202nd Meeting - Salt Lake City, UT
October 20-25, 2002
PROGRAM INFORMATION
K2 - Seventh International Symposium on Magnetic Materials, Processes and Devices
Electrodeposition
Monday October 21, 2002
Grand Ballroom C, First Floor, Little America Hotel
Overview of Magnetic Device Fabrication
Co-Chairs: L. Romankiw and Y. Kitamoto
Magnetic Storage Media
Co-Chairs: M. Russak and K. Ouchi
Time | Abs# | Title |
2:00 | 495 |
Evolution of Advanced High Performance Magnetic Recording Media - M. Russak
(Komag, Incorporated) |
2:30 | 496 |
Review on Recent Perpendicular Recording Devices and Their Performances - K. Ouchi (Akita Research institute of Advanced Technology) |
3:00 | 497 |
Multilayer Superlattice Perpendicular Magnetic Recording Media for Ultra-High Areal Densities -
J.H. Judy, W. Peng, R.H. Victora (University of Minnesota), and W. Zhu (Seagate Technology) |
3:30 | 498 |
Fabrication of CoNiP Dot Arrays for Patterned Magnetic Recording Media with Electroless Deposition Process - J.
Kawaji, F. Kitaizumi, T. Homma, and T. Osaka (Waseda University) |
3:45 | 499 |
FePt Nanoparticle-assembly for Magnetic Recording Media - Y.
Kitamoto, H. Sakuma, A. Jogo, T. Taniyama, and Y. Yamazaki (Tokyo Institute of Technology) |
4:00 | |
Panel Discussion- Present and Future Directions in Magnetic
Storage Technology and MEMS |
Tuesday October 22, 2002
Alloy Plating I (Co Ni-Fe Systems)
Co-Chairs: K. Ohashi and C. Bonhote
Time | Abs# | Title |
8:15 | |
Introductory Remarks - |
8:30 | 500 |
The Electrodeposition Conditions of CoNiFe Films, the Crystal Structure, and the Evaluation of Magnetic Moments - M. Saito and K. Ohashi (NEC Corp.) |
8:45 | 501 |
Electroplated High Moment CoNiFe - M.
Ramasubramanian, C. Bonhote, E. Velasco, E.I. Cooper, and L.T. Romankiw (IBM) |
9:00 | 502 |
Magnetic Properties of Electroplated CoNiFe Alloys -
J.A. Medina, T. Jiang, and T. Dinan (Read-Rite Corporation) |
9:15 | 503 |
Pulse Plating of Soft High Magnetic Moment Materials-Properties and Application - S.
Brankovic, X. Yang, and E. Johns (Seagate Technology) |
9:30 | |
Thirty-Minute Intermission - |
10:00 | 504 |
Electrodeposition of Soft CoFeCr Films with High Magnetic Saturation and High Resistivity - C. Locatelli
(CEA) and D. Comte (ALDITECH) |
10:15 | 505 |
Development of High-performance Soft Magnetic Thin Films by Electroless Deposition and their Application to Magnetic Recording Head Core - T. Osaka and T. Yokoshima
(Waseda University) |
10:45 | 506 |
Electrodeposition and Performance Evaluation of High Moment NiFe Films - M.
Ramasubramanian, J. Lam, A. Hixson-Goldsmith, A. Medina, T. Dinan, N. Robertson, T. Harris, and S. Yuan (IBM) |
11:00 | 507 |
Domain Studies of Electroplated High Moment CoFe and NiFe on Test Structures - H.
Xu, Y. Hsu, and J. Heidmann (IBM) |
11:15 | 508 |
Electroplated 2.4 Tesla
CoFe Films - C.
Bonhote, E.I. Cooper, L.T. Romankiw, and H. Xu (IBM) |
11:45 | 509 |
In Situ Surface Measurements and Rotating Cylinder Hull Cell- A Powerful Combination of Methods for Investigation of Iron Group Metal Alloys - C.
