210th ECS Meeting - Cancun, Mexico

October 29 - November 03, 2006

PROGRAM INFORMATION
 

D2 - Corrosion of Electronic Materials and Devices

Corrosion/Electronics and Photonics
 

Tuesday, October 31, 2006

Universal Ballroom, 2nd Floor, Expo Center

Tuesday Evening Poster Session

Co-Chairs:
TimeAbs#Title and Authors
o 793 Study on a Hydrophobic Nano-TiO2 Coating and its Photo-Generated Cathodic Protection to Metals C. Lin, G. Shen, J. Li and H. Yun (Xiamen University)
o 794 Electrochemical and Surface Evaluation on Aluminum 2024 T-3 Pretreated with Metacryloxypropylmethoxysilane and Cerium Nitrate G. E. Englert (Universidade Federal do Rio Grande do Sul), D. Azambuja and S. Takeuchi (UFRGS)
 

Wednesday, November 1, 2006

Universal 15, 1st Floor, Expo Center

Corrosion Of Electronics

Co-Chairs: Luis Garfias, Robert Frankenthal, Robert Sorensen and Luis Diaz
TimeAbs#Title and Authors
08:00 Introductory Remarks (5 Minutes)
08:05 795 Modeling the Influence of the Electrolyte on the Selective Dissolution of the Least Noble Component from a Binary Alloy S. Policastro (UVA) and R. G. Kelly (University of Virginia)
08:20 796 Electrochemical Shorting Behavior of Two Copper Electrodes Under Permanent Bias in 0.5M NaCl Solution S. Jebnoun (ENSCP), E. Sutter (LGPPTS-ENSCP) and B. Tribollet (LISE-CNRS)
08:40 797 Monitoring Corrosion of Electronic Material and Devices Due to Ionic Contamination B. J. Newton (dionex corporation)
09:00 798 Corrosion Resistance of Copper Coated Contacts M. Reid, J. Punch (University of Limerick), G. Grace (Molex) and L. Garfias (S.C. Johnson & Son, Inc,)
09:20 799 The Investigation of Au/Pd-Ni/Ni Plating for Electrical Contacts O. Hiramoto (Sony Corporation)
09:40 Intermission (20 Minutes)
10:00 800 Corrosion and Environmental Effects on Electronic Systems R. Ambat, P. Møller and P. Westermann (Technical University of Denmark)
10:20 801 Accelerated Atmospheric Corrosion of Various Metals and Devices Using the Mixed Flowing Gas Chamber K. L. Shannon (Southwest Research Institute) and L. Garfias (S.C. Johnson & Son, Inc,)
10:40 802 Biased Mixed Flowing Gas Testing for World Class Reliability G. E. Derkits, J. Franey, W. Reents and D. Fleming (Lucent Technologies)
11:00 803 Ionic Migration in Soldered Joints of a Printed Circuit Board M. A. Neri, C. Carreño and A. Martinez_Villafañe (CIMAV)
11:20 804 Corrosion Products Formed on Silver and Copper Plates Exposed in a Volcanic Area M. Watanabe, T. Handa (Nippon Telegraph and Telephone East Corporation), T. Ichino (Nippon Telegraph and Telephone Corporation) and N. Kuwaki (Nippon Telegraph and Telephone East Corporation)
11:40 805 Evaluation of Silver Corrosion Behavior in Sulfur Gas Released from Rubber R. Minamitani (Hitachi, Ltd.)
12:00 Intermission (60 Minutes)
13:00 Intermission (60 Minutes)
14:00 806 Comparative Study of Breakdown Phenomena between Al/PEDT and Ta/PEDT Capacitor K. Ueno, L. Dominey (Chemi-Con Materials Corp.) and R. Alwitt (Boundary Technologies, Inc.)
14:20 807 A Corrosion Sensor for Integrated State-of-Health Evaluation R. Sorensen and J. Stamps (Sandia National Labs)
14:40 808 Hexavalent Chromium-Free Pre-Treatment for Galvanized Steel L. A. Hernández and L. S. Hernández (Institute of Metallurgy, UASLP)
15:00 809 Study of Cerium Salts Concentration on AISI 1018 Commercial Steel as an Alternative in the Chemical Conversion Treatments F. J. Rodríguez (Universidad Nacional Autonoma Mexico, UNAM), E. Onofre (UNAM), M. A. Domínguez (IPN), A. Olvera and J. Genescá (UNAM)
15:20 810 Kinetics of Growth and Properties of Anodic Antimonium Oxide Films M. Lopez Teijelo and O. Linarez Perez (Facultad de Ciencias Químicas, Universidad Nacional de Cordoba)
15:40 811 Ensuring High Reliability on S.C. Johnson Electrical Devices J. Murillo (S.C. Johnson)
16:00 Discussion (30 Minutes)