204th Meeting of The Electrochemical Society, Co-sponsored in Part by the Electronics Division of The American Ceramic Society

October 12-October 16, 2003


J1 - Characterization, Mechanistic Models, and Transport Aspects of Cathodic and Anodic Processes, In Honor of Dieter Landolt


Monday, October 13, 2003

Emerald Room, Ground Level

Electrodeposition of Nanostructures

Co-Chairs: M. Matlosz and E. Podlaha

10:00 Introductory Remarks- Matlosz and Schmutz
10:15674 Electrochemical Nanotechnology by Means of Electrodeosition - T. Osaka (Waseda University)
10:45675 In Situ Transmission Electron Microscopy Study of Copper Nucleation and Growth at the Solid-Liquid Interface - A. Radisic (Johns Hopkins University), M. Williamson (University of Virginia), R. Tromp, P. Vereecken (IBM T. J. Watson Research Center), P. Searson (Johns Hopkins University), and F. Ross (IBM T. J. Watson Research Center)
11:00676 Electrodeposited FeCoNiCu Nanostructures - Q. Huang (Louisiana State University), R.W. Cohn (University of Louisville), and E.J. Podlaha (Louisiana State University)
11:15677 Bi-Layer Interfaces in Metal Multilayers - S. Roy (Newcastle University)

New Developments and High Aspects Ratio Deposition

Co-Chairs: W. Plieth, J. Kelly, and C. Bonhote

2:00678 Electrodeposited of Alumina-NiCu, FeW and NiW Nanocomposites - E. Podlaha, A. Panda, J. Armstrong, and G. Sanchez (Louisiana State University)
2:30679 Pulse Plating of Ni-W Alloys - S. Franz (Politecnico di Milano), A. Marlot, and D. Landolt (Swiss Federal Institute of Technology Lausanne)
2:45680 Effects of Additives on Copper Electrodeposition in Submicrometer Trenches - M. Hasegawa, Y. Negishi, T. Yokoshima, T. Nakanishi, and T. Osaka (Waseda University)
3:00681 Electrochemical Investigation of Electroless Deposition from DMAB Based Solutions - D. Casey, K. Reynolds, M. O'Connell, and J. Rohan (NMRC)
3:15 Fifteen-Minute Intermission
3:30682 Alloys and Intermetallic Compounds: The Development of Crystallographic Structure - W. Plieth (Dresden University of Technology)
4:00683 Residual Stress and Magnetic Properties of Pulse-Reverse Electrodeposited High Aspect Ratio CoNiP Micro-arrays Magnets - S. Guan (University of Minnesota-Twin Cities) and B. Nelson (Swiss Federal Institute of Technology)
4:15684 High Rate Through-Mask Deposition of Copper for MEMS and WL-CSP Applications - B. Kim, D. Erickson, T. Ritzdorf (Semitool, Inc.), S. Christian, and R. Forman (Shipley Company, L.L.C.)
4:30685 Properties of Nanocrystalline Ni-Fe Alloys Using Microelectroforming in Mold Insert - K.-L. Ou (Taippei Medical University), Y.-M. Yeh (National Chiao Tung University), S.-Y. Chiou (National Kaohsiung University of Applied Science), and S. Lee (Taippei Medical University)
4:45686 Texture, Microstructure, and Mechanical Properties of NiMn Alloy Electrodeposits - A. Talin, J. Kelly, S. Goods, G. Lucadamo, and N. Yang (Sandia National Laboratories)
5:00687 Low-Stress High Performance Soft Magnetic Materials For MEMS From Additive-Free Chloride Baths - N. Myung, E. Urgiles, K.-A. Son, C.-S. Lee, and T. George (California Institute of Technology)

Tuesday, October 14, 2003

Experimental Development in Electrodeposition Processes and Surface Structuring

Co-Chairs: S. Roy and T. Osaka

8:30688 Electrochemical Microfabrication without Photolithography - J.D. Whitaker and D.T. Schwartz (University of Washington)
9:00689 Triggering Local Reactivity on Semiconductor Surfaces - P. Schmuki (University of Erlangen-Nuremberg), R. Gassilloud (Swiss Federal Laboratories for Materials Testing and Research (EMPA)), L. Santinacci (University of Erlangen-Nuremberg), J. Michler (Swiss Federal Laboratories for Materials Testing and Research (EMPA)), and M. Hueppe (University of Erlangen-Nuremberg)
9:15690 Fabrication of Metal Dot Array on Aluminum by AFM Probe Processing - Z. Kato, M. Sakairi, and H. Takahashi (Hokkaido University)
9:30 Thirty-Minute Intermission
10:00691 Superconformal Film Growth - T. Moffat, D. Wheeler, B. Baker, and D. Josell (NIST)
10:30692 Electrode Reactions of Group 4 Transition Metal Ions in Lewis Acidic AlCl3-EtMeImCl Ionic Liquids - T. Tsuda, C. Hussey (The University of Mississippi), and G. Stafford (National Institute of Standards and Technology)
10:45693 Electrodeposition of Cs and Sr Ions from the Tri-n-butylmethylammonium Triflate Ionic Liquid - P.-Y. Chen and C. Hussey (The University of Mississippi)
11:00694 Influence of Ferric Ion on Magnetic Properties of High Moment CoFe Electrodeposited Thin Films - K. Imai, T. Yokoshima, and T. Osaka (Waseda University)
11:15695 Characterization of Mass Transfer During Copper Electrodeposition - M. Alodan, F. Almubaddal, F. Abdullaleem, and M. Imtiaz (King Saud University)
11:30696 Analysis of CV Hysteresis by PEG and Chloride Ion in Copper Electroplating - M. Hayase, M. Taketani, T. Hatsuzawa (Tokyo Institute of Technology), and K. Hayabusa (Ebara Research Company)