Bonhote, P. Kern, and L.T. Romankiw (IBM) |
Alloy Plating II
Co-Chairs: G. Zangari and E.J. Podlaha
Time | Abs# | Title |
2:00 | 510 |
Pulse Plating of High Moment CoFe Thin Films - C.-P. Chen, K. Lin, and J.-W. Chang (Headway Technologies, Inc.) |
2:30 | 511 |
Effect of Carbon Inclusion on Properties of Electrodeposited CoNiFeMo-based Soft Magnetic Thin Films - T.
Yokoshima, A. Kawashima, T. Nakanishi, T. Osaka (Waseda University), M. Saito, and K. Ohashi (NEC Corporation) |
2:45 | 512 |
Thermo-mechanical Properties of Electrodeposited HMM for Magnetic Recording -
V.R. Inturi, I. Tabakovic, M. Chander, D. Macken, D. Olson, and M. Kief (Seagate Technology) |
3:00 | 513 |
Effect of Magnetic Field on NiFe Alloy Electrodeposition - I.
Tabakovic, S. Riemer, V. Vas'ko, V. Sapozhnikov, and M. Kief (Seagate Technology) |
3:30 | |
Fifteen-Minute Intermission - |
3:45 | 514 |
The Inhibition of Anomalous Codeposition of Iron-Nickel Deposits Using Pulse-Reverse Electroplating - C.-C. Hu and P. Tsay (National Chung Cheng University) |
4:00 | 515 |
Electrodeposition of Magnetic Thin Films of Iron Group - V Alloys - B.
Yoo, D. Park, N. Myung, P. Sumodjo, M. Schwartz, and K. Nobe (University of California) |
4:15 | 516 |
A Model to Describe Pulsed Electrodeposition of GMR FeCoNiCu Alloys - Q. Huang and E. Podlaha (Louisiana State University) |
4:30 | 517 |
Composition Modulation in Ferromagnetic Layer in Ni-Co(Cu)/Cu Multilayer -
S.M.S.I. Dulal, E.A. Charles, and S. Roy (University of Newcastle upon Tyne) |
4:45 | 518 |
Giant Magnetoresistance of Ni-Co(Cu)/Cu Multilayers Plated from a Citrate Electrolyte -
S.M.S.I. Dulal, E.A. Charles (University of Newcastle upon Tyne), L. Peter, I. Bakonyi (Hungarian Academy of Sciences), and S. Roy (University of Newcastle upon Tyne) |
5:00 | 519 |
Nucleation Mechanisms of Iron Electrodeposition - B. Pesic and D. Grujicic (University of Idaho) |
Grand Ballrooms B and C, Main Floor, Grand America Hotel
Poster Session
Co-Chair: S. Krongelb
Wednesday October 23, 2002
Grand Ballroom C, First Floor, Little America Hotel
MEMS
Co-Chairs: M.G. Allen and J.W. Judy
Time | Abs# | Title |
10:00 | 521 |
Magnetic Micromachined Structures for RF MEMS Applications - M. Allen (Georgia Institute of Technology) |
10:30 | 522 |
RF Soft Magnetic Applications as Integrated Passives - M. Yamaguchi, K.-H. Kim, S. Ikeda, and K.-I. Arai (Tohoku University) |
11:00 | 523 |
Ferromagnetic MEMS Arrays for Reconfigurable Frequency Selective Surfaces - J.
Zendejas, J. Gianvittorio, B. Yoo, Y. Rahmat-Samii, K. Nobe, and J.W. Judy (University of California) |
11:15 | 524 |
Technology for the Development of Magnetic Micro Stir-bar Mixers for Fluid Lab-on-a-chip Applications - C. Liu, K.
