210th ECS Meeting - Cancun, Mexico

October 29 - November 03, 2006

PROGRAM INFORMATION

 

F1 - Electrochemical Deposition onto Non-Metallic Surfaces

Electrodeposition

 

Tuesday, October 31, 2006

Star 4, 2nd Floor, Sunrise

Carbon-based electrodes and surface layers

Co-Chairs: K. Strubbe and P.C. Searson
TimeAbs#Title and Authors
08:15 Introductory Remarks (5 Minutes)
08:20 1607 Charge Transfer Stage during Potentiostatic Formation of Zinc Nuclei on Carbon Electrode from Zincate Solution Y. Kryshtop (Dnipropetrovsk National University) and V. Trofimenko (Dniepropetrovsk National University)
08:40 1608 Pulsed-Electrodeposition of Platinum: Deposit Morphology, Current Efficiency, and Activity towards Methanol Oxidation T. D. Hall, A. Miller and D. Hill (University of Notre Dame)
09:00 1609 Towards a Nano-Scale Electrochemical and Spectroscopic Characterization of Organic Layers on Oxide Surfaces A. Hubin, T. Hauffman, O. Blajiev (Vrije Universiteit Brussel), J. Snauwaert, C. Van Haesendonck (Katholieke Universiteit Leuven) and H. Terryn (Vrije Universiteit Brussel)
09:20 1610 Charge and Interface Traps in 1-Octadecene Monolayers on Silicon as a Function of Silicon Pretreatment and Deposition Regime I. V. Antonova (Institute of Semiconductor Physics), R. Soots, V. Seleznev and V. Prinz (Institute of Semiconductor Physics, Novosibirsk, Russia)
09:40 Intermission (20 Minutes)
 

Metallization of semiconductor surfaces

Co-Chairs: G. Oskam and P.M. Vereecken
TimeAbs#Title and Authors
10:00 1611 Electrodeposition of Fe on n-Type GaAs and GaAlAs G. Zangari, W. Shao, G. Pattanaik (University of Virginia), S. Vutukuri and R. Shad (University of Alabama)
10:20 1612 Electrochemical Behavior of (100) Germanium in Copper (II) Containing Solutions K. Strubbe and I. Huygens (Ghent University)
10:40 1613 Electrochemical Deposition of Manganese and Copper-Manganese Alloy on Silicon A. Radisic and P. M. Vereecken (IMEC vzw)
11:00 1614 Electroless Displacement Deposition of Metals onto n-Type Silicon Surface S. Yae, N. Nasu, T. Matsuda, N. Fukumuro and H. Matsuda (University of Hyogo)
11:20 1615 Electrodeposited Extended and Laterally Confined Metal / n - Si (111) Contacts W. Schindler and P. Hugelmann (TUM)
11:40 1616 Electrodeposition of Copper-Silver Alloys on n-Si (100) from Acidic Sulfate Solution W. Shao, G. Pattanaik and G. Zangari (University of Virginia)
 

Electrosynthesis of semiconductor and oxide materials

Co-Chairs: P.C. Searon and G. Oskam
TimeAbs#Title and Authors
14:00 1617 Electrodeposition into TiO2 Nanotubes P. Schmuki and P. Schmuki (University of Erlangen)
14:40 1618 Formation of Porous Alumina Patterns on Silicon P. M. Vereecken (IMEC vzw) and F. Jansen (KUL)
15:00 1619 A Study of the Effect of Different Cadmium Sources on Chemical Bath Deposited CdS Thin Films L. Chow, H. Khallaf (University of Central Florida) and I. Oladeji (ATMEL, North Tyniside Ltd.)
15:20 1620 Electrosynthesized Oxide Semiconductors for Photoelectrochemical Applications K. Rajeshwar, R. Chenthamarakshan, N. de Tacconi, G. Yogeeswaran and A. Seshadri (The University of Texas at Arlington)
15:40 Intermission (20 Minutes)
 

Metallization of insulator materials

Co-Chairs: A. Vervaet and P.M. Vereecken
TimeAbs#Title and Authors
16:00 1621 Metallizing Polyetherimide Resin Reinforced with Glass Fibers M. A. Alodan (KSU)
16:20 1622 Metallization of Spherical Polystyrene Particles S. Djokic (Elchem Consulting Ltd.)
16:40 1623 Electroless Metallization and Characterization of Oxide Particles E. E. Kalu (FAMU-FSU COE), C. Davy (Florida State University) and P. Kalu (FAMU-FSU COE)
17:00 1624 Study of the Failure Mechanism of the Cu/Epoxy Interface After Modifications by Means of Surface Chemical Reactions A. A. Vervaet (Ugent) and S. Siau (Arcelor)
 

Universal Ballroom, 2nd Floor, Expo Center

Tuesday Evening Poster Session

Co-Chairs: P.M. Vereecken, P.C. Searson, K. Strubbe and G. Oskam
TimeAbs#Title and Authors
o 1625 Prussian Blue: Electrochemical Behavior and Operational Stability N. Shams, B. Haghighi and A. Rahmati (Institute for Advanced Studies in Basic Sciences)
o 1626 Role of the Nanoparticules of TiO2 on Making of Films of NiB Deposited by the Dynamic Chemical Plating Method G. Stremsdoerfer, H. Omidvar (Ecole Centrale de Lyon) and Y. Meas (Centro de Investigacion y Desarrollo Tecnologico en electroquimica)
o 1627 Electrochemical Nucleation of Zinc onto Glassy Carbon M. Plata (Instituto Politécnico Nacional), S. Olvera, C. Ramírez, A. Ezeta, H. Dorantes and E. M. Arce (IPN)
o 1628 Computing Current Density Distribution for Plating on Plastic Parts Using Computer Simulation K. Lee (Korea Institute of Machinery & Materials), J. Lee (Changwon National Univ), C. Woo (Dae Lyuk Industries. Co.) and W. Che (Tongmyung Univ.)
o 1629 Enhanced Performance of Dye-Sensitized TiO2 Solar Cells with Electrodeposited Platinum Counter Electrodes C. Yoon (Korea University), W. Che (Daejin University) and K. Kim (Korea University)
o 1630 Electrochemical Deposition of Ruthenium on Carbon Paste Electrodes (CPE) O. Martinez Alvarez (research center of energy CIE-UNAM) and M. Miranda Hernández (CIE-UNAM)
o 1631 Electrodeposition of Indium onto Mo/Cu for Deposition of Cu(In,Ga)Se2 Thin Films R. Castañeda, M. Miranda, A. Ocampo and S. Joseph (Centro de Investigación en Energía)
o 1632 Preparation of the Ru/Pt/C Nanocatalyst by Rotating Disk-Electrode (RoDSE) Technique D. Santiago and C. R. Cabrera (University of Puerto Rico, Rio Piedras Campus)
o 1633 Selective Electroless Deposition Using Photoinduced Oxidation of Sn(II) Compounds on Surface-Modified Polyimide Layers K. Song, J. Kim, T. Byk, S. Cho, C. Noh, J. Kim (Samsung Advanced Institute of Technology) and T. Gaevskaya (Belarussian State University)