208th ECS Meeting - Los Angeles, California

October 16 - October 21, 2005



I3 - Science, Technology, and Tools for Electrodeposition, from Lab to Factory



Tuesday, October 18, 2005

San Gabriel B, Lobby Level

Chip Metallization and Tools

Co-Chairs: J. Dukovic & A. West
TimeAbs#Title and Authors
14:00 664 Future Directions in Electrochemical Technology on Semiconductor Chips H. Deligianni (IBM)
14:40 665 Advanced Electrochemical Processes for Sub-50 nm On-chip Metallization R. N. Akolkar, V. Dubin, C. Cheng, S. Johnston, R. Chebiam and A. Fajardo (Intel Corporation)
15:20 666 Electrochemical Evolution for 45 nm-node Technology and Beyond C. Shih (AMTD/TSMC), M. Tsai, W. Shue, C. Yu and M. Liang (METD/AMTD/TSMC)
15:50 667 Direct Copper Plating on Highly Resistive Barrier Layers R. Palmans (IMEC)
16:10 Intermission (10 Minutes)
16:20 668 Advanced Waveform and Uniformity Control in the Initial Stage of Copper Electrodeposition H. Hafezi, J. Behnke, J. Dukovic (Applied Materials) and A. Rosenfeld (Applied Materials, Inc.)
16:40 669 An Innovative Technology for Copper Electroplating on Wafer Substrates T. Dretschkow, O. Worm, T. Saito and R. Preisser (Atotech Deutschland GmbH)
17:00 670 Pad Induced Surface Additive Concentration Differential in Electrochemical Mechanical Deposition B. Basol, A. Durmus, T. Wang (ASM NuTool Inc.) and R. Zhang (ASM NuTool)
17:20 671 Planarization of Copper Deposits by Electropolishing for Interconnect Applications N. Y. Kovarsky (Applied Materials Inc.), L. Zhu, A. Rosenfeld (Applied Materials, Inc.) and M. Yang (Applied Materials, Inc)
17:40 672 Copper Electrochemical Mechanical Polishing (e-CMP) Technology K. Musaka, E. Cooper, K. Namiki, M. Kumekawa and H. Deligianni (Ebara Technologies, Inc.)

Wednesday, October 19, 2005

San Gabriel B, Lobby Level

Additives and Metrology I

Co-Chairs: A. West & H. Hafezi
TimeAbs#Title and Authors
10:00 673 Additive Design for Copper Interconnect Electrodeposition C. A. Witt (Cooksonelectronics - Enthone), X. Lin, V. Paneccasio, J. Srinivasan, M. Cicoria (Enthone) and M. King (ATMI, Inc.)
10:20 674 Desorption of Polyethylene Glycol During Copper Electrodeposition: Effects of Potential and SPS K. R. Hebert and K. Ganesan (Iowa State University)
10:40 675 Superconformal Film Growth T. Moffat, T. Moffat, D. Wheeler and D. Josell (NIST)
11:00 676 MPSA Behavior Near a Copper Surface Through Molecular Simulation and Experiment C. G. Guymon, J. Harb and D. R. Wheeler (Brigham Young University)
11:20 677 A Microfluidic Device for Measuring Adsorption and Desorption Kinetics of Additives M. J. Willey and A. C. West (Columbia University)
11:40 678 Effects of Oxygen and Cuprous Ion on Copper Deposition in the Presence of PEG and MPSA D. P. Barkey (University of New Hampshire), K. Kondo (Osaka Prefecture University), T. Matsumoto (University of Okayama) and M. Pritzker (University of Waterloo)

Additives and Metrology II

Co-Chairs: H. Hafezi & A. West
TimeAbs#Title and Authors
14:40 679 Copper ECD Process of ULSI Circuits Controlled by Electroanalysis Combined with Chemometrics. Calibration Transfer A. R. Jaworski and H. Wikiel (Technic, Inc.)
15:00 680 Absorption Investigation of ViaForm Organic Additives on the Pt Microelectrode by Differential Capacitance Measurement J. Han (ATMI) and M. King (ATMI, Inc.)
15:20 681 Detection of Organic Electroactive Species in Acidic Copper Plating Baths by HPLC with an Electrochemical Detector M. Hilgarth (ATMI), M. King (ATMI, Inc.) and P. Figura (Enthone, Inc)
15:40 Intermission (20 Minutes)

