anion Effects In The Underpotential Deposition Of Copper On Platinum - S.A.S. Machado, D.W. Miwa, M.C. Santos, and L.A. Avaca (Universidade de Sao Paulo) | |
| o | 692 | Electroreduction of Palladium(II) from Glycinate Electrolyte - V. Kublanovsky, V. Nikitenko, and N. Chernenkaya (Institute of General & Inorganic Chemistry) | |
| o | 693 | Transition from an Anomalous to a Normal Electrodeposition Mechanism of Zn-Co Alloys by the Effect of BA - G. Trejo, R. Ortega Borges, Y. Meas (Centro de Investigacion y Desarrrollo Tecnologico en Electroquímica S.C.), E. Chainet, P. Ozil, and B. Nguyen (Ecole Nationale Superiere de electrochimie et Electrometallurgie de Grenoble) | |
| o | 694 | Electrochemical Study of the Formation of Passive Layers on Lead-base Alloys Immersed in an Aqueous Solution with High Sulphate Contents - L. Espinoza-Ramos, J. Hallen-López, C. Ramírez, E. Arce (Instituto Politecnico Nacional-ESIQIE), M. Romero-Romo, and M. Palomar-Pardavé (Universidad Autonoma Metropolitana-Azcapotzalco) | |
| o | 695 | Electrodeposition of Chromium from Chromium(III) Sulphate Solutions - M. Eguchi, Y. Komagine, and Y. Momose (Ibaraki University) | |
| o | 696 | Pd/GaAs Schottky Diodes Fabricated by Electroless Plating - H.-I. Chen, Y.-I. Chou, and C.-K. Hsiung (NCKU) | |
| o | 697 | Electrolessly Deposited CoZnWP Films Having High Coercivity and High Corrosion Resistance - S. Yae, T. Kanki, J. Matsumoto, and H. Matsuda (Himeji Institute of Technology) | |
| o | 698 | Effect of PEG(Polyethylene glycol) on the Anodic Dissolution of Copper in Acid Copper Electrodeposition Baths - K.D. Song and K.B. Kim (Yonsei University) | |
| o | 699 | Mechanisms and Molecular Aspects of Copper Electrodeposition - A.L. Portela, G.I. Lacconi, and M. Lopez Teijelo (Universidad Nacinal de Cordoba) | |
| o | 700 | Nucleation and Growth of Zn, Ni and Zn-Ni Alloys from a Chloride Solution - L. Mascaro (Universidade Federal do Parana) and L. Teixeira (Universidade Federal de Sao Carlos) | |
| o | 701 | Electrochemical Deposition of Copper-Based Nanocrystalline Composite Films - H. Deng and P. Fedkiw (North Carolina State University) | |
| o | 702 | Analysis of Initial Stages of Electrocrystallization and Composition of Fe-Co Deposits - L. Mascaro, F. Bento, and E. Charipova (Universidade Federal do Parana) | |
| o | 703 | Electrochemical Deposition of Organoceramic Materials - I. Zhitomirsky and A. Petric (McMaster University) | |
| o | 704 | Dynamic Scaling in Electroless Cu Deposition - N. Hasan (Universidade de Sao Paulo), J. Mallett, W. Schwarzacher (University of Bristol), and S. Gomes dos Santos Filho (Universidade de Sao Paulo) | |
| o | 705 | Studies of Se Deposition And H_2Se Electrocrystallisation on Pt Ultramicroelectrodes - L.A. Avaca and C. Barin (Universidade de Sao Paulo) | |
| o | 706 | Tip Geometer Artifacts on the Shape of Copper Microstructures Fabricated by Localized Electrochemical Deposition - R. Said (United Arab Emirates University) | |
| o | 707 | Determination of Shape Formation of Electrochemically Deposited Copper Microstructures by Progressive Boundary Update Method - R. Said (United Arab Emirates University) | |
