201st Meeting - Philadelphia, PA

May 12-17, 2002


AL1 - Sensing In Industrial And Extreme Applications

Sensor/Industrial Electrolysis and Electrochemical Engineering

Monday, May 13, 2002

Salon I, Level 5

Materials, Characterization, and Gas Sesning

Co-Chairs: R. Cernosek and J.R. Stetter

10:00 Introductory Remarks -
10:051567 Nanostructured Interfacial Materials for Piezoelectric and Chemiresistor Sensors - L. Han, J. Kneller, S. Chun, J. Luo, and C.-J. Zhong (State University of New York at Binghamton)
10:301568 An Electrochemical Detector for Vinyl Chloride in Gaseous Phase - M.-C. Chuang and M.-C. Yang (National Cheng Kung University)
10:551569 MEMS Based H2 Gas Sensors - F. DiMeo Jr., I.S. Chen, P. Chen, and J. Neuner (ATMI)
11:201570 The Improvement of the H_2S Sensing Potential for the SnO2 Produced by Mechano-chemical Milling - U. Kersen (Helsinki University of Technology)
11:451571 Studies on Platinum Coating on Zirconia Substrate of Oxygen Sensors Using Four-Point Probe and AC Impedance Technique - H. Xiao, T. Blanar, and R. Manoharan (Rosemount Analytical Inc.)

High-Temperature and Emission Monitoring

Co-Chairs: J. Weidner and J.R. Stetter

2:001572 Development of a High Temperature Total NOx Sensor Using a Microporous Catalytic Filter - N. Szabo and P. Dutta (The Ohio State University)
2:251573 Solid Electrolyte Sensors for Emissions Monitoring - S. Yao and J. Stetter (Illinois Institute of Technology)
2:501574 Thin Film Sensors for Harsh Environments - G. Fralick, L. Martin, and J. Wrbanek (NASA Glenn Research Center)
3:25 Twenty-Minute Intermission -
3:451575 Improving Sensitivity and Selectivity in TiO_2-Based Gas Sensors for High Temperature Applications - M. Frank, P. Dutta (Ohio State University), M. Fulkerson, B. Patton (Ohio State Univeristy), V. Thomas (Ohio Aerospace Institute), and G. Hunter (NASA Glenn Research Center)
4:101576 High-Temperature, High-Pressure Acoustic Microsensor with Diffraction-based Optical Detection - M. Abercrombie and F.L. Degertekin (Georgia Institute of Technology)
4:35 Closing Remarks -