202nd Meeting - Salt Lake City, UT

October 20-25, 2002

PROGRAM INFORMATION

K1 - Electrodeposition of Alloys

Electrodeposition

Tuesday October 22, 2002

Grand Ballrooms B and C, Main Level, Grand America Hotel

Co-Chairs: G. Zangari and W. Schwarzacher

TimeAbs#Title
o466 Galvanostatic Double-Pulse Plating of Copper with Organic Additives in Acid-Copper Solution - J. Han and M. King (ATMI)
o467 Effect of Saccharin Concentration on the Microstructure of the Electrodeposited Ni-Fe - S.-H. Kim, T. Kang, H.-J. Sohn, Y.-C. Joo, Y.-W. Kim (Seoul National University), T.-H. Yim, and H.-Y. Lee (Korea Institute of Industrial Technology)
o468 Electrodeposition of Platinum CIridium Alloy on Nickel-Base Single-Crystal Superalloy TMS75 - F. Wu, Y. Yamamoto, Y. Yamabe-Mitarai (National Institute for Materials Scienc), H. Murakami (The University of Tokyo), N. Hirosaki, and H. Harada (National Institute for Materials Scienc)
o469 The Analysis of the Zinc and Iron Group Metal Alloy Deposition Mechanism using an EQCM - H. Hayashi, S. Matsuda, and T. Katase (Okayama University)

Wednesday October 23, 2002

Tucson Room, Second Floor, Little America Hotel

Co-Chair: W. Schwarzacher

TimeAbs#Title
10:00470 Co-Deposition and the Interace Roughness of Iron Group Binary Alloys - J. Ebothé, S. Vilain, and M. Hiane (Universite de Reims)
10:30471 Anormalous Scaling of Surfaces Grown by Pulse-Current Electrodeposition - W. Oshikawa, K. Hamaguchi, and M. Saitou (University of the Ryukyus)
10:45472 Characterization of Initial Stages of the Electrodeposition of Ni, Zn and Ni-Zn Alloy by EQCM - K.D. Song and K.B. Kim (Yonsei University)
11:00473 Studies On Electrodeposited Zn-Ni-X (X = Cu, SiO_2) Ternary Alloys As a Replacement For Cadmium Coatings - S.P. Kumaragu, B. Veeraraghavan, B. Haran, and B. Popov (University of South Carolina)
11:15474 Non-Anomalous Zn-Ni-X (X=P, SiO2) Deposits As A Replacement For Cadmium Coating - B. Veeraraghavan, S.P. Kumaraguru, B.S. Haran, and B.N. Popov (University of South Carolina)
11:30475 Characterization of the Electrodeposited Co/Re-188 Alloy Layer on Radioactive Stents - H. Zhang (Cleveland State University) and U. Hafeli (The Cleveland Clinic Foundation)
11:45476 Electrodeposited Co-Mo Alloys for Hydrogen Evolution in a Hot Alkali Solution - P. Zabinski, H. Nemoto, S. Meguro (Tohoku Institute of Technology), K. Asami (Tohoku University), and K. Hashimoto (Tohoku Institute of Technology)

Co-Chair: D.T. Schwartz

TimeAbs#Title
2:00477 Tip-induced Metal Deposition for Nanostructuring Electrode Surfaces - D.M. Kolb (University of Ulm)
3:00478 In situ Scanning Tunneling Microscopy: Nanostructuring of Solid State Surfaces and Determination of Surface Properties - W. Schindler (Universitat Karlsruhe)
3:30 Fifteen-Minute Intermission -
3:45479 In situ Electrochemical Atomic Force Microscopy on Surface Alloying at Au(100)/Cd2+ Interface - R. Vidu (Univesity of California at Davis), N. Hirai, and S. Hara (Osaka University)
4:15480 Electrochemical Impedance Spectroscopy Study of Electrochemical Reactions on Single-Crystal Nickel Surfaces in Nickel Sulfamate - K. Hamaguchi, W. Oshikawa, and M. Saitou (University of the Ryukyus)
4:30481 Underpotential Deposition of Zinc on Platinum - E. Guerra (University of British Columbia), G. Kelsall (Imperial College), M. Bestetti (Polytechnic of Milan), D. Dreisinger, and D. Bizzotto (University of British Columbia)

Thursday October 24, 2002

Co-Chair: G. Zangari

TimeAbs#Title
8:30482 Electrodeposition of Vanadium-Aluminum Alloys in Lewis Acidic AlCl3-EtMeImCl Melt Containing EtMeImBF4 - T. Tsuda and C. Hussey (The University of Mississippi)
9:00483 Electrochemical Behavior of Tm3+ Ion and Electrodeposition of Tin Alloy Films in Dimethylsulfoxide - G. Liu and D. Yuan (Zhongshan University)
9:15484 A Comparison of Direct and Pulse Plating Techniques from Aprotic-Non-Aqueous Solutions and Aqueous Solutions for the Preparation of Various Pt/Ru/Os Alloys - J. Thomas and D. Buttry (University of Wyoming)
9:30 Thirty-Minute Intermission -
10:00485 Phase Stability of Electrodeposited Alloys: The Case of IB Metals - Sn Alloys - P.L. Cavallotti, M. Bestetti, L. Nobili, and A. Vicenzo (Ingegneria Chimica "Giulio Natta")
10:30486 White Gold Alloys Electrodeposition for Decorative Applications - A. Vicenzo, M. Rea, L. Vonella, M. Bestetti, and P.L. Cavallotti ("Giulio Natta" Politecnico di Milano)
10:45487 Electrodeposition of Brass-like Thin Films from Thiourea Electrolytes - M. Bestetti, A. Vicenzo, F. Ziglioli, S. Franz, and P.L. Cavallotti (Chimica "G. Natta")
11:00488 The Properties of Electrodeposited Copper-Manganese Alloy coatings - J. Gong, G. Wei (The University of Alabama), J.A. Barnard (University of Pittsburgh), and G. Zangari (The University of Alabama)
11:15489 Electrodeposition of Ni-Cu-gamma Al_2O3 Alloys into Deep Recesses - A. Panda and E. Podlaha (Louisiana State University)
11:30490 Flexible Maskless Electrodeposition of Arbitrary 250-dpi Alloy Patterns with Local Composition Control - J. Whitaker, W. Wang, D. Schwartz, A. Mudholkar, M. Ganter, and D. Storti (University of Washington)