| o | 708 | Relationship Between the Electrochemical Properties and Electronic Structure and Structural Inhomogenity of High-Chromium Alloys - N. Mandich (HBM Electrochemical and Engeneering Corporation) and N. Vyazovikina (NAS of Ukraine) | |
| o | 709 | Passivation of Aluminum and its Alloys by Strong Oxidizers - N. Vyazovikina (NAS of Ukraine) and N. Mandich (HBM Electrochemical and Engeneering Corporation) | |
| o | 710 | Effect of Poly(o-aminophenol) Film on Silver Electrodeposition on Pt Electrode. - N. Hernandez, J.M. Ortega, M. Choy, and R. Ortiz (Universidad de Los Andes) | |
| o | 711 | Large Area Electrodeposition of Scattered Nanowires Microlithographically Interconnected for Electrical Components - M. Lindeberg and K. Hjort (Uppsala University) | |
| o | 712 | Analytical Determination of Small Concentrations of Zn and Cd in the Pb-Cd-Zn Alloy by ALSV Technique - R. Zejnilovic, N. Blagojevic, and V. Kastratovic (University of Montengro) | |
| o | 713 | Nanocrystalline, Fibrous Structure of Electrodeposited Amorphous Alloys of W with Ni, Co and Fe - M. Donten, Z. Stojek (Warsaw University), and H. Cesiulis (Vilnius University) | |
| o | 714 | Effect of Natural Convection on Metal Anodic Dissolution - A. Davydov (A.N.Frumkin Institute of Electrochemistry of Russian Academy of Sciences) | |
| o | 715 | Electrosynthesis of PAni-Powder Using Anodized Aluminum - D. Huerta-Vilca and A. Motheo (Universidade de Sao Paulo) | |
| o | 716 | A New Process for Silicon Field Emitter Arrays Fabrication Using HF Photoelectrochemical Etching - G. Barillaro, F. Pieri, and M. Piotto (Universita di Pisa) | |
| o | 717 | Oxidation of J-ions in Propilencarbonat - V. Komnenic (University of Montenegro), S. Mentus (University of Belgrade), and V. Vojinovic (University of Montenegro) | |
| o | 718 | Oxidation of J-Ions in Aqueous Solutions on Catalyzed and Non-catalyzed Ebonex Electrode - M. Pjescic, I. Draskovic-Boskovic (University of Montenegro), S. Mentus (University of Belgrade), N. Blagojevic (University of Montenegro), and V. Komnenic (Universiti of Montenegro) | |
| o | 719 | Advanced Scanning Probe Instrumentation for Electrochemical Nanotechnology - W. Schindler (University of Karlsruhe) | |
| o | 720 | Theoretical Formalism That Describes (I-t) Curves Where the Presence of Diffusion Limited 3D Nucleation and HER Appear Simultaneously - M. Palomar-Pardave (Universidad Autonoma Metropolitana-Azcapotzalco), B. Scharifker (Universidad Simon Bolivar), E. Arce (Instituto Plotecnico Nacional, ESIQUIE), I. Gonzalez (Universidad Autonoma Metropolitana-Iztapalapa), and M. Romero-Romo (Universidad Autonoma Metropolitana-Azcapotzalco) | |
| o | 721 | Growth Kinetics of Anodic ALuminum Oxide Films Formed in Sulphamic Acid - K. D, V. Raj, M.P. Rajaram, and G. Balasubramanian (Central Electrochemical Research Institute) | |
| o | 722 | A Two-Compartment Vertical Channel Cell for Electrowinning Studies - P.A. Adcock (Australian National University), S.B. Adeloju (University of Western Sydney), L.J. Power, and M. Newman (Pasminco Site Technical Support) | |
| o | 723 | QCM Monitoring of CuCl Formation and Dissolution on Copper Surface - D. Soares (Universidade Estadual de Campinas), S. Wasle, K. Doblhofer (Fritz-Haber-Institut der Max-Planck Gesellschaft), and M. Tenan (Universidade de Mogi das Cruzes) | |
