202nd Meeting - Salt Lake City, UT
October 20-25, 2002
PROGRAM INFORMATION
L1 - Lead-Free Solders for Microelectronics Packages
Electrodeposition/Dielectric Science and Technology
Monday October 21, 2002
Tucson Room, Second Floor, Little America Hotel
Co-Chairs: R. Agerwala and R. Stafford
Time | Abs# | Title |
10:00 | 549 |
Thermomechanical and Metallurgical Evaluations of Pb-free Solders - J.
Bartelo, K.J. Puttlitz, Sr., and R.A. Susko (IBM Corporation) |
10:30 | 550 |
Mechanical Properties and Shear Strength of Sn-3.5Ag-Bi Solder Alloys - J.-W.
Choi, H.-S. Cha, S.-W. Lee, and T.-S. Oh (Hong Ik University) |
10:50 | 551 |
Reaction and Intermetallic Compound Formation between Sn-Cu Solder and Thin Film UBM - T.-S. Oh (Hong Ik University), J.-S. Ha (Seoul National University), and K.-N. Tu (UCLA) |
11:10 | 552 |
Whisker Formation on Electroplated Sn-Cu - G. Stafford, M. Williams, C. Johnson, K.-W. Moon, and W. Boettinger (National Institute of Standards and Technology) |
Co-Chairs: H.S. Rathore and C.M. Reidsema-Simpson
Time | Abs# | Title |
2:00 | 553 |
Challenges of Lead-Free Manufacturing -
K.J. Puttlitz, Sr. and R.A. Susko (IBM Corporation) |
2:20 | 554 |
Solder Reaction and Diffusion of Autocatalytic Cobalt with Tin Solder Alloys - V.
Sirtori, S. Seregni (Celestica Italia), L. Magagnin, D. Maggi, and P.L. Cavallotti (G. Natta Politecnico di
Milano) |
2:40 | 555 |
Electrochemical Aspects of Zincate Pretreatment for UBM Applications - J.-H. Lee
(Hongik University), I. Lee, T. Kang (Seoul National University), N. Kim, and S. Oh (Samsung Electronics) |
3:00 | 556 |
Electroless Nickel Plating on Aluminum I/O Pad in UBM - I. Lee, T. Kang (Seoul National University), J.-H. Lee
(Hongik University), N. Kim, and S. Oh (Samsung Electronics) |
3:20 | 557 |
In Situ Characterization of Intermetallic Compound Formation in Lead-Free Soldering - C. Lavoie (IBM Research), D. Leonard (IBM
Microelectroncis), A. Ozcan (Boston University), S.J. Kilpatrick (IBM
Microelectroncis), T.-M. Korhonen (Cornell University), and J.M.E. Harper (IBM Research) |
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