202nd Meeting - Salt Lake City, UT

October 20-25, 2002


L1 - Lead-Free Solders for Microelectronics Packages

Electrodeposition/Dielectric Science and Technology

Monday October 21, 2002

Tucson Room, Second Floor, Little America Hotel

Co-Chairs: R. Agerwala and R. Stafford

10:00549 Thermomechanical and Metallurgical Evaluations of Pb-free Solders - J. Bartelo, K.J. Puttlitz, Sr., and R.A. Susko (IBM Corporation)
10:30550 Mechanical Properties and Shear Strength of Sn-3.5Ag-Bi Solder Alloys - J.-W. Choi, H.-S. Cha, S.-W. Lee, and T.-S. Oh (Hong Ik University)
10:50551 Reaction and Intermetallic Compound Formation between Sn-Cu Solder and Thin Film UBM - T.-S. Oh (Hong Ik University), J.-S. Ha (Seoul National University), and K.-N. Tu (UCLA)
11:10552 Whisker Formation on Electroplated Sn-Cu - G. Stafford, M. Williams, C. Johnson, K.-W. Moon, and W. Boettinger (National Institute of Standards and Technology)

Co-Chairs: H.S. Rathore and C.M. Reidsema-Simpson

2:00553 Challenges of Lead-Free Manufacturing - K.J. Puttlitz, Sr. and R.A. Susko (IBM Corporation)
2:20554 Solder Reaction and Diffusion of Autocatalytic Cobalt with Tin Solder Alloys - V. Sirtori, S. Seregni (Celestica Italia), L. Magagnin, D. Maggi, and P.L. Cavallotti (G. Natta Politecnico di Milano)
2:40555 Electrochemical Aspects of Zincate Pretreatment for UBM Applications - J.-H. Lee (Hongik University), I. Lee, T. Kang (Seoul National University), N. Kim, and S. Oh (Samsung Electronics)
3:00556 Electroless Nickel Plating on Aluminum I/O Pad in UBM - I. Lee, T. Kang (Seoul National University), J.-H. Lee (Hongik University), N. Kim, and S. Oh (Samsung Electronics)
3:20557 In Situ Characterization of Intermetallic Compound Formation in Lead-Free Soldering - C. Lavoie (IBM Research), D. Leonard (IBM Microelectroncis), A. Ozcan (Boston University), S.J. Kilpatrick (IBM Microelectroncis), T.-M. Korhonen (Cornell University), and J.M.E. Harper (IBM Research)