202nd Meeting - Salt Lake City, UT
October 20-25, 2002
K1 - Electrodeposition of Alloys
Tuesday October 22, 2002
Grand Ballrooms B and C, Main Level, Grand America Hotel
Co-Chairs: G. Zangari and W. Schwarzacher
||Galvanostatic Double-Pulse Plating of Copper with Organic Additives in Acid-Copper Solution - J. Han and M. King
||Effect of Saccharin Concentration on the Microstructure of the Electrodeposited Ni-Fe - S.-H. Kim, T. Kang, H.-J.
Sohn, Y.-C. Joo, Y.-W. Kim (Seoul National University), T.-H. Yim, and H.-Y. Lee (Korea Institute of Industrial Technology)|
||Electrodeposition of Platinum CIridium Alloy on Nickel-Base Single-Crystal Superalloy TMS75 - F. Wu, Y. Yamamoto, Y. Yamabe-Mitarai (National Institute for Materials
Scienc), H. Murakami (The University of Tokyo), N. Hirosaki, and H. Harada (National Institute for Materials
||The Analysis of the Zinc and Iron Group Metal Alloy Deposition Mechanism using an EQCM - H. Hayashi, S. Matsuda, and T. Katase (Okayama University)|
Wednesday October 23, 2002
Tucson Room, Second Floor, Little America Hotel
Co-Chair: W. Schwarzacher
||Co-Deposition and the Interace Roughness of Iron Group Binary Alloys - J.
Ebothé, S. Vilain, and M. Hiane (Universite de Reims)|
||Anormalous Scaling of Surfaces Grown by Pulse-Current Electrodeposition - W.
Oshikawa, K. Hamaguchi, and M. Saitou (University of the Ryukyus)|
||Characterization of Initial Stages of the Electrodeposition of Ni, Zn and Ni-Zn Alloy by EQCM -
K.D. Song and K.B. Kim (Yonsei University)|
||Studies On Electrodeposited Zn-Ni-X (X = Cu, SiO_2) Ternary Alloys As a Replacement For Cadmium Coatings -
S.P. Kumaragu, B. Veeraraghavan, B. Haran, and B. Popov (University of South Carolina)|
||Non-Anomalous Zn-Ni-X (X=P, SiO2) Deposits As A Replacement For Cadmium Coating - B.
Veeraraghavan, S.P. Kumaraguru, B.S. Haran, and B.N. Popov (University of South Carolina)|
||Characterization of the Electrodeposited Co/Re-188 Alloy Layer on Radioactive Stents - H. Zhang (Cleveland State University) and U. Hafeli (The Cleveland Clinic Foundation)|
||Electrodeposited Co-Mo Alloys for Hydrogen Evolution in a Hot Alkali Solution - P.
Zabinski, H. Nemoto, S. Meguro (Tohoku Institute of Technology), K. Asami (Tohoku University), and K. Hashimoto (Tohoku Institute of Technology)|
Co-Chair: D.T. Schwartz
Thursday October 24, 2002
Co-Chair: G. Zangari
||Electrodeposition of Vanadium-Aluminum Alloys in Lewis Acidic AlCl3-EtMeImCl Melt Containing EtMeImBF4 - T. Tsuda and C. Hussey (The University of Mississippi)|
||Electrochemical Behavior of Tm3+ Ion and Electrodeposition of Tin Alloy Films in Dimethylsulfoxide - G. Liu and D. Yuan
||A Comparison of Direct and Pulse Plating Techniques from Aprotic-Non-Aqueous Solutions and Aqueous Solutions for the Preparation of Various Pt/Ru/Os Alloys - J. Thomas and D. Buttry (University of Wyoming)|
||Thirty-Minute Intermission - |
||Phase Stability of Electrodeposited Alloys: The Case of IB Metals - Sn Alloys -
P.L. Cavallotti, M. Bestetti, L. Nobili, and A. Vicenzo (Ingegneria Chimica
||White Gold Alloys Electrodeposition for Decorative Applications - A.
Vicenzo, M. Rea, L. Vonella, M. Bestetti, and P.L. Cavallotti ("Giulio
Natta" Politecnico di Milano)|
||Electrodeposition of Brass-like Thin Films from Thiourea Electrolytes - M.
Bestetti, A. Vicenzo, F. Ziglioli, S. Franz, and P.L. Cavallotti (Chimica "G.
||The Properties of Electrodeposited Copper-Manganese Alloy coatings - J. Gong, G. Wei (The University of Alabama),
J.A. Barnard (University of Pittsburgh), and G. Zangari (The University of Alabama)|
||Electrodeposition of Ni-Cu-gamma Al_2O3 Alloys into Deep Recesses - A. Panda and E. Podlaha (Louisiana State University)|
||Flexible Maskless Electrodeposition of Arbitrary 250-dpi Alloy Patterns with Local Composition Control - J. Whitaker, W. Wang, D. Schwartz, A.
Mudholkar, M. Ganter, and D. Storti (University of Washington)|