1991 Published Proceeding Volumes

All proceedings for this year are  Out of Print.

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State-of-the-Art Program on Compound Semiconductors XIII/Metallization of III-V Compound Semiconductors, H. H. Lee, P. Clechet, O. Ueda, and J. M. Woodall, editors, PV 91-1, 376 pages. This symposium volume is divided into six sections according to the nature of the papers on the state of the art of compound semiconductors: Superlattices, Epitaxy and CVD; Devices and Fabrication; Properties and Characterization; Diffusion and Implantation; Processing Technologies; and Metallization.  Out of Print.


Corrosion of Electronic Materials and Devices (1st International Symposium), J. D. Sinclair, editor, PV 91-2, 480 pages. The device classes and diversity of materials topics covered in this symposium volume range from materials aspects of the reliability of coatings for advanced packaging technologies, to reliability of coatings for advanced packaging technologies; to studies aimed at a fundamental understanding of surface conductance across insulating substrates, and investigations of the corrosion behavior of metal interconnect or contact materials during processing or field exposure.  Out of Print.


Primary and Secondary Lithium Batteries, K. M. Abraham and M. Salomon, editors, PV 91-3, 456 pages. Topics covered in the symposium volume include pulse power batteries, high and superhigh energy density primary systems, organic polymer electrolytes and electrodes, mixed solvent-based liquid electrolytes for secondary batteries, and alternative anodes such as Li alloys and intercalated carbon for safe rechargeable batteries.  Out of Print.


Process Physics and Modeling in Semiconductor Technology (2nd International Symposium), G. R. Srinivasan, J. D. Plummer, and S. T. Pantelides, editors, PV 91-4, 820 pages. The main objective of this symposium was to provide a forum where research on the physical mechanisms and numerical modeling of processes involved in various integrated circuit technologies are discussed. The volume is divided into seven sections: Surfaces and Interfaces, Ion Implantation, Thin Film Growth, Diffusion and Thermal Processing, Dislocations and Defects, Plasma and Beam Processing, Numerical Modeling.  Out of Print.


Automated Integrated Circuits Manufacturing (6th International Symposium), V. E. Akins and H. Harada, editors, PV 91-5, 416 pages. This symposium volume is divided into six sections: CIM and Factory Automation; Process Control; Cluster Tools; Scheduling, Simulation and Modeling; Contamination and Defect Control; Contamination, Environmental Control and Safety.  Out of Print.


High Temperature Electrode Materials and Characterization, D. Macdonald and A. C. Khandkar, editors, PV 91-6, 304 pages. Topics in this symposium volume range from the theoretical, where mathematical formalisms are presented for the analyses and interpretation of EIS, to the applied where recent results from the application of EIS and other transient techniques to the study of electrode processes are presented. Other topics discussed are molten salt batteries, molten carbonate fuel cells, Na-heat engines, and solid electrolyte systems.  Out of Print.


The Application of Surface Analysis Methods to Environmental/Material Interaction, D. R. Baer, C. R. Clayton, and G. D. Davis, editors, PV 91-7, 576 pages. This symposium addresses the fundamental aspects of surface sensitive analytical methods currently or potentially useful to studies of environmental/materials interactions and the application of these methods to model or engineering systems. Also covered are issues concerning in situ and ex situ analysis, probe effects, quantitative analysis and other important experimental and analytical considerations.  Out of Print.


Diamond Materials (2nd International Symposium), A. J. Purdes, J. C. Angus, R. F. Davis, B. M. Meyerson, K. E. Spear, and M. Yoder, editors, PV 91-8, 688 pages. This symposium addresses all aspects of diamond materials science and technology from growth fundamentals to applications. Topics included are: synthesis techniques, vapor phase diagnostics, nucleation and crystal growth, microstructural characterization and local atomic order, mechanical behavior, optical properties, electronic properties, and manufacturing issues.  Out of Print.


Defects in Silicon II, W. M. Bullis, U. Gosele, and F. Shimura, editors, PV 91-9, 704 pages. This symposium focuses on the science and technology of chemical and crystallographic defects in silicon crystals and wafers. Among the defects of concern are oxygen, carbon, nitrogen, hydrogen, other electrically "inactive" impurities; heavy metals; vacancies; self-interstitials; dislocations; stacking faults; oxide or metallic precipitates; and near-surface damage. Topics include the origin of these defects; mechanical, chemical, and electrical effects of defects in the bulk or at the surface; interactions between two or more defect species; and techniques for characterizing and controlling defects.  Out of Print.


Ultra Large Scale Integration Science and Technology (3rd International Symposium), J. M. Andrews and G. K. Celler, editors, PV 91-11, 944 pages. This symposium focuses on processing, structure, and properties of integrated circuits with submicron features. Topics include: ULSI device structure and technology, submicron device and process modeling and evaluation, submicron feature patterning, shallow junction and ohmic contacts, thin gates, removal of process-reduced damage and contamination, rapid thermal processing, planarization techniques, ULSI interconnect and packaging, and ULSI manufacturing.  Out of Print.


Ionic and Mixed Conducting Ceramics (1st International Symposium), T. A. Ramanarayanan and H. L. Tuller, editors, PV 91-12. Topics covered in this symposium are fast ion transport in crystalline, glassy, or composite electrolytes; means of inserting substantial electronic conduction into ionic matrices, modeling of mixed conduction under chemical and electrical driving forces, role of structure in mixed conduction phenomena; modeling and characterization of mixed ionic-electronic transport in insertion, electrochromic, and fuel cell electrodes; evaluation of ionic and mixed conducting materials in solid state batteries, fuel cells, displays, sensors, and other applications.  Out of Print.


State-of-the-Art Program on Compound Semiconductors XIV/Large Area/Scale Epitaxy for III-V Device Fabrication, A. T. Macrander and D. N. Buckley, editors, PV 91-13, 316 pages. The first part of this proceedings addresses the latest developments in compound semiconductors. Product development and research results which relate device properties to materials properties or to processing steps are discussed. The second part addresses the large-scale growth, charcterization and processing of epitaxial structures for III-V electronic and photonic devices. Also discussed are issues related to large wafer size and high throughput.  Out of Print.


Low Temperature Electronic Device Operation, D. Foty, S. Raider, N. Saks, and G. Oleszek, editors, PV 91-14, 256 pages. This symposium addresses the operation of electronic devices, circuits, and systems at reduced temperature. Topics include the basic physics of electronic materials and structures at low temperatures, as well as comparisons with room temperature technology in terms of the benefits and reasons for creating a low temperature technology.   Out of Print.

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