207th ECS Meeting - Quebec City, Canada

May 15 - May 20, 2005

PROGRAM INFORMATION
 

E1 - Chemical, Electrochemical, and Mechanical Effects on CMP, Tribocorrosion, and Biotribocorrosion

Corrosion/Electronics and Photonics
 

Tuesday, May 17, 2005

Room 204A, Level 2, Quebec City Convention Center

Tribocorrosion/Biocorrosion

Co-Chairs: J.P. Celis & D.J. Duquette
TimeAbs#Title and Authors
08:20 306 Fretting Corrosion Behavior of Ti6Al4V Alloy with Collagen Coated on the Surface S. Hiromoto (National Institute for Materials Science) and S. Mischler (Swiss Federal Institute of Technology Lausanne (EPFL))
08:40 307 Electrokinetic Currents and Corrosion in Lubricated Systems T. Beck (Electrochemical Technology Corp.)
09:00 308 Conditions Promoting and Suppressing Electrokinetic-Current Corrosion T. Beck (Electrochemical Technology Corp.)
09:20 309 Transient Measurements of Single Particle Impacts on Disk Shaped Microelectrodes for the Investigation of Tribocorrosion A. Smith (Max-Planck-Institute for Iron Research), M. Stratmann (Max-Planck-Institut) and A. Hassel (Max-Planck-Institute)
09:40 310 Tribocorrosion of Aisi 304l Stainless Steel under Continuous Sliding in Ringer's Medium J. Celis (KUL), A. Berradja, D. Deforge, F. Wenger, P. Ponthiaux and R. Nogueira (Ecole Centrale Paris)
10:00 1798 Electrochemical Preparation and Characterization of Biocompatible Passive Layers on Titanium B. Zhao and G. Jerkiewicz (Queen's University)
10:20 1799 Electrochemical Characterization of The Passive Films on The Bioactive Implant Titanium Alloys E. Vasilescu (Institute of Physical Chemistry), J. Mirza-Rosca, J. Rodriguez Castro, E. Herrera (Las Palmas de Gran Canaria University), M. Popa and P. Drob (Institute of Physical Chemistry)
10:40 311 Electrochemical Study of the Repassivation of Titanium in Different Artificial Saliva Solutions A. Catarina, L. Rocha, A. Edith (University of Minho) and J. Celis (Katholieke Universiteit Leuven)
11:00 312 Electrochemical Behavior of Pure Titanium in Alternative linear Regime of Sliding in Contact with Artificial Saliva solutions A. Ribeiro, L. Rocha, E. Ariza (University of Minho) and J. Celis (KUL)
11:20 313 Tribocorrosion of AISI 304L Stainless Steel Sliding Against AISI 304L Stainless Steel in Nuclear Environment D. Deforge, P. Ponthiaux, F. Wenger (Ecole centrale Paris), A. Lina and A. Ambard (Electricite France)
 

CMP

Co-Chairs: D.J. Duquette & J.P. Celis
TimeAbs#Title and Authors
14:00 314 Electrochemical Investigations in to CMP Mechanisms V. Desai (Univ. of Central Florida)
14:30 315 A Study of Bath Chemistry for Electropolishing for Electrochemical Mechanical Polishing (eCMP) Process Development A. Mansson and D. Duquette (RPI)
14:50 316 Acoustic Emission Characteristics of Oxidation and Dissolution in Copper CMP J. Choi, D. Lee and D. Dornfeld (University of California at Berkeley)
15:10 317 A Novel Nanoparticle Additive for Enhanced Copper CMP Performance S. Deshpande, S. Patil, S. Kuchibhatla and S. Seal (University of Central Florida)
15:30 318 Effect of Oxidizer on the Galvanic Behavior of Cu/Ta Couple in the Chemical-Mechanical Polishing W. Tsai and J. Chen (National Cheng Kung University)
15:50 319 The Effect of Organic Additives on Corrosion in Cu Chemical Mechanical Polishing M. Kang, J. Lee (Research Center for Energy Conversion and storage) and J. Kim (Seoul National University)
16:10 320 Characterization of 5-aminotetrazole (ATRA) as a Corrosion Inhibitor in Copper Chemical Mechanical Polishing J. Lee, M. Kang (Research center for energy conversion and storage) and J. Kim (Seoul National University)
16:30 321 The Competitive Reaction Between Slurry and Cleaning Solution A. Ueno (Electrical and Electronic Engineering), M. Kodera (Ebara Corporation) and S. Uekusa (Meiji University)
16:50 322 Performance of a Novel Controlled-contact Area Pad for CMP S. Lee, H. Kim (The University of California, Berkeley) and D. Dornfeld (University of California at Berkeley)
17:10 323 Polishing Performance of Double XY-groove Pattern Pad for W-CMP Application Y. Seo (Daebul University), C. Kim (Dong-Sung A&T. Co. Ltd.), S. Park (Daebul University) and W. Lee (Chosun University)
17:30 324 Use of Chemical Mechanical Polishing in the Fabrication of Radio Frequency (RF) Micro Coaxial Transmission Lines (MCTL) P. Zantye, A. Kumar, S. Natrajan and T. Weller (University of South Florida)