| o | 724 | Study of Bi, Re Adatomes on Polycrystalline Rhodium Electrode in Posphate Medium - M. Choy, J.M. Ortega, and M.I. Duala (Universidad de Los Andes) | |
| o | 725 | Electrochemical Study of the Anodic Dissolution of Copper with Electrochemical Quartz Crystal Microbalance(EQCM) in Alkaline Solution - S. Choi and Y. Tak (Inha University) | |
| o | 726 | The Investigation for the Behaviors of Surfactants Influenced Electroplating Through Polymeric Mask - S.T. Ke, M.D. Ger, Y. Sung, and L.M. Wang (Chung Cheng Institute of Technology) | |
| o | 727 | Fabrication of Titania Nanostructures on Glass by Aluminum Anodizing and Sol-Gel Process - S.-Z. Chu, K. Wada, S. Inoue, and S.-I. Todoroki (National Institute for Materials Science) | |
| o | 728 | Cu and Ag Deposition at Pt Single Crystal Electrodes: Nucleation, Structure and Nanostructuring - X. Xiao, P. Berenz, and H. Baltruschat (University of Bonn) |
Co-Chairs: J.M. Fenton and M. Musiani
| Time | Abs# | Title | View |
|---|---|---|---|
| 8:30 | 729 | Nanocomposite Electroplating. Electrochemical Aspects, Structure and Properties. - L. Benea (Dunarea de Jos University of Galati), P.L. Bonora (Trento University), A. Borello (ENEA), F. Wenger, P. Ponthaux, and J. Galland (Ecole Centrale Paris) | |
| 8:45 | 730 | Electrochemically Formed Films of Quaternary Pyridinium Compounds - J. Wong, V. Birss, and D. Cramb (University of Calgary) | |
| 9:00 | 731 | Electrochemical Polymerization of Co (II)-4,4',4'', -tetracarboxyphthalocyanine4''' - S. Maranhao, I. Aoki, and I. Guedes (Escola Politecnica da Universidade de Sao Paulo) | |
| 9:15 | 732 | Electrochemical Control of Whisker Growth on Electrodeposited Tin Coatings - A. Vicenzo, P.L. Cavallotti (Politecnico di Milano), and P. Crema (ST Microelectronics) | |
| 9:30 | 733 | Formation of Zn Film using Electrochemical Plating - M. Maeda and Y. Nishio (Kanazawa Institute of Technology) | |
| 9:45 | 734 | The Application of Pulsed Current to Sn-Pb Alloy Deposition onto a Rotating Disc Electrode - Y. Liu and M. Pritzker (University of Waterloo) | |
| 10:00 | Forty-Five Minute Intermission | ||
| 10:45 | 735 | Structure and Electrochemical Preoperties of Layered Oxide Films Prepared by Electrophoretic Deposition - M. Koinuma, H. Seki, D. Matsuo, H. Nakashima, and Y. Matsumoto (Kumamoto University) | |
| 11:00 | 736 | Electrodeposition Mechanism of PbSe and PbTe Epitaxial Films on InP Single Crystals - M. Froment, L. Beaunier, H. Cachet (Universite Paris VI), and A. Etcheberry (Universite de Versailles- St. Quentin en Yvelines) | |
| 11:15 | 737 | Characteristics of Conductivity-improved Polypyrrole Deposited on Roughened Gold Substrate - Y.C. Liu (Van Nung Institute of Technology) and K.C. Chung (National Taiwan University of Science and Technology) | |
| 11:30 | 738 | Electroplating Tin Oxide on Stainless Steel in Nitric Acid Solution - S.-T. Chang, I.-C. Leu, and M.-H. Hon (Nation Cheng Kung University) | |
| 11:45 | 739 | Corrosion Behavior of Electroplated Tin/Zinc Deposits - K. Wang, K. Weil, and H. Pickering (The Pennsylvania State University) |
Co-Chairs: M. Froment and D. Schwartz
| Time | Abs# | Title | View |
|---|---|---|---|
