214th ECS Meeting - Honolulu, HI |
October 12 - October 17, 2008 |
PROGRAM INFORMATION |
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F3 - Green Electrodeposition |
Electrodeposition |
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Wednesday, October 15, 2008 |
Coral Exhibit Hall, Mid-Pacific Conference Center, Hilton Hawaiian Village |
Poster Session |
| Co-Chair(s): S. Roy and K, Ryder |
| Time | Abs# | Title and Authors |
| o |
2528
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Study on an Environmental-friendly Method to Colorize Green Film on Stainless Steel
M. Li (Sichuan University of Science and Engineering), Y. Luo and S. Zhang (Sichuan University of Science ang Engineering)
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| o |
2529
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Electrochemical Synthesis and Structural Study of Bi-Tm-Ni-Fe-Co-Mn High Entropy Alloy Film
C. Yao, P. Zhang, X. He, G. Li, P. Liu and Y. Tong (MOE of Key Laboratory of Bioinorganic and Synthetic Chemistry)
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| o |
2530
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Galvanic Contact Deposition of UV Light-Emitting ZnO Nanopillar Arrays
T. Shinagawa (OMTRI), K. Murase (Kyoto University) and M. Izaki (Toyohashi University of Technology)
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| o |
2531
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ZnO Nano-Cauliflower Array Dye-Sensitized Solar Cells
I. Yamaguchi (Doshisha University), M. Watanabe, T. Shinagawa, M. Chigane (OMTRI), M. Inaba, A. Tasaka (Doshisha University) and M. Izaki (Toyohashi University of Technology)
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| o |
2532
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Recovery of Tin from Waste Solution : The Influence of Temperature, Time and Current Density
E. Ko (Dongbu Steel), C. Hong (Dongbu-steel company), Y. Song (Production Management Team), K. Lee and Y. Lee (Technical Research Laboratories)
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| o |
2533
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The Development of Environmentally-friendly Black Anti-fingerprinted Electrolytic Galvanized Steel Sheets with Excellent Thermal Absorption and Irradiation Properties
C. Hong (Dongbu-steel company), E. Ko (Dongbu Steel), J. Ju (Dongbu-steel company) and Y. Lee (Technical Research Laboratories)
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| o |
2534
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Effects of Additives in Ru Electroless Plating Formulation
J. Chen (National Chiao Tung University), P. Wu (National Chiao-Tung University) and Y. Lu (National Chiao Tung University)
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Thursday, October 16, 2008 |
Sea Pearl 5 & 6; Mid-Pacific Conference Center, Hilton Hawaiian Village |
Green Processes and Materials Technology |
| Co-Chair(s): G. Zangari |
| Time | Abs# | Title and Authors |
| 09:00 |
2535
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A Novel Process for Etching Modulated Profiles
R. Sporer, U. Landau (Case Western Reserve University), H. Kuo (GM R&D Center) and Y. Wang (General Motors)
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| 09:20 |
2536
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Electrodeposition of Iron in Aqueous Alkaline Solution: An Alternative to Carbothermic Reduction
B. Yuan (Norwegian University of Science and Technology (NTNU)), O. Kongstein (SINTEF) and G. Haarberg (Norwegian University of Science and Technology (NTNU))
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| 09:40 |
2537
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Effect of PEG molecular weight on Bottom-up Filling of Copper Electrodeposition for PCB
Z. Wang, L. Yin, Z. Liu, Z. Yang (Shaanxi Normal University) and S. Shingubara (Kansai University, Osaka, Japan)
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| 10:00 |
2538
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Surface Metallization on Liquid Crystalline Polymer Film by Means of UV Irradiation Reforming Process
T. Sugiyama, Y. Iimori, K. Inoue (Kanto Gakuin University), M. Watanabe (Kanto Gakuin University Surface Engineering Research Institute) and H. Honma (Faculty of Engineering, Kanto Gakuin University)
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| 10:20 |
2539
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Low Temperature Electrolysis of Aluminum as a Possible Green Technology for Aluminum Production
Y. Zaikov, N. Shurov, A. Apisarov, A. A. Redkin, V. Batukhtin (Institute of High Temperature Electrochemistry) and V. Kryukovsky (Basic Element)
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| 10:40 |
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Intermission (20 Minutes)
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| 11:00 |
2540
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Electroless Ni-P Deposition on AZ91D Magnesium Alloy Prepared by Molybdate Chemical Conversion Coatings
H. H. Elsentriecy and K. Azumi (Hokkaido University)
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| 11:20 |
2541
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Sustainable Relief of the Environment by Increased Durability of Gradient Wear Protection Layers
