207th ECS Meeting - Quebec City, Canada

May 15 - May 20, 2005

PROGRAM INFORMATION
 

I1 - Surfactant and Additive Effects on Thin Film Deposition and Particle Growth

Electrodeposition/Physical and Analytical Electrochemistry
 

Monday, May 16, 2005

Room 2000D, Level 2, Quebec City Convention Center

Co-Chairs: T.P. Moffat & J. Switzer
TimeAbs#Title and Authors
10:00 439 An Atomic View on The Dynamics of Defects on Metal Surfaces and on The Influence of Adsorbates on Surface Diffusion Phenomna M. Giesen (Forschungszentrum Juelich)
10:40 440 What is the Role of Colloidal Templates in Controllig the size and Shape of Nanocrystals? M. Pileni (Universite P et M Curie)
11:20 441 Surface Dynamics in the Presence of Coupled Anion-Cation Layers - An In-Situ STM Study P. Broekmann (University Bonn)
 
Co-Chairs: O. Magnussen & T.P. Moffat
TimeAbs#Title and Authors
14:00 442 Surfactant-Directed Shape Control of Gold and Silver Nanoparticles C. Murphy (University of South Carolina)
14:40 443 Adsorption of Decyltrimethylammonium Triflate (DeTATf), A Model Cationic Surfactant, at the Au(111) Surface C. Brosseau, E. Sheepwash, I. Burgess, E. Cholewa, J. Lipkowski (University of Guelph) and S. Roscoe (Acadia University)
15:00 444 Seed-Mediated Growth of Gold Nanorods Directly on Surfaces F. Zamborini, Z. Wei and A. Mieszawska (University of Louisville)
15:20 445 In-situ Surface X-ray Diffraction Studies of Homoepitaxial Gold Electrodeposition O. Magnussen, A. Ayyad, K. Krug and J. Stettner (University Kiel)
16:00 446 Gold Nanorod Nucleation and Growth from Colloid Seeds J. Hafner and H. Liao (Rice University)
16:20 447 Gold Superfill During Electrodeposition in Submicrometer Features D. Josell, T. Moffat and D. Wheeler (NIST)
16:40 448 In situ Sum Frequency Generation Spectroscopy of the CN Resonance at Au Single- and Polycrystalline Electrodes in the presence of Organic Additives for Electrodeposition baths B. Bozzini (Universiti Lecce), B. Busson (Centre Universitaire Paris Sud), G. De Gaudenzi (Anzola d'Ossola), L. D'Urzo (Universita di Lecce), G. Giovannelli (Universita di Roma), C. Mele (Universit di Lecce), C. Six, F. Vidal and A. Tadjeddine (Centre Universitaire Paris Sud)
17:20 449 Effect of a Supporting Electrolyte and Additives on Crystal Growth of Electrodeposited Ag T. Wakatsuki, E. Kusaka, Y. Fukunaka and R. Ishii (Kyoto University)
17:40 450 The Importance of Defect (MMS) Surface States in Additive Effects in Damascence Copper Plating Baths L. Burke (Unversity College Cork), C. Buckley and R. Sharna (University College Cork)
 

Tuesday, May 17, 2005

Room 2000D, Level 2, Quebec City Convention Center

Co-Chairs: J. Switzer & T.P. Moffat
TimeAbs#Title and Authors
08:00 451 Scratching Induced Sensitization of Semiconductor Surface for Electrodeposition Y. Zhang and P. Schmuki (University of Erlangen-Nuremberg)
08:20 452 Electrochemical Soft Lithography: A New Route for Metal Nanopatterning R. Salvarezza (INIFTA-UNLP-CONICET), P. Dip, C. Dos Santos Claro (INIFTA), G. Benitez, M. Fonticelli (INIFTA-CONICET-UNLP), P. Schilardi and O. Azzaroni (INIFTA-UNLP-CONICET)
09:00 453 Using Self-assembled Monolayers as Model Substrates for Metal Deposition: The Influence of Alkyl Chain Length C. Whelan, T. Fernandez Landaluce, A. Demas and J. Schuhmacher (IMEC)
09:20 454 Site-Selective Patterning Using Surfactant-Based Resists N. Pesika (Kyoto University), K. Stebe and P. Searson (Johns Hopkins UNiversity)
09:40 Intermission (20 Minutes)
10:00 455 Superconformal Film Growth: Mechanism and Quantification T. Moffat, D. Wheeler and D. Josell (NIST)
10:20 456 Bump Reduction in Copper Superfilling by Cl- Rich Bath M. Hayase and T. Hatsuzawa (Tokyo Institute of Technology)
10:40 457 In situ Surface Enhanced Raman and Electroreflectance Spectroelectrochemical Investigations of Organic Additives during the Electrodeposition of Cu from Acidic Sulphate Solutions B. Bozzini (Universiti Lecce), L. D'Urzo (Universita di Lecce), G. Giovannelli (Universita di Roma) and C. Mele (Universit di Lecce)
11:00 458 Effect Of Additives On Deposition and Corrosion: Vibrational Spectroscopic Measurements A. Gewirth, Z. Schultz and Z. Feng (University of Illinois)
11:40 459 In-Situ Ellipsometric Study of PEG/Cl- Co-adsorption on Cu, Ag and Au M. Walker, L. Richter and T. Moffat (NIST)
 
