Atomic Layer Etching and Cleaning

Here’s our latest Call for Papers:

Atomic Layer Etch (ALEt) and Atomic Layer Clean (ALC) are emerging as enabling technologies for sub 10nm technology nodes. At these scales performance will be extremely sensitive to process variation.

Atomic layer processes are the most promising path to deliver the precision needed. However, many areas of ALEt and ALC are in need of improved fundamental understanding and process development. This focus issue will cover state-of-the-art efforts that address a variety of approaches to ALE and ALC.

Topics of interest include but are not limited to:

  • Surface reaction chemistry and its impact on selectivity
  • Plasma ion energy distribution and control methods
  • Novel plasma sources and potential application to ALEt & ALC
  • Innovative approaches to atomic layer material removal
  • Novel device applications of ALEt & ALC
  • Process chamber design considerations
  • Advanced delivery of chemicals to processing chambers
  • Metrology and control of ALEt & ALC
  • Device performance impact
  • Synthesis of new chemistries for ALEt & ALC application
  • Damage free surface defect removal
  • Process and discharge modeling

FIND OUT MORE!

Deadline for submission of manuscripts | December 17, 2014

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0 Comments

  1. Sunil Pathak

    July 11, 2014 at 4:08 pm

    Just want to ask that the comparative experimental study on finishing of mechanical gears using different electrochemical process can be considered in that topic or not. Thanks in advance

  2. Rob Gerth

    July 16, 2014 at 2:12 pm

    This is a call for papers to be published on this topic not a symposium.

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