Only one month left to save $125 on registration!The 233rd ECS Meeting will take place May 13-17, 2018 at the Seattle Sheraton and Washington State Convention Center.
If our strong technical program, of over 2,600 abstracts being presented in 43 symposia across five days, wasn’t enough of a reason to join us, check out some of the other exciting events taking place in Seattle.
Topic Close-up #9Symposium G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8
Symposium Focus: This meeting is the 8th International ECS SiGe Symposium for the past 16 years (www.sigesymposium.com). It will provide a forum for people from industry, research institutions, and academics around the world to gather together in an unique and relaxed environment, reviewing and discussing materials and device related aspects of SiGe, Ge, and Related Compounds (Group IV incl. C and Sn alloys, and III/V on Si, as well as 2D materials). There are 10 areas of interests covering very broad spectrum from devices to fundamental material characterization, to stimulate information exchange and innovations, 1) Heterojunction Bipolar Transistors, 2) FET Technology, 3) Optoelectronics, 4) Epitaxy, 5) Emerging Applications, 6) Processing, 7) Strain Engineering, 8) Surfaces and Interfaces, 9) Related Compounds, 10) Metrology and Characterization.
Join us as ECS comes to the Seattle Sheraton and Washington State Convention Center in Seattle, WA! Our strong technical program of 2,600 abstracts being presented in 46 symposia over five days will have something for everyone!
ECS meetings are well known for their strength in areas such as batteries/energy storage, fuel cells/energy conversion, carbon nanostructures, semiconductors, sensors, corrosion, and more. In addition, the Seattle meeting will explore newer areas such as materials recycling, data science for modeling and design, consumer products, and flexible electronics.
Take a moment and read a few topic close-ups, and see what is in store!
Topic Close-up #8Symposium G01: Semiconductor Wafer Bonding: Science, Technology, and Applications 15
Symposium Focus: The fifteenth symposium solicits original theoretical and experimental papers that document new developments and cover the full range of basic science, process technologies, and product applications of semiconductor wafer bonding (direct, anodic, thermo-compression, eutectic, adhesive bonding). Besides permanent bonding, temporary wafer bonding technique deserves also to be discussed regarding all the recent development in many 3D applications. Fundamental aspects of interest include surface preparations for bonding, film transferring, low temperature bonding, surface activation at bonding interfaces, bonding techniques, novel material composites to synthesize heterostructures. Presentations characterizing currently utilized materials and processes, as well as novel approaches to new materials systems and modeling and process simulations are encouraged. Practical aspects of interest include innovative developments in product architecture and new integration and processing schemes for microelectronics, photonics, MEMS, microtechnologies, nanotechnologies and other relevant applications.
Invited Speakers from CEA-Leti, imec, EVG, KTH, Qromis, and more will be featured during the symposium.
Topic Close-up #7Symposium H07: Electronic, Thermal, and Electrochemical Properties of Metal Organic Frameworks (MOFs): Technology, Applications, and Emerging Devices
Symposium Focus: The 1st International Symposium sponsored by the Electronics and Photonics Division of the Electrochemical Society brings together researchers in chemistry, materials science, physics, devices and process engineers and related interdisciplinary areas, to seek and capture the state-of-the art in MOF based fundamental aspects and latest technological applications. This symposium offers a new interdisciplinary and international platform, and aims to contribute towards advancing the fundamental understanding of the layered MOF thin films and aiming to improve technological applications thereof. Original contributions are solicited that cover all fundamental and applied aspects including electronic, thermal and electrochemical transport properties and phenomena, device/ system fabrication and integration of MOF thin films into emerging technological device applications. All oral presentations will be grouped into topical sessions. Invited Keynote speakers will present critical reviews covering recent advances and future directions in the diverse field of fundamental and applied MOF properties.
Topic Close-up #6Symposium G05: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB
Symposium Focus: This symposium focuses on issues pertinent to advances in semiconductor interconnects beyond the 20 nm technology node as well as novel materials and integration methods for 2.5D and 3D interconnects. An emerging technology or device architecture called 2.5D and 3D integration is based on the system performance gains that is achieved by chip stacking and vertically interconnecting distinct device layers. Since electrochemical processes are the ultimate solution to create smaller size and lower cost devices, both practical and fundamental aspects of electrochemical processes are of high demand. Ideally, this symposium will bring researchers together to discuss various aspects of device architecture, novel materials, chemical formulation, packaging approaches and nano-scale fabrication methodologies.
Topic Close-up #5Symposium D06: Surface Characterization and Manipulation for Electronic Applications
Symposium Focus: The properties of interfaces underpin many of the advances and emerging applications in electronics. From studies of charge transport in molecular electronics to interactions between biomolecules in bioelectronics sensing, the ability to understand and control interfacial properties is more important than ever. This symposium aims to address interfacial properties in a variety of electronic applications, where the functionalization of interfaces is demonstrated and characterized in order to advance understanding and to enable new devices and device applications.
Topic Close-up #4Symposium A07: Battery Safety and Failure Modes
Symposium Focus: Long life, high power, reliable and safe lithium-ion batteries are needed for new consumer electronics, vehicle and grid storage applications. Demands for increased battery functionality, makes the severity of a potential battery safety incident a growing risk for emerging lithium-ion battery technologies. The objective of this symposium is to address lithium-ion battery durability, reliability and safety from a materials and cell design perspective with the goal of reducing the severity of an energetic safety incident. Better understanding of battery failure modes and effects could enable cell and system design improvements, performance enhancements and facilitate regulatory approvals of advanced lithium-ion battery power systems.
ECS biannual meetings are a forum for sharing the latest scientific and technical developments in electrochemistry and solid state science and technology. Scientists, engineers and industry leaders come from around the world to attend the technical symposia, poster sessions, and professional development workshops. Not to mention exciting networking opportunities and social events.
Don’t miss the opportunity to sponsor or exhibit at our largest spring meeting ever! Join us as ECS heads to the Seattle Sheraton and Washington State Convention Center in Seattle, WA from May 13-17, 2018, for the 233rd ECS Meeting. This is a can’t miss event for electrochemists and solid state scientists, featuring over 2,600 abstracts in over 50 symposia.
In addition to long running symposia on batteries, semiconductors, fuel cells, fullerenes, and luminescent materials, the Seattle meeting will also explore newer areas such as materials recycling, data science for modeling and design, consumer products, and flexible electronics.
This meeting is the perfect opportunity to get your products and services in front of our specialized audience of leading scientist and engineers!
Reserve a booth or browse our sponsorship options
Return applications by Friday, March 9, 2018
If your organization is interested in exhibiting or sponsoring, please contact Ashley Moran, ECS corporate programs manager, via email.