K. Romankiewicz and M. Metzner (Fraunhofer Institute Manufacturing Engineering and Automation)
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| 11:40 |
2542
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Cu-In-Ga-Se Based Solar Cells from Solution-Based Precursor Layers
R. N. Bhattacharya (National Renewable Energy Laboratory)
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Green Materials and Chemistry |
| Co-Chair(s): S. Yoshihara |
| Time | Abs# | Title and Authors |
| 14:00 |
2543
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Electrolytic Metal Coatings and Metal Finishing Using Ionic Liquids
K. S. Ryder and A. Abbott (University of Leicester)
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| 14:40 |
2544
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Copper Alloy Metallization through Reduction-Diffusion Method Using Medium-Low Temperature Ionic Liquid Baths
K. Murase, A. Ito, Y. Nishizaki, T. Ichii and H. Sugimura (Kyoto University)
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| 15:00 |
2545
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In Situ Corrosion-Resistance Evaluation of Ni-P Anode Electrode for Water Electrolysis
D. Suzuki (Vantec Co., Ltd.), Y. Chikugo (Graduate School of Engineering Utsunomiya University), S. Yoshihara (Utsunomiya University) and N. Kudo (Vantec Co.,Ltd.)
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| 15:20 |
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Intermission (20 Minutes)
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| 15:40 |
2546
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The Wear Resistance of as-plated and Flame-hardened Cr-C Deposits Electroplated in a Trivalent-Chromium Based Bath
C. Chuang, Y. Lieu (Chang Gung University), F. Hsu (Ming Chi University of Technology) and C. Huang (Chang Gung University)
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| 16:00 |
2547
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The Electrochemical Corrosion Behavior of Cr-Ni Deposit Electroplated in a Bath Containing Trivalent Chromium and Divalent Nickel Ions
C. Lin, C. Chen and C. Huang (Chang Gung University)
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| 16:20 |
2548
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Modification of Titania Nanotubes for Photoelectrochemical Devices Applications
E. Verardi (Dipartimento Progettazione e Tecnologie, Universita di Bergamo), L. Wu (University of Virginia), M. Villa (Universita' di Bergamo), N. Swami and G. Zangari (University of Virginia)
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| 16:40 |
2549
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Magnetic Force-Based Microarray Chip for Medical Care Prepared by Plating Method
I. Koiwa, M. Fukuda, T. Sano, Y. Haijima (Kanto Gakuin University) and T. Obata (The Central Institute, Toyama Industrial Technology Center)
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Friday, October 17, 2008 |
Sea Pearl 5 & 6; Mid-Pacific Conference Center, Hilton Hawaiian Village |
Green Deposition and Reclamation Processes |
| Co-Chair(s): K. Ryder |
| Time | Abs# | Title and Authors |
| 09:00 |
2550
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Electrochemical Gold Deposition from Non-Toxic Electrolytes
S. Roy (Newcastle University)
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| 09:20 |
2551
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Production of Tin-Silver Eutectic by Electrocodeposition of Silver Nano-Particles in a Tin Plating Solution
D. Barkey (University of New Hampshire)
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| 09:40 |
2552
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Electroless Gold Deposition using Novel Cyanide-free Bath Composition
O. Sadik and S. Kikandi (SUNY-Binghamton)
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| 10:00 |
2553
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Direct Electroplating of Copper on AZ31 Magnesium Alloy in Pyrophosphate Electrolyte
J. Lee, Y. Kim, J. Kim, Y. Ahn and W. Chung (Pusan National University)
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| 10:20 |
2554
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Possibility for the Deposit of Chromium Layers from Trivalent Chrome Electrolytes
K. Romankiewicz and J. Bohnet (Fraunhofer Institute Manufacturing Engineering and Automation)
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| 10:40 |
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Intermission (20 Minutes)
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| 11:00 |
2555
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Electrochemical Copper Recovery from Tin-Strip Solution : Kinetic Effects
S. Roy and R. Buckle (Newcastle University)
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| 11:20 |
2556
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Electrorecovery of Actinides at Room Temperature
D. Costa, M. Stoll and W. Oldham (Los Alamos National Laboratory)
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| 11:40 |
2557
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Photocatalytic Film Prepared by Electrophoretic Sol-Gel Deposition - Challenges for the Visible Light Activity
S. Yoshihara (Utsunomiya University)
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