217th ECS Meeting - Vancouver, Canada

April 25 - April 30, 2010

PROGRAM INFORMATION
 

F2 - Electrochemical Engineering for the 21st Century (dedicated to Richard C. Alkire)

Electrodeposition/Industrial Electrochemistry and Electrochemical Engineering/Corrosion/Energy Technology
 

Monday, April 26, 2010

Georgia B, 2nd Floor, Hyatt

Multiscale Modeling

Co-Chairs: Venkat Subramanian and Linda Petzold
TimeAbs#Title and Authors
08:00   1240   Water Transport in the Ionomer-Phase and Across Its Interfaces in Catalyst Coated Membranes for Proton Exchange Membrane Fuel Cells V. Gurau and J. Mann (Case Western Reserve University)
08:20   1241   Surface Morphology of Lithium Metal Anodes M. Karulkar and J. Adams (Ford Motor Company)
08:40   1242   Continuum and Multiscale Modeling of Performance Curves and Capacity Fade in Lithium-Ion Batteries V. Subramanian, V. Ramadesigan, R. N. Methekar (Washington University), K. Chen and R. Braatz (University of Illinois at Urbana-Champaign)
09:00   1243   Formation of Localized Corrosion-Relevant Surface Defects on Aluminum: Experimental Studies and Kinetic Monte Carlo Simulation K. Hebert, G. Zhang, J. Ai (Iowa State University) and G. Stafford (National Institute of Standards and Technology)
09:20   1244   Simulation of Three-Dimensional Solid-by-Solid Model and Application to Electrochemical Engineering Y. Kaneko (Kyoto University), Y. Hiwatari (Toyota Physical and Chemical Research Institute), K. Ohara and F. Asa (C. Uyemura & Co., Ltd.)
09:40 Intermission (20 Minutes)
10:00   1245   (Keynote) Electrochemical Engineering: The Need for Next-Generation Methods R. Alkire (University of Illinois)
10:40   1246   (Keynote) An Algorithm for Simulation of Electrochemical Systems with Surface-Bulk Coupling Strategies M. Buoni (Los Alamos National Laboratory) and L. Petzold (University of California Santa Barbara)
11:20   1247   Characteristic Timescales in Multiscale Feature Metallization J. D. Adolf and U. Landau (Case Western Reserve University)
11:40   1248   Adsorptive SPS Dissociation Within the c(2x2)-Cl Matrix on Cu(100) under Reactive Conditions: A Combined In Situ STM and DFT Study N. T. Hai (University of Bern), W. Reckien (University of Bonn), A. Fluegel, M. Hahn, A. Wagner, D. Mayer (BASF SE), T. Bredow (University of Bonn) and P. Broekmann (University of Bern)
 

Electrochemical Systems-Molecular/Nano

Co-Chairs: John Harb and Daniel Schwartz
TimeAbs#Title and Authors
14:00   1249   (Keynote) The Metallization of SAMs: Molecular Double Deckers F. Eberle, M. Manolova, D. M. Kolb (University of Ulm), H. Boyen and M. Saitner (Hasselt University)
14:40   1250   Metallization of DNA Origami Templates for the Fabrication of Nanoelectronic Circuits J. Harb (Brigham Young University), J. Liu (Brighan Young University), Y. Geng, E. Pound, J. Ashton, S. Gyawali and A. Woolley (Brigham Young University)
15:00   1251   Combined Electrochemical and In Situ STM Studies on the Redox-Activity of Leveler Additives A. Fluegel (BASF SE), N. T. Hai (University of Bern), M. Hahn, A. Wagner, D. Mayer (BASF SE) and P. Broekmann (University of Bern)
15:20   1252   Nanomanufacturing by Orchestrated Structure Evolution S. Kitayaporn, S. Abbasi, K. Böhringer and D. Schwartz (University of Washington)
15:40   1253   Nanosheet Formation by Electrodeposition and Its Application to Miniaturized Reference Electrodes S. Safari-Mohsenabad (McMaster University), P. R. Selvaganapathy (McMaster Unversity), A. Derardja (University of Batna) and M. J. Deen (McMaster University)
16:00   1254   Creating Metallic Conductivity in TiO2 Nanotubes R. Hahn and P. Schmuki (University of Erlangen)
16:20   1255   Density Functional Theory Study on the Oxidation Reactivity of Hypophosphite Ion as a Reductant for Electroless Deposition Process M. Kunimoto, H. Nakai and T. Homma (Waseda University)
 