Co-Chairs: T. Yoshida & J. Switzer
TimeAbs#Title and Authors
14:00 460 Electrodeposition of Zinc Oxide in Presence of Additives D. Lincot (Ecole Nationale Superieure de Chimie de Paris), T. Pauporte, A. Goux, V. Lair (ENSCP) and T. Yoshida (Gifu University)
14:40 461 Electrodeposition of Chiral Metal Oxide Films J. Switzer, H. Kothari, I. Nicic, E. Kulp, S. Limmer and E. Bohannan (University of Missouri-Rolla)
15:20 462 Structure Controlled Electrodeposition of ZnO/Dye Hybrid Thin Films T. Yoshida (Gifu University), T. Pauporte (ENSCP), D. Lincot (Ecole Nationale Superieure de Chimie de Paris), H. Tada (Institute for Molacular Science) and H. Minoura (Gifu University)
16:00 463 Templating of Nanoparticulate Iron Oxides and Oxyhydroxides in Non-ionic Surfactant Media C. Boxall, J. Addison, S. Bashir, M. Leaver, R. McCabe and D. Mobbs (University of Central Lancashire)
16:20 464 A Molecular View of Adsorbate Effects during Crystallization C. Orme (Lawrence Livermore National Laboratory), I. Kim (New York University), M. Darragh (Lawrence Livermore National Laboratory), J. Evans (New York University) and J. De Yoreo (Lawrence Livermore National Laboratory)
17:00 465 Self Assembly of Star Shape Engineered Oxide Nanostructures for High Temperature Applications S. Kuchibhatla, S. Patil (University of Central Florida), S. Hong (ucf) and S. Seal (University of Central Florida)
17:20 466 The Importance of Polarization Curves in Understanding Surfactant Effects on Electrochemical Deposition Processes P. Adcock (Campbellsville University)
 

Room 200A/200B/200C, Level 2, Quebec City Convention Center

Tuesday Evening Poster Session

Co-Chairs: T. Moffat & J. Switzer
TimeAbs#Title and Authors
o 467 The Influence of Conductive Polymer on Deposition and Morphology Study of Compositional LSM/YSZ Cathode Layer Using Electrophoretic Deposition J. Shen (National Chen Kung University), K. Yang (National Kaohsiung University of Applied Science), H. Wen (National Chiao Tung University), K. Yang and K. Fung (National Chen Kung University)
o 468 Electrodeposition of CoPd Alloys from a Chloride Bath Containing Glycine F. Takata (Chemistry) and P. Sumodjo (IQ/USP)
o 469 Electrochemical Screening of Additive Effects in Electrodeposition P. Adcock (Campbellsville University)
o 470 Spouted Bed of MCrAlY Powders in Applications CVD F. Juarez (IInstituto Politecnico Nacional)
 

Wednesday, May 18, 2005

Room 2000D, Level 2, Quebec City Convention Center

Co-Chairs: S. Brankovic & J. Switzer
TimeAbs#Title and Authors
10:00 471 The Use of Elemental Replacement Reactions, with Iodine as a Surfactant, for the Formation of Atomic Layers in an EC-ALE Cycle for the Formation of Metal Films J. Stickney (The University of Georgia) and Y. Kim (University of Georgia)
10:20 472 Competition Between Crystallographic and Geometrical Influences on Nickel Electrocrystallization in the Presence of Saccharin D. Dibble, A. Talin and N. Bartelt (Sandia National Laboratories)
11:00 473 Saccharin Incorporation During the Electrodeposition of Co40Fe60 Alloys - Consequences for Magnetic and Corrosion Properties S. Brankovic (Seagate Research Center), F. Wiatrowski and M. Seigler (Seagate Research)
11:20 474 Effect of The Presence of Additives on Roughness Scaling Behavior of Tin Electrodeposits S. Morin (York University) and T. Jiang (Universite de Sherbrooke)
11:40 475 Low-Temperature Electrodeposition of CoxPdy Alloys in a Mixed Ligand System W. Mustain and J. Prakash (Illinois Institute of Technology)