214th ECS Meeting - Honolulu, HI

October 12 - October 17, 2008

PROGRAM INFORMATION
 

F5 - Molecular Structure of the Solid-Liquid Interface and its Relationship to Electrodeposition 6

Electrodeposition
 

Tuesday, October 14, 2008

South Pacific 1; Mid-Pacific Conference Center, Hilton Hawaiian Village

Co-Chair(s): D. Kolb and T. Homma
TimeAbs#Title and Authors
08:00 Introductory Remarks (5 Minutes)
08:05   2609   Self-Assembled Monolayers and Networks as Templates to Control Electrochemical Metal Deposition M. Buck (University of St Andrews)
08:40   2610   Electrochemical Deposition of Metallic Nanowires into ALD-modified Nanoporous Templates M. Motoyama, N. P. Dasgupta and F. B. Prinz (Stanford University)
09:00   2611   Electrodeposition of Materials by ALD J. L. Stickney, D. Banga, N. Jayaraju and L. Sheridan (The University of Georgia)
09:20   2612   In Situ Electrochemical STM Characterizations of Surfactant DDAPS adsorbed on Au(111) Surface S. Xu (Lanzhou Institute of Chemical Physics of Chinese Academy of Sciences) and J. Lipkowski (University of Guelph)
09:40 Intermission (20 Minutes)
10:00   2613   Electrochemical and in situ SERS Studies on Adsorption of 2-hydroxypyridine and Polyethleneimine during Silver Electroplating Z. Lin (MOE Key Laboratory of Analysis and Detection Technology for Food Safety, Department of Chemistry, Fuzhou University), J. Tian (Department of Chemistry and State Key Laboratory of Physical Chemistry of Solid Surfaces, Xiamen University), B. Xie (MOE Key Laboratory of Analysis and Detection Technology for Food Safety, Department of Chemistry, Fuzhou University), Y. Tang (Department of Chemistry and State Key Laboratory of Physical Chemistry of Solid Surfaces, Xiamen University), J. Sun (MOE Key Laboratory of Analysis and Detection Technology for Food Safety), G. Chen (MOE Key Laboratory of Analysis and Detection Technology for Food Safety, Department of Chemistry, Fuzhou University), B. Ren (State Key Laboratory of Physical Chemistry of Solid Surfaces and Department of Chemistry, Xiamen University) and Z. Tian (State Key Laboratory of Physical Chemistry of Solid Surfaces)
10:20   2614   The Metallization of Aliphatic and Aromatic SAMs F. Eberle, M. Kayser, D. M. Kolb, M. Manolova (University of Ulm), H. Boyen (University of Hasselt) and P. Ziemann (University of Ulm)
10:40   2615   In Situ X-ray Diffraction Study of the Electrodeposition of Copper on UHV Prepared GaAs(001) Surfaces Y. Gruender (ESRF), T. Lee (Diamond Light source), F. Renner (MPI fuer Eisenforschung), B. Fimland (Norwegian University of Science and Technology), D. M. Kolb (University of Ulm) and J. Zegenhagen (ESRF)
11:00   2616   Electrodeposition of Si-Ge alloy and of Si and Ge Nanowires from an Ionic Liquid F. Endres, R. Al Salman and S. Zein El Abedin (Institute of Particle Technology)
11:40   2617   Molecular Mechanism of Si Reduction in Ionic Liquids: a Combined Experimental and Molecular Simulations Study C. R. Miranda (Kyoto University), Y. Nishimura, T. Nishida (Graduate School of Energy Science, Kyoto University) and Y. Fukunaka (Kyoto University)
 