Tuesday, April 27, 2010

Georgia B, 2nd Floor, Hyatt

Electrochemical Systems-Fundamental

Co-Chairs: Kurt Hebert and Stanko Brankovic
TimeAbs#Title and Authors
08:20   1256   Wet Etching Process on Semiconductors: A Typical Electrochemical Engineering Challenge A. Causier, M. Bouttemy, I. Gérard and A. Etcheberry (Institut Lavoisier UMR CNRS 8180)
08:40   1257   Simulation of Cu Surface Morphology Evolution during Electropolishing J. Thomas and S. R. Brankovic (University of Houston)
09:00   1258   Porosity of Electrodeposited Cobalt Hard Gold: Effects of Reversed Pulse Current Z. Liu (Columbia University), M. Zheng, R. Hilty (Tyco Elecronics) and A. West (Columbia University)
09:20   1259   Direct Copper Plating on a RuTa Substrate M. Nagar, A. Radisic (IMEC), K. Strubbe (Ghent University) and P. Vereecken (IMEC)
 

Electrochemical Devices

Co-Chairs: Lili Deligianni and James Fenton
TimeAbs#Title and Authors
10:00   1260   (Keynote) Establishment of Electrochemical Device Engineering T. Osaka (Waseda University)
10:40   1261   One-Dimensional Molecular-Junction Arrays Fabricated Using Anodic Aluminum Oxide Templates Y. Song, J. Fang and Z. D. Chen (University of Kentucky)
11:00   1262   Future Challenges in Electrochemical Engineering from Microelectronics to Solar Thin Films H. Deligianni (BM T.J. Watson Research Center), Q. Huang (IBM T.J. Watson Research Center), L. T. Romankiw (BM T.J. Watson Research Center), R. Vaidyanathan, S. Ahmed (IBM T.J. Watson Research Center), S. Jaime, P. Grand, V. Charrier and O. Kerrec (Nexcis Photovoltaic Technology)
11:20   1263   Analysis and Control of Plating Baths in the Electrodeposition of Copper Indium Gallium Selenide Films with Ion Chromatography J. Wang (SoloPower, Inc), S. Aksu (SoloPower Inc) and M. Pinarbasi (SoloPower, Inc.)
11:40   1264   Roughness Control of Electrodeposited CIS Thin Film H. Huang (Nation Taiwan University) and C. Lin (National Taiwan University)
 

Henry B. Linford Award Address

Co-Chairs:
TimeAbs#Title and Authors
14:00   1265   Preparing Electrochemical Engineers for the 21st Century - The Henry B. Linford Award Address of The Electrochemical Society D. Schwartz (University of Washington)
 

Electrochemical Engineering

Co-Chairs: James Fenton and Vijay Ramani
TimeAbs#Title and Authors
14:40   1266   Microfluidic Platforms for Catalyst and Electrode Optimization F. Brushett and P. Kenis (University of Illinois at Urbana-Champaign)
15:00   1267   Electro-Oxidation on the Ti/SnO2-Sb2O5 Anode for Wastewater Treatment Q. Ni, D. Kirk and S. Thorpe (University of Toronto)
15:20   1268   Analysis of Coal-Extracts Using Electrochemical Techniques A. Valenzuela-Muñiz and G. G. Botte (Ohio University)
15:40   1269   Effect of the Electroactive Area and Liquid Mass Flow on the Resident Time Distribution (RTD) in a FM01 Electrochemical Reactor M. Cruz-Díaz (Tecnológico de Estudios Superiores de Ecatepec), E. Rivero (Universidad Nacional Autónoma de México), F. Rivera and I. González (Universidad Autónoma Metropolitana Iztapalapa)
 

