202nd Meeting - Salt Lake City, UT

October 20-25, 2002

PROGRAM INFORMATION

K1 - Electrodeposition of Alloys

Electrodeposition

Tuesday October 22, 2002

Grand Ballrooms B and C, Main Level, Grand America Hotel

Co-Chairs: G. Zangari and W. Schwarzacher

Time	Abs#	Title
o	466	Galvanostatic Double-Pulse Plating of Copper with Organic Additives in Acid-Copper Solution - J. Han and M. King (ATMI)
o	467	Effect of Saccharin Concentration on the Microstructure of the Electrodeposited Ni-Fe - S.-H. Kim, T. Kang, H.-J. Sohn, Y.-C. Joo, Y.-W. Kim (Seoul National University), T.-H. Yim, and H.-Y. Lee (Korea Institute of Industrial Technology)
o	468	Electrodeposition of Platinum CIridium Alloy on Nickel-Base Single-Crystal Superalloy TMS75 - F. Wu, Y. Yamamoto, Y. Yamabe-Mitarai (National Institute for Materials Scienc), H. Murakami (The University of Tokyo), N. Hirosaki, and H. Harada (National Institute for Materials Scienc)
o	469	The Analysis of the Zinc and Iron Group Metal Alloy Deposition Mechanism using an EQCM - H. Hayashi, S. Matsuda, and T. Katase (Okayama University)

Wednesday October 23, 2002

Tucson Room, Second Floor, Little America Hotel

Co-Chair: W. Schwarzacher

Time	Abs#	Title
10:00	470	Co-Deposition and the Interace Roughness of Iron Group Binary Alloys - J. Ebothé, S. Vilain, and M. Hiane (Universite de Reims)
10:30	471	Anormalous Scaling of Surfaces Grown by Pulse-Current Electrodeposition - W. Oshikawa, K. Hamaguchi, and M. Saitou (University of the Ryukyus)
10:45	472	Characterization of Initial Stages of the Electrodeposition of Ni, Zn and Ni-Zn Alloy by EQCM - K.D. Song and K.B. Kim (Yonsei University)
11:00	473	Studies On Electrodeposited Zn-Ni-X (X = Cu, SiO_2) Ternary Alloys As a Replacement For Cadmium Coatings - S.P. Kumaragu, B. Veeraraghavan, B. Haran, and B. Popov (University of South Carolina)
11:15	474	Non-Anomalous Zn-Ni-X (X=P, SiO2) Deposits As A Replacement For Cadmium Coating - B. Veeraraghavan, S.P. Kumaraguru, B.S. Haran, and B.N. Popov (University of South Carolina)
11:30	475	Characterization of the Electrodeposited Co/Re-188 Alloy Layer on Radioactive Stents - H. Zhang (Cleveland State University) and U. Hafeli (The Cleveland Clinic Foundation)
11:45	476	Electrodeposited Co-Mo Alloys for Hydrogen Evolution in a Hot Alkali Solution - P. Zabinski, H. Nemoto, S. Meguro (Tohoku Institute of Technology), K. Asami (Tohoku University), and K. Hashimoto (Tohoku Institute of Technology)

Co-Chair: D.T. Schwartz

Time	Abs#	Title
2:00	477	Tip-induced Metal Deposition for Nanostructuring Electrode Surfaces - D.M. Kolb (University of Ulm)
3:00	478	In situ Scanning Tunneling Microscopy: Nanostructuring of Solid State Surfaces and Determination of Surface Properties - W. Schindler (Universitat Karlsruhe)
3:30		Fifteen-Minute Intermission -
3:45	479	In situ Electrochemical Atomic Force Microscopy on Surface Alloying at Au(100)/Cd²⁺ Interface - R. Vidu (Univesity of California at Davis), N. Hirai, and S. Hara (Osaka University)
4:15	480	Electrochemical Impedance Spectroscopy Study of Electrochemical Reactions on Single-Crystal Nickel Surfaces in Nickel Sulfamate - K. Hamaguchi, W. Oshikawa, and M. Saitou (University of the Ryukyus)
4:30	481	Underpotential Deposition of Zinc on Platinum - E. Guerra (University of British Columbia), G. Kelsall (Imperial College), M. Bestetti (Polytechnic of Milan), D. Dreisinger, and D. Bizzotto (University of British Columbia)

Thursday October 24, 2002

Co-Chair: G. Zangari

Time	Abs#	Title
8:30	482	Electrodeposition of Vanadium-Aluminum Alloys in Lewis Acidic AlCl3-EtMeImCl Melt Containing EtMeImBF4 - T. Tsuda and C. Hussey (The University of Mississippi)
9:00	483	Electrochemical Behavior of Tm3+ Ion and Electrodeposition of Tin Alloy Films in Dimethylsulfoxide - G. Liu and D. Yuan (Zhongshan University)
9:15	484	A Comparison of Direct and Pulse Plating Techniques from Aprotic-Non-Aqueous Solutions and Aqueous Solutions for the Preparation of Various Pt/Ru/Os Alloys - J. Thomas and D. Buttry (University of Wyoming)
9:30		Thirty-Minute Intermission -
10:00	485	Phase Stability of Electrodeposited Alloys: The Case of IB Metals - Sn Alloys - P.L. Cavallotti, M. Bestetti, L. Nobili, and A. Vicenzo (Ingegneria Chimica "Giulio Natta")
10:30	486	White Gold Alloys Electrodeposition for Decorative Applications - A. Vicenzo, M. Rea, L. Vonella, M. Bestetti, and P.L. Cavallotti ("Giulio Natta" Politecnico di Milano)
10:45	487	Electrodeposition of Brass-like Thin Films from Thiourea Electrolytes - M. Bestetti, A. Vicenzo, F. Ziglioli, S. Franz, and P.L. Cavallotti (Chimica "G. Natta")
11:00	488	The Properties of Electrodeposited Copper-Manganese Alloy coatings - J. Gong, G. Wei (The University of Alabama), J.A. Barnard (University of Pittsburgh), and G. Zangari (The University of Alabama)
11:15	489	Electrodeposition of Ni-Cu-gamma Al_2O₃ Alloys into Deep Recesses - A. Panda and E. Podlaha (Louisiana State University)
11:30	490	Flexible Maskless Electrodeposition of Arbitrary 250-dpi Alloy Patterns with Local Composition Control - J. Whitaker, W. Wang, D. Schwartz, A. Mudholkar, M. Ganter, and D. Storti (University of Washington)