Thick Film Processes

Co-Chairs: H. Hafezi & J. Dukovic
TimeAbs#Title and Authors
15:40 Intermission (20 Minutes)
16:00 682 Recent Progress in the Development of ECPR (ElectroChemical Pattern Replication) Metal Printing for Microelectronics M. Fredenberg, P. Moller (Replisaurus Technologies AB) and P. Leisner (Acreo AB)
16:20 683 New Chip-on-glass and Flip-chip Processes Using Interlocking Bump Structure Fabricated by Electrodeposition K. Lee, H. Won and T. Oh (Hongik University)
16:40 684 Formation of Copper Pillar Bumps by High Speed Copper Electroplating B. Wu (NEXX Systems Inc.), Z. Liu and A. Keigler (Nexx Systems)
17:00 685 An Economical Wafer Electroplating System for Thick Film Structures A. Keigler, Z. Liu (Nexx Systems), J. Harrell and B. Wu (NEXX Systems Inc.)
17:20 686 Electrodeposition of Copper Line Using Semi-additive Method for FCB Application J. Lee (Hongik University), S. Byun (Hongik Univerisity), S. Kang and S. Kim (LG Micron)
17:40 687 Morphology Evolution of Single Crystal Copper by Etching K. Kondo (Osaka Prefecture University), K. Hiroaki (MitsuiMCS Inc.) and H. Murakami (Osaka Prefecture University)
18:00 688 Microvia Filling by Copper Electroplating over SPS Self-Assembly Monolayer on Au and Cu Seed Layers W. Dow and M. Yen (National Yunlin University of Science & Technology)

Thursday, October 20, 2005

San Gabriel B, Lobby Level

Electroless / General

Co-Chairs: A. West & J. Dukovic
TimeAbs#Title and Authors
08:00 689 Real Time Monitoring of Electroless CoWP Deposition Process Y. Gu, M. Birang, A. Shanmugasundram, D. Lubomirsky and R. Cheboli (Applied Materials)
08:20 690 On Compensation of Copper Crystallographic Orientation Effect in CoWP Electroless Deposition I. Ivanov and A. Kolics (Blue29, LLC)
08:40 691 DMAB Oxidation for Electroless Deposition from Alkaline Solutions J. F. Rohan, B. Ahern and L. Nagle (Tyndall National Institute)
09:00 692 Electroless Deposition of Interconnected Silver Particles on Aluminum Alloyed with Copper D. A. Brevnov and T. Olson (University of New Mexico)
09:20 693 Thermal Stability and Crystallization Behavior of Electroless Ni-Ce-P and Ni-W-P Alloy Films S. B. Antonelli, T. Allen and D. Johnson (University of Oregon)
09:40 1335 Electroless Nickel and Cobalt Thin Film Barrier and Capping Layers -- Composition Effects Y. Shacham-Diamand (Waseda University), A. Shanmugasundram (Applied Materials), T. Weidman (Applied Materials Inc), M. Yoshino and T. Osaka (Waseda University)
10:00 694 Preparation of Anisotropic Conductive Particles using a Treatment as Photo-catalyst Mechanism by Electroless Ni Plating K. Tanaka, H. Inaba, I. Koiwa and H. Honma (Kanto-gakuin Surface Engineering Research Institute)
10:20 695 Magnetic Abrasive Finishing by use of Co-Ni Electroless plated Active Carbon and their Application to Post CMP Processes S. Yoshihara, Y. Zhang and T. Shinmura (utsunomiya University)
10:40 696 In Situ Stress Measurements During Electrochemical Processing G. Stafford and C. Beauchamp (NIST)
11:00 697 Mesoporous Metal Formation in Microfabricated Channels T. Momma (Waseda U.), Y. Yamauchi, H. Kitoh, K. Kuroda and T. Osaka (Waseda University)
11:20 698 The Formation Nanometer Thickness Thin Films of Compound Semiconductors and Metals Using Electrochemical Atomic Layer Epitaxy (EC-ALE) J. L. Stickney, Y. Kim (The University of Georgia), J. Kim and C. Thambidurai (The Unviversity of Georgia)
11:40 699 Reducing the Order of Current-Potential Distribution models V. R. Subramanian (Tennessee Technological University)

Magnetics and MEMS

Co-Chairs: A. West & S. Brankovic
TimeAbs#Title and Authors
14:00 700 [Fe3+] Influence on Magnetic Moment and Nano-structure Morphology of the Electrodeposited CoFe Alloys S. R. Brankovic, F. Wiatrowski and K. Trumbull (Seagate Research Center)
14:20 701 Electrodeposition of Co/Cu Multilayered Thin films and Micro-posts Y. Li, M. Moldovan, D. Young and E. J. Podlaha (Louisiana State University)
14:40 702 Appearance and Remediation of Voids in Electroplated Copper Microstructures K. Y. Sasaki and J. Medina (Western Digital Corp.)
15:00 703 Pre- and Post-Treatment for Electrodeposition of Organic Dielectric on Gold Electrodes T. Sakata, H. Ishii, Y. Okabe, N. Sato, K. Kuwabara (NTT), T. Kamei, K. Kudou, M. Yano (NTT Advanced Techmplogy Corp.) and K. Machida (NTT)
15:20 704 Metal Matrix Nanocomposites as Thin Films and Microstructures from Basic Electrolytes A. Lozano-Morales, J. Fitzgerald and E. J. Podlaha (Louisiana State University)