Exhibit and Poster Hall, Conference Floor, Fairmont

Poster Session

Co-Chairs:
TimeAbs#Title and Authors
o   1270   Fundamental Thermodynamic Limitations in Wagner's Equation in Solid State Electrochemistry T. Miyashita (Miyashita Clinic)
o   1271   Surface Energy Effects on the Metallization of Nanoscale Features J. D. Adolf and U. Landau (Case Western Reserve University)
o   1272   Investigation on Adsorption Characteristics of Organic Dyes during Via Filling by Copper Electrodeposition R. Manu and S. Jayakrishnan (Central Electrochemical Research Institute)
o   1273   Structural and Protecting Properties of Functional Organic Coatings on Copper Ž. Petrović (University of Zagreb), M. Metikos-Hukovic (University of Zagreb,) and S. Omanovic (McGill University)
o   1274   Surface Modification of Nitinol by Biocompatibile Passive Films J. Katić (Faculty of Chemical Engineering and Technology) and M. Metikos-Hukovic (University of Zagreb,)
o   1275   Electrodeposition and Thermoelectric Properties of BiSbTe Nanowires R. S. Mannam (Louisiana Tech University), K. Varahramyan (IUPUI), D. Davis (Louisiana Tech University) and M. Agarwal (IUPUI)
o   1276   Study the Diffusion Behavior of Li+ in the WO3 Electrochromic Device by Electrochemical AC Impedance Spectroscopy Y. Lu and F. Lien (National University of Tainan)
 

Wednesday, April 28, 2010

Georgia B, 2nd Floor, Hyatt

Electrodeposition-Applications

Co-Chairs: Lili Deligianni and Lisa Podlaha
TimeAbs#Title and Authors
08:00   1277   Understanding and Predicting Metallic Whisker Growth as a Function of Electrodeposited Morphology W. Yelton, D. Susan, J. Michael (Sandia National Labs) and D. Shore (Rensselaer Polytechnic Institute)
08:20   1278   Recrystallization of Electrodeposited Copper-Silver Thin Films N. Alshwawreh (The University of British Columbia), M. Militzer and D. Bizzotto (University of British Columbia)
08:40   1279   Optimization of Fill Rate Uniformity for Dense Features B. L. Buckalew (Novellus Systems, Inc.), T. Ponnuswamy, J. Reid and Y. Takada (Novellus Systems, Inc)
09:00   1280   Seedless Copper Electrochemical Deposition on Barrier Materials as a Replacement/Enhancement for PVD Cu Seed Layers in HAR TSVs S. Armini, H. Philipsen, Z. El-Mekki, A. Redolfi, A. Van Ammel, A. Radisic, M. Nagar and W. Ruythooren (IMEC)
09:20   1281   Electrodeposition and Characterization of FePd Magnetic Thin Films D. Pečko, K. Zužek Rožman (Jozef Stefan Institute), B. Pihlar (Faculty of Chemistry and Chemical Technology ) and S. Kobe (Jozef Stefan Institute)
09:40 Intermission (20 Minutes)
10:00   1282   (Keynote) Electrochemical Technology in Electronics: A Path from Art to Science L. T. Romankiw (BM T.J. Watson Research Center)
10:40   1283   Electrochemical Processes for TSV/Bump Formation Without CMP and Lithographic Process J. Lee, S. Kim and J. Lee (Hongik University)
11:00   1284   Effect of pH and Temperature of the Electrolyte on the Electrodeposition of CoWP Films Using Alkali-Metal-Free Precursors Y. Son, H. Lee and C. Kim (Ajou university)
11:20   1285   Molecular Scale Growth of Electrolytic Copper Foils K. Kondo (Osaka Prefeecture University)
11:40   1286   Additive Transport and Adsorption in Copper Metallization of Interconnects Focusing on TSV Scales J. D. Adolf and U. Landau (Case Western Reserve University)
 

Energy Storage

Co-Chairs: Richard Varijian and Patrik Ng
TimeAbs#Title and Authors
14:00   1287   (Keynote) Diffusion-Induced Stress, Charge-Transfer Resistance, and Materials Selection Criteria for Avoiding Crack Initiation of Insertion Electrode Particles M. Verbrugge (General Motors) and Y. Cheng (University of Kentucky)
14:40   1288   Two-Port Transmission Line Technique for Dielectric Property Characterization of Polymer Electrolyte Membranes Z. Lu (RIT), M. Lanagan, E. Manias and D. Macdonald (Penn State University)
15:00   1289   A Generalized Multidimensional Mathematical Model for Li-Ion Intercalation Batteries S. Pannala, S. Allu, J. Nanda and W. Shelton (Oak Ridge National Laboratory)
15:20   1290   Low Temperature Studies of EC:DMC Mixture in Lithium-Ion System A. Drews, J. Adams, R. Kudla, M. Karulkar and C. Paik (Ford Motor Company)
15:40   1291   Carbon Nanotube-Confined MnO2 Nanocomposites for Electrochemical Capacitors W. Chen, K. Bechtold, M. Beidaghi, V. Penmatsa and C. Wang (Florida International University)