Ryu, and L.-H. Lu (University of Illinois at Urbana-Champaign) |
11:30 | 525 |
Development of Electroplated Magnetic Materials for MEMS - N. Myung (Jet Propulsion Laboratory) |
Heads for Magnetic Storage
Co-Chairs: J.W. Chang and M. Ramasubramanian
Time | Abs# | Title |
2:00 | 526 |
Trends and Process Considerations for Making New Generations of Magnetic Recording Heads - E. Johns (Seagate Technology), U. Tran
(Sparkolor, Inc), J. Jayashankar, A. Eckert, S. Batra, and R. Rottmayer (Seagate Technology) |
2:30 | 527 |
Focused Ion Beam Write Pole Nanofabrication - B. Miller, G. Brown, M.
Strayer, and S. Stone (FEI Company) |
3:00 | 528 |
Identifying and Reducing Lapping Variables in GMR/TMR Head Manufacturing Processes - S. Griffin and
S.Y. Kuo (Engis Corporation) |
3:30 | |
Fifteen-Minute Intermission - |
3:45 | 529 |
Highly Sensitive CPP Elements using Spin Valve Film with Partially Oxidized Magnetic Layer for Over 150 Gb/in2 Read Heads - K.
Nagasaka, Y. Seyama, H. Oshima, R. Kondo, Y. Shimizu, and A. Tanaka (Fujitsu Laboratories Limited) |
4:15 | 530 |
Reliability of CPP Mode Spin Valve Heads - S. Kao, C.
Luo, and J.W. Chang (Headway Technologies) |
4:30 | 531 |
Development of Advanced CIP Spin Valve GMR Materials - M. Li, S.
Liao, C. Horng, K. Ju (Headway Technologies, Inc), M. Sano, Y. Tsuchiya, K. Noguchi, and K. Terunuma (TDK Corporation) |
5:00 | 532 |
Enhanced Magnetoresistance in Co/Cu Multilayers due to the Insertion of Ni Layers - K.
Tanahashi, T. Endo, T. Sugimoto, T. Sasaki, S. Shinriki, A. Kanemoto, M. Eguti, K. Motoi, K. Imai, K. Suzuki, T. Sawada, and N. Kimura (Hokkaido Institute of Technology) |
Thursday October 24, 2002
Actuators and MEMS
Co-Chairs: S. Krongelb and C. Liu
Time | Abs# | Title |
8:30 | 533 |
Thermally-Degraded and Electromigration-Induced Failures in Spin-valve Heads - C.
Luo, S. Kao, and J.-W. Chang (Headway Technologies Inc.) |
9:00 | 534 |
Small Actuator for Large Capacity: A MEMS Microactautor for Hard-Disk Drive Tracking Servo - T. Hirano (IBM) |
9:30 | |
Thirty-Minute Intermission - |
10:00 | 535 |
A Large-Displacement Electromagnetic MEMS Actuation System - M. Neal,
A.L. Sidman, and J. Borski (Advanced Microsensors) |
10:15 | 536 |
Optimizing the Magnetic Properties of Electroplated Permalloy for Flux Guides in Micromotors - M. Fohse and
H.H. Gatzen (Hanover University) |
10:30 | 537 |
Effect of Etch Holes on the Performance of Ferromagnetic MEMS - W.-J. Ouborg (University of California), N. Myung (Jet Propulsion Laboratory), K.
Nobe, and J. Judy (University of California) |
10:45 | 538 |
Ni Electroplating in SU-8 Microforms for Fabricating Self Supporting Microstructures - T. Kohlmeier and
H.H. Gatzen (Hanover University) |
11:00 | 539 |
Plastic Deformation Magnetic Assembly Method and Its Applications - C. Liu, J.
Zou, J. Chen, Z. Fan, and F. Delcomyn (University of Illinois at Urbana-Champaign) |
11:30 | 540 |
Silicon Optical MEMS: Three Dimensional Micromachining and Integration - K. Hane and M. Sasaki (Tohoku University) |
Alloy Plating III and Special Materials
Co-Chairs: M. Abe and P. Kern
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