204th Meeting of The Electrochemical Society, Co-sponsored in Part by the Electronics Division of The American Ceramic Society

October 12-October 16, 2003


E1 - Sixth International Symposium on Environmental Issues in the Electronics and Semiconductor Industries

Dielectric Science and Technology

Tuesday, October 14, 2003

Exhibit Hall, Ground Level

Technical Exhibit and Poster Session, 7:00 - 9:00 PM

Co-Chairs: L. Mendicino and L. Simpson

o528 Comparison of Coke and Titanium as Components for Galvanochemical Systems - A. Pikelny (AEMF) and O. Pikelnaya (UCLA)
o529 The Study on Protective Layer to Suppress Deformation of ArF Photo Resist During Dry Etching - C.-H. Shin, G.-J. Min, C.-J. Kang, W.-S. Han, and J.-T. Moon (Samsung Co. Electronics, Ltd.)
o530 A New Hole-Cleaning Process for Printed Circuit Boards Using Dense Ozonated Gas - T. Saito, J. Aragane, T. Muraki, T. Otsubo (Mitsubishi Electric Corporation), and K. Takishita (SPC Electronics Corporation)
o531 Evaluating Alternative Chamber Cleaning Processes Using a New Environmental Evaluation Framework - Y. Chen, G. McRae, and K. Gleason (Massachusetts Institute of Technology)




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