Co-Chair(s): R. Alkire and Y. Fukunaka
TimeAbs#Title and Authors
14:00   2618   Correspondence between Experiment and Theory of Bulk Electrocrystallisation at Solid Electrodes in Aqueous Electrolyte J. E. Andersen (Technical University of Denmark)
14:20   2619   Kinetics and Mechanism of Growth of Disk-shaped, Single Crystal Cu Islands L. Guo and P. Searson (Johns Hopkins University)
14:40   2620   Simulation of Additive Effects on Nucleation and Growth during Electrodeposition onto Patterned Substrates R. Stephens and R. C. Alkire (University of Illinois)
15:00   2621   Deposition of Copper Films on Aluminum Using a Surface Hydride Precursor J. Ai, S. Liu, S. Adhikari and K. Hebert (Iowa State University)
15:20 Intermission (20 Minutes)
15:40   2622   In-Situ Stress Measurements of Electrodeposited Au-Ni Films E. Rouya (University of Virginia), G. R. Stafford, C. Beauchamp, E. Sandnes (NIST) and G. Zangari (University of Virginia)
16:00   2623   Numerical Simulation of Double Layer Effects at Conical Glass Nanopore Electrodes A. Bund (Technische Universitaet Dresden), H. White (University of Utah) and C. Kubeil (Technische Universitaet Dresden)
16:20   2624   The Electrocapillarity Response of Cu(111) Electrodes to Changes in Equilibrium Adatom Population C. Friesen (Arizona State University)
16:40   2625   I Adsorption and CuI Growth on Cu(111) Electrodes - an In situ Surface X-ray Diffraction Study D. Friebel, J. Stålgren, R. Yang (Stanford Linear Accelerator center), M. Toney (SLAC), C. Schlaup and K. Wandelt (University of Bonn)
 

Coral Exhibit Hall, Mid-Pacific Conference Center, Hilton Hawaiian Village

Molecular Structure of the Solid-Liquid Interface and its Relationship to Electrodeposition

TimeAbs#Title and Authors
o   2626   One-Step Through-Mask Electrodeposition of a Porous Structure Composed of Manganese Oxide Nanosheets M. Nakayama and M. Fukuda (Yamaguchi University)
o   2627   The Effect of Substrate Shape and Temperature on the Liquid Cluster Deposition using Molecular Dynamic Simulation S. Go, H. Jeong (Pusan National University), S. Masahiko (Department of Mechanical Engineering, Osaka University), G. Choi and D. Kim (Busan national university)
o   2628   Underpotential Deposition of Bi on Au(111) in BMIBF4 Ionic Liquid: An In-Situ STM Study Y. Fu, Y. Su, D. Wu, J. Yan and B. Mao (State Key Laboratory of Physical Chemistry of Solid Surfaces, College of Chemistry and Chemical Engineering, Xiamen University)
o   2629   Non Reactive Versus Reactive Adsorption of Viologens: an EC-STM Approach D. Phan, C. Schlaup, K. Wandelt (University of Bonn) and P. Broekmann (BASF SE, Development Electronic Materials Europe, Ludwigshafen, Germany)
o   2630   Immobilization of Cationic Porphyrin between Multilayers of Manganese Oxide during Their Electrochemical Assembly R. Hoyashita and M. Nakayama (Yamaguchi University)
o   2631   Formation and Reaction of Pyridinethiolate Self-Assembled Monolayers on Au/Si Surface in Aromatic and Aliphatic Ionic Liquids Studied by SEIRAS K. Nishiyama, H. Seriu and I. Taniguchi (Kumamoto University)
o   2632   In Situ STM Study of an Ultrathin Copper Sulfide Film on Au(100) in Alkaline Solution C. Schlaup and K. Wandelt (University of Bonn)
 

