Major interests of the Electrodeposition Division include fundamental aspects of electrochemical deposition of metals and alloys, structure and properties of deposits, and technological applications of electrochemically produced metals and alloys. Electrochemical deposition involves reduction of metallic ions from aqueous, inorganic, and fused salt electrolytes. The reduction process M^z+(solution) + zc -> M(lattice) can be accomplished by the electrodeposition process in which z electrons are supplied by an external power supply or by electroless (autocatalytic) deposition process in which a reducing agent in the solution is the electron source (there is no external power supply). There are two types of fundamental problems involved with the above equation: (i) kinetics and mechanism of the process, and (ii) nucleation and growth of the lattice (M(lattice)). In the research on fundamental aspects of the kinetics and mechanism of special interest are basic kinetic steps: charge transfer or ion discharge to form a neutral adatom or partly charges adion at the substrate surface and surface diffusion of adatom and adion. Interfacial electrochemistry (charge distribution across interface and the structure of the doublelayer) and various aspects of materials science are of great importance for understanding the above fundamental problems.
In the area of structure and properties of deposits of special interest are grain size, texture (preferred orientation), and correlation between structure and physical and chemical properties of deposits. A few examples of applications of electrochemical deposition include: printed circuit boards, magnetic alloys for computer memories, coatings for hard disk drives, wear resistant coatings, corrosion resistant alloys, metal matrix composites, electroreformed laser mirrors, electrochromic materials, decorative coatings, oxides, and organic polymers.
Electrodeposition Division Research Award —The Research Award of the Electrodeposition Division recognizes recent outstanding achievement or contribution in the field of electrodeposition. The award, consisting of a scroll and $2,000 is given annually at the fall ECS meeting. Submit nominations in a letter detailing the accomplishments of the nominee accompanied by a list of supporting publications with titles to: Thomas P. Moffat, NIST, 100 Bureau Drive, Stop 8551, Gaithersburg, MD 20899-8551, USA; e-mail: thomas.moffat@nist.gov. The nomination deadline is April 1, 2008.
Student Travel Grants —$750 student travel grants are available. The grant shall be presented to a graduate student of demonstrated ability in electrodeposition research to assist his or her travel to an ECS meeting at which he or she is presenting a paper or a student poster in a sponsored or cosponsored Electrodeposition Division symposium. These are competitive grants. The travel grants committee consists of: Stanko Brankovic, Chair, and Elizabeth Podlaha. Please send your grant applications to Stanko Brankovic, e-mail: Stanko.Brankovic@mail.uh.edu.
Future Electrodeposition Division Symposia
2008 Spring, Phoenix
Electrodeposition for Energy Applications
Organizers: J. L. Stickney, S. R. Brankovic, L. Deligianni, M. Lay, K. Rajeshwar, G. Zangari, and S. Zou.
2008 Fall, Honolulu
Tenth International Symposium on Magnetic Materials, Processes and Devices
Organizers: C. Bonhote, S. Brankovic, H. Gatzen, Y. Kitamoto, T. Osaka, W. Schwarzacher, G. Zangari
Molecular Structure of the Solid-Liquid Interface and Its Relationship to Electrodeposition VI
Organizers: R. Alkire, Y. Fukunaka, T. Homma, and D. Kolb
Electronics Packaging III
Organizers: K. Kondo, D. Barkey, M. Hayase, T. Ritzdorf, and W. Wu
Green Electrodeposition II
Organizers: S. Roy, G. Zangari, and S. Yoshihara
Bio-inspired Materials Synthesis
Organizers: D. Schwartz, H. De Long, C. Orme, and T. Homma