Modeling of Electrodeposition Processes

Co-Chairs: T. Moffat and A. West

2:00697 Simulation of the Influence of Reactant Depletion On Nucleation Rate in Electrodeposition - M. Zheng and A. West (Columbia University)
2:30698 Parameter Estimation of a Copper Electrodeposition Additive Mechanism using Data Obtained from a D-Optimal Experimental Design - T. Drews, F. Xue, X. Li (University of Illinois at Urbana-Champaign), H. Deligianni, P. Vereecken, E. Cooper, P. Andricacos (IBM Research), R. Braatz, and R. Alkire (University of Illinois at Urbana-Champaign)
2:45699 Atomic-Scale Kinetic Monte Carlo Simulations of Copper Nucleation: Investigation of Attachment Limited Rate Laws - T. Drews (University of Illinois at Urbana-Champaign), A. Radisic, J. Erlebacher (Johns Hopkins University), R. Braatz (University of Illinois at Urbana-Champaign), P. Searson (Johns Hopkins University), and R. Alkire (University of Illinois at Urbana-Champaign)
3:00700 Controlled Current Methods in Studies of Nucleation and Growth - P. Adcock (Los Alamos National Laboratory)
3:15 Fifteen-Minute Intermission
3:30701 Use of High Performance Computingn Tools to Integrate Experimental Data with Multi-Scale Simulations of Copper Electrodeposition with Additives - R. Alkire (University of Illinois)
4:00702 A Comprehensive Electrochemical Modeling Tool for Simulating Tertiary Current Distributions - J.-C. Sheu, S. Lowry (CFD Research Corporation), and L. Gochberg (Novellus Systems, Inc.)
4:15703 Electrodeposited Ni-Zn-P Coatings as Substitute for Cadmium/Experimental Studies and Mathematical Modeling - S.P. Kumaraguru, B. Veeraraghavan, and B. Popov (University of South Carolina)
4:30704 Electrodeposition of a Combinatorial Library of Binary Cu_1-xZnx Alloys - S. Beattie and J. Dahn (Dalhousie University)
4:45705 Combinatorial Electrodeposition of Ternary Alloys - S. Beattie and J. Dahn (Dalhousie University)

Wednesday, October 15, 2003

In-Situ Characterization of Surface Stability, Oxidation, or Deposition

Co-Chairs: P. Schmutz and M. Seo

10:00706 EQCM Studies of Anodic Film Growth - C. Olsson (EPFL)
10:30707 EQCM and Stress Analyses of Electrodeposition Process Accompanying Potential Oscillations - M. Seo and M. Hagioi (Hokkaido University)
10:45708 Titanium Oxide Film Growth Studied with the RRD/EQCM Technique - M.-G. Vergé, C. Olsson, and D. Landolt (Ecole Polytechnique Federale de Lausanne)
11:00709 EQCM and Switch-Flow Cell Set Up Applied to Adsorption Studies - F. Galliano, C. Olsson, and D. Landolt (EPFL - Institut des Matériaux - LMCH)
11:15710 Anodically Deposited Oxygen Evolution Anodes for Seawater Electrolysis - K. Hashimoto (Tohoku Institue of Technology), K. Izumiya (Mitsui Shipbuilding and Engineering Co.Ltd), N. Kumagai (Daiki Engineering Co. Ltd.), S. Meguro (Tohoku Institue of Technology), K. Asami (Tohoku University), and N. Abdel Ghany (Tohoku Institue of Technology)
11:30711 The Concentration and Temperature Borders of Copper Local Corrosion in Hydrocarbonate-Formiate Solutions - E. Neupokoeva, S. Kaluzhina, and I. Ryzhkova (Voronezh State University)

Surface Characterization and Microstructuration

Co-Chairs: C. Olsson and H.H. Strehblow

2:00712 Passivation Mechanisms Emerging From Surface Chemical and Structural Analysis by XPS and STM and Atomic Scale Modeling - P. MARCUS (CNRS)
2:30713 Influence of Additive Elements on Passive Films on Fe-18Cr Alloy - H. Tsuchiya, S. Fujimoto (Osaka University), and