Wednesday, October 15, 2008

South Pacific 1; Mid-Pacific Conference Center, Hilton Hawaiian Village

Co-Chair(s): Y. Fukunaka and T. Homma
TimeAbs#Title and Authors
08:00   2633   Structural Change in 4-Pyridineethanethiolate Self-Assembled Monolayers on Au(111) Induced by Protonation of Pyridine Ring in Electrolyte Solutions K. Nishiyama, M. Tsuchiyama, H. Seriu, S. Yoshimoto and I. Taniguchi (Kumamoto University)
08:40   2634   Supramolecular Nanostructure of Porphyrin Diacid on Sulfate/Bisulfate Adlayer Formed on Au(111) S. Yoshimoto (Kumamoto University) and T. Sawaguchi (National Institute of Advanced Industrial Science and Technology)
09:00   2635   Molecular Simulation Approach to the Effects of Additives in Electrodeposition Y. Kaneko, S. Nishimura (Kyoto University), Y. Hiwatari (Toyota Physical and Chemical Research Institute), K. Ohara and F. Asa (C. Uyemura & Co., Ltd.)
09:20   2636   Mathematical Modeling of ZnO Precipitation for Solid-Solution Properties J. Drake (Procter & Gamble)
09:40 Intermission (20 Minutes)
10:00   2637   Depositing Mechanism of Metal Oxide Thin Film in the Liquid Phase Deposition Process S. Deki, M. Takagi, D. Cho and M. Mizuhata (Kobe University)
10:20   2638   On Numerical Simulation of Electrochemical Processes in Thin Layer Cells C. Kubeil (Technische Universitaet Dresden), M. Mirkin (Queens College - CUNY), H. White (University of Utah) and A. Bund (Technische Universitaet Dresden)
10:40   2639   Ultrathin Copper Sulfide Films at the Au(111)/electrolyte Interface Studied with EC-STM D. Friebel (Stanford Linear Accelerator Center), C. Schlaup and K. Wandelt (University of Bonn)
11:00   2640   Preparation of Microporous Copper Foam with 3-Dimensionally Interconnected Pores by Electrodeposition J. Kim, R. Kim and H. Kwon (Korea Advanced Institute of Science and Technology)
11:20   2641   Effect of Ionic Mass Transfer Rate on Morphological Variation of Li Metal Electrodeposition T. Mori, K. Nakanishi (Kyoto University), T. Nishida (Graduate School of Energy Science), K. Nishikawa (Laboratoire de Physique de la MatiereCondensee), T. Inaba (Toyota Central R&D Labs., Inc.) and Y. Fukunaka (Kyoto University)
11:40   2642   Optimum Plating Entry Conditions for Void Free Dual Damascene Copper Electrofill S. S. Boyapati (Spansion Inc.)
 

Electrodeposition Division 2008 Research Award

Co-Chair(s): D. Kolb and R. Alkire
TimeAbs#Title and Authors
14:00 Introductory Remarks (10 Minutes)
14:10   2643   Elementary Processes in Electrodeposition: An In Situ Atomic-scale View O. Magnussen (University Kiel)
15:00   2644   A Combined Electrochemical and XPS Study of Cu and Bi UPD on Different Substrates K. Thiel (Freie Universität Berlin), M. Hintze (FU Berlin), A. Vollmer (BESSY) and C. Donner (FU Berlin)
15:20   2645   Underpotential Deposition of Co and Ni on Pt: A Voltammetric and STM Study L. Ou Yang and T. Moffat (NIST)
15:40 Intermission (20 Minutes)
16:00   2646   Mathematical Modeling of ZnO Precipitation -- Homogenous Nucleation to Growth J. Drake (Procter & Gamble)
16:20   2647   ECSTM Studies of Electrochemical AuxS Compound Formation on Au(111) and Au(100) Surfaces C. Schlaup (University of Bonn), D. Friebel (Stanford Synchrotron Radiation Laboratory) and K. Wandelt (University of Bonn)
16:40   2648   Electrochemical Engineering Modelling of the Electro-Deposition Process at a Vertical Electrode from the Continuous Scale to the Micron Scale with or without Gravity P. P. Mandin (Ecole Nationale Superieure de Chimie de Paris), H. Matsushima (Kiel University), J. Cense (Ecole Nationale Superieure de Chimie de Paris) and Y. Fukunaka (Kyoto University)