| 2:00 | 740 | Highly Resistive ZnO/Cu Multi-layered Film by Solution Chemical Processes - H. Takahashi and M. Izaki (NEC Toyama, Limited) | |
| 2:15 | 741 | AFM Induced Nanoscale Electrochemical Deposition of Metals on Si (100) Surfaces. - L. Santinacci (Swiss Federal Institute of Technology Lausanne), T. Djenizian, and P. Schmuki (University of Erlangen) | |
| 2:30 | 742 | Steady-state and Impedance Study of Nb Electrodissolution in Acid Fluoride Medium - S. Cattarin, M. Musiani (IPELP CNR), and B. Tribollet (CNRS UPR15 "Physique des Liquides et Electrochimie") | |
| 2:45 | 743 | Electrodeposition of Cu/Ni(Cu) Multilayers from a Citrate Electrolyte in a Flow Cell - W. Meuleman, S. Roy (University of Newcastle), and L. Peter (Hungarian Academy of Sciences) | |
| 3:00 | 744 | Effectiveness of Pulsed Cu ECD in Void Reduction in Feature Fills - S. Sen, S. Soukane, and T. Cale (Rensselaer Polytechnic Institute) | |
| 3:15 | 745 | High Throwing Power Nickel Electroplating and its Application - T. Murakami (C. Uyemura & Co., Ltd.), D. Gudeczauskas, D. Liston, and M. Moffatt (Uyemura International Corporation) | |
| 3:30 | 746 | Development of New Zn-Ni-Cd Coatings from Alkaline Solutions - H. Kim, A. Durairajan, and B.N. Popov (University of South Carolina) | |
| 3:45 | Fifteen-Minute Intermission | ||
| 4:00 | 747 | Application of Computer-aided Design and Manufacturing Concepts to Electrochemical Fabrication - D. Schwartz, W. Wang, J. Whitaker, S. Green, M. Ganter, and D. Storti (University of Washington) | |
| 4:30 | 748 | Formation of Complex, Three-Dimensional, Metallic Components Through a Removable-Template Electroplating Technique - C.M. Hagg, U. Schubert, A.H. Whitehead, and M. Schreiber (Funktionswerkstoffe F & E GmbH) | |
| 4:45 | 749 | The Influence of Convection on the Anodic Oxide Formation of Aluminum Studied and Modeled in a Wall-Jet Electrode Reactor - I. De Graeve, H. Terryn, G. Nelissen (Free University of Brussels), and P. Vankeirsbilck (ElSyCa NV) | |
| 5:00 | 750 | Electroless Ni-P Plating with Continuously Controlled Constituents - F. Matsui, S. Kawsaki, and H. Inagawa (C. Uyemura & Co., Ltd.) | |
| 5:15 | 751 | Corrosion of Auxiliary Electrodes in Electrochemical Processes Using AC - L. Binder, S. Mitsche (Graz University of Technology), and D. Lang (Plansee AG) | |
| 5:30 | 752 | Effect of Mass Transport on Si Electrodissolution in Aqueous Hydrazine - S. Cattarin, M. Musiani (IPELP CNR), and B. Tribollet (CNRS-UPR15) | |
| 5:45 | 753 | Localized Nucleation and Growth of Pb Clusters on n-Si(111):H Surfaces - M. Hugelmann, P. Hugelmann, W. Wiesbeck, W. Lorenz, F. Kaertner, and W. Schindler (University of Karlsruhe) |
Co-Chairs: G. Evans and D.A. Scherson
| Time | Abs# | Title | View |
|---|---|---|---|
| 8:30 | 754 | The Initial Stages of Electrochemical Metal Deposition - D.M. Kolb (University of Ulm) | |
| 9:00 | 755 | Mechanism of the Electrodeposition of Ag and Ag-Au Alloys on N-Si(111) and Properties of the Deposits - K. Marquez, G. Staikov, and J.W. Schultze (Heinrich-Heine-Universitat Dusseldorf) | |
| 9:15 | 756 | Deposition Process of Ni on Si(100) Surface in Aqueous Alkaline Solution - D. Niwa, N. Takano, T. Homma, and T. Osaka (Waseda University) | |
| 9:30 | 757 | Role of Nucleation and Growth Phenomena in Metallization of Micro- and Nanostructures - G. Staikov (Heinrich-Heine-Universitat Dusseldorf) | |
| 9:45 | 758 | In Situ Iridium LIII- Edge X-Ray Absorption Spectroscopy of Electrodeposited Iridium Oxide Films in Aqueous Electrolytes - Y. Mo, I. Stefan, and D. Scherson (Case Western Reserve University) | |
| 10:00 | Forty-Five Minute Intermission | ||
| 10:45 | 759 | An In situ Surface X-Ray Diffraction Study on the Electrochemical Deposition of Ni on Au(111) - T. Nouar, C. Lucas, R. Nichols, J. Thornton, D. Johnson, and S. Medway (University of Liverpool) | |
| 11:00 | 760 | In Situ Electrochemical Quartz Crystal Microbalance Study of the Dissolution of Gold Electrodes in Hydroxamic Acid Solution containing Nitric Ion - S. Shackleford, C. Boxall (University of Central Lancashire), G. Garnham, and R. Taylor (BNFL) | |
| 11:15 | 761 | A Study on the Inhibition Behavior of Polyethylene Glycol (PEG) in Copper Electrodeposition using EQCM - K.D. Song and K.B. Kim (Yonsei University) | |
| 11:30 | 762 | In Situ Monitoring of the Electroplating Process and Its Photocahodic Protection from Corrosion of Fe-Cr Alloy by the Use of Quartz Crystal Microbalance - S. Yoshihara, H. Yamato, T. Shirakashi (Utsunomiya University), N. Kudoh, and W. Oikawa (Nippon Platec) | |
| 11:45 | 763 | Parameter Estimation and Multi-Scale Simulations of Surface Roughness Evolution During Copper Electrodeposition - T. Drews, R. Gunawan, J. Alameda, R. Braatz, and R. Alkire (University of Illinois) |
Co-Chairs: R.P Janek and K. Kondo
| Time | Abs# | Title | View |
|---|---|---|---|
| 2:00 | 764 | Fundamental Aspects of Electrodeposition- zinc, Bumping and Via Filling - K. Kondo (University of Okayama) | |
| 2:30 | 765 | Computer Model Prediction of Electrochemical Ni-P Deposition Thickness and Composition in Phosphorous Electrolytes - B. Van den Bossche, G. Nelissen, J. Deconinck (Vrije Universiteit Brussel), M. Roessler, and L. Henneken (Robert Bosch GmbH) | |
| 2:45 | 766 | Microdefect Decoration in Monocrystalline Silicon: A Theoretical and Experimental Study - M. Kulkarni, J. Libbert, S. Keltner, and L. Mulestagno (MEMC Electronic Materials, Inc.) | |
| 3:00 | 767 | Simulation of Pulse-Plating in High Aspect Ratio Trenches - D. Veyret and M. Georgiadou (Univ of Provence) | |
| 3:15 | 768 | Computational Modeling of Electrodeposition in LIGA Microfabrication of MEMS Devices - K. Chen and G. Evans (Sandia National Laboratories) | |
| 3:30 | 769 | Variation of Film Resistance During Electropaint Deposition - Y.-I. Suzuki, H. Fukui, K. Tsuchiya, S. Arita (C. Uyemura & Co.,Ltd.), and Y. H. Ogata (Kyoto University) | |
| 3:45 | Fifteen-Minute Intermission | ||
| 4:00 | 770 | Electrodeposition of a Nano-Structured Ni-W Alloy and Charaterization of Electrocatalytic Properties - M. Miaomiao, V.S. Donepudi, J. Prakash (Illinois Institute of Technology), G. Sandi, G. Wiederrecht, and G. Wurtz (Argonne National Laboratory) | |
| 4:15 | 771 | Characterization and Processing of Electroplated Materials for LIGA Micromachining - R. Janek, T. Buchheit, S. Prasad, and C. Vanecek (Sandia National Laboratories) | |
| 4:30 | 772 | A New Method for the Evaluation of Electrodeposition Behavior for Electroplating Through Mask - Y. Sung, L.-M. Wang, M.-D. Ger, and S.T. Ke (National Defense University) | |
| 4:45 | 773 | Through-mask Electrodeposition of Au Alloys - J. Kelly (Sandia National Laboratories) | |
| 5:00 | 774 | Electron-Beam Induced Carbon Nanomasking for Selective Electrodeposition of Metals on Si(100) - T. Djenizian (University of Erlangen-Nuremberg), L. Santinacci (Swiss Federal Institute of Technology-Laussane), and P. Schmuki (University of Erlangen-Nuremberg) | |
| 5:15 | 775 | Fabrication and Contacting of Single Wires by Ion Track Etching and Electrochemical Deposition - M.E. Toimil Molares, R. Neumann, I. Schuchert, Z. Siwy, and C. Trautmann (Gesellschaft fuer Schwerionenforschung) | |
| 5:30 | 776 | Effect of Laser Irradiation Condition on the Fabrication of Microstructure on Aluminum via Anodizing, Laser Irradiation, and Electroplating - T. Kikuchi, M. Sakairi, H. Takahashi (Hokkaido University), Y. Abe, and N. Katayama (Hokkaido Industrial Research Institute) | |
| 5:45 | 777 | Fabrication of Highly Ordered Structures Using Anodic Porous Alumina - K. Nishio (Tokyo Metropolitan University), M. Nakao, A. Yokoo, T. Tamamura (NTT), and H. Masuda (Tokyo Metropolitan University) |
Co-Chairs: T.P. Moffat and G.T. Staikov
| Time | Abs# | Title | View |
|---|---|---|---|
| 8:30 | 778 | Superconformal Electrodeposition of Copper - T. Moffat, D. Wheeler, W. Huber, and D. Josell (National Institute of Standards and Technology) | |
| 9:00 | 779 | Focused Ion Beam Sensitization for Selective Triggering of Electrochemical Dissolution and Deposition on Semiconductor Surfaces - P. Schmuki (University of Erlangen-Nuremberg), L.E. Erickson, and G. Champion (National Research Council of Canada (NRC)) | |
| 9:15 | 780 | Controling Shape Formation of Copper Microstructures Fabricated by Localized Electrochemical Deposition - R. Said (United Arab Emirates University) | |
| 9:30 | 781 | Effect of Organic Alcohol Additives on the Shape for Electrodeposited Ni Microprobes - M. Kawaminami, R. Sugimoto, T. Yokoshima (Waseda Univesity), F. Asa (Advanced Reserch Institute for Science and Technology), T. Momma (Kagami Memorial Laboratory for Materials Science and Technology), T. Osaka (Waseda Univesity), and H. Honma (Kanto Gakuin University) | |
| 9:45 | 782 | Fabrication of Microabsorber Array for X-ray Microcalorimeter by Sn Electrodeposition - H. Sato, E. Goto, H. Kudo, T. Homma, T. Osaka, S. Shoji (Waseda University), T. Oshima, D. Audley, N. Iyomoto, R. Fujimoto, and K. Mitsuda (Institute of Space and Astronautic Science) | |
| 10:00 | Forty-Five Minute Intermission | ||
| 10:45 | 783 | Titanium Electrochemical Micromachining using Laser Lithography on Oxide Film - P.-F. Chauvy and D. Landolt (Ecole Polytechnique Federale de Lausanne) | |
| 11:00 | 784 | Metallization and Microstructuring of Insulating Polymers by the PLATO-Technique - T.T. Mai, G. Staikov, and J.W. Schultze (Heinrich-Heine-University of Dusseldorf) | |
| 11:15 | 785 | The Electrochemical Deposition and Properties of H1-e Nanostructured Films of Palladium - P.N. Bartlett, S. Guerin, J. Marwan, and Y.M. Tan (University of Southampton) | |
| 11:30 | 786 | Strategies for Etching Microcontact-printed Metal Substrates - M. Geissler, H. Schmid, A. Bietsch, E.J. O'Sullivan, B. Michel, and E. Delamarche (IBM Research) |