213th ECS Meeting - Phoenix, AZ

May 18 - May 22, 2008

PROGRAM INFORMATION
 

E4 - Plasma Processing 17

Dielectric Science and Technology/Electronics and Photonics
 

Tuesday, May 20, 2008

Room 104B, 100 Level, Phoenix Convention Center

Diagnostics and Measurements

Co-Chair(s): G. Mathad and M. Engelhardt
TimeAbs#Title and Authors
09:00   740   In-Situ Measurement of the Relative Thermal Contributions of Chemical Reactions and Ions During Plasma Etching M. R. Tesauro (Qimonda Dresden GmbH & Co. OHG) and G. Roche (KLA-Tencor, SensArray Division)
09:20   741   Noninvasive Monitoring of Ion Current and Ion Energy during Plasma Processing M. A. Sobolewski (National Institute of Standards and Technology)
09:40 Intermission (20 Minutes)
10:00   742   In-situ Spatial Analysis of RF Voltage during Plasma Etching. A. P. Milenin, J. De Marneffe and H. Struyf (IMEC)
10:20   743   In-situ Surface Recombination Measurement of Oxygen and Chlorine Atoms on Dynamic Stainless Steel Surfaces in Inductively Coupled O2 and Cl2 Plasmas L. Stafford (Universite de Montreal), J. Guha and V. Donnelly (University of Houston)
10:40   744   Damage-free Pattern Transfer by Low Energy Electron Enhanced Etching (LE4): Mechanisms and Applications H. Gillis, S. Anz and M. Demine (Systine Inc.)
11:20   745   Effects of Photon Irradiation during Plasma Etching Processes for Low-k films B. Jinnai and S. Samukawa (Tohoku University)
 

Etching and Deposition

Co-Chair(s): D. Hess and G. Mathad
TimeAbs#Title and Authors
14:00   746   Etching Requirements for 32 nm and Below: The Best of Times, the Worst of Times R. A. Gottscho (Lam Research Corporation)
14:40   747   Challenges of High Aspect Ratio Oxide Etching D. Koehler and D. Fischer (Qimonda AG)
15:00   748   Ultimate Top-down Etching Processes for Future Nanoscale Devices S. Samukawa (Tohoku University)
15:40 Intermission (20 Minutes)
16:00   749   Grain Size Effects on Plasma-Based Copper Etch Process and Electromigration of Etched Copper Lines G. Liu and Y. Kuo (Texas A&M University)
16:20   750   Control of the Electrical and Optical Properties of Plasma Polymerized Fluorocarbon Films H. Kwon, S. Mahapatra, B. Park (Ajou University), S. Woo (Eugene Technology) and C. Kim (Ajou University)
16:40   751   Organic Offset Deposition by Innovative Plasma Technology: Channel Length Modulation for NOR Flash Memories F. Zanderigo, D. Piumi (STMicroelectronics), M. Boccardi, H. Zhu (Lam Research), T. Ghilardi, P. Scintu (STMicroelectronics), R. Sadjadi and A. Romano (Lam Research)
17:00   752   Invetigations of Ultrathin Ru/WCN Mixed Phase Films for Diffusion Barrier and Copper Direct-Plate Applications D. V. Greenslit, S. Kumar, T. Chakraborty and E. Eisenbraun (University at Albany)
 

Hall 2, Lower Level, Phoenix Convention Center

Poster Session

TimeAbs#Title and Authors
o   753   Cylinder Materials of Construction for Ultra-High Purity HBr in Advanced Semiconductor Etch Processes A. J. Seymour, C. Wyse, J. Yao, M. Raynor and R. Torres (Matheson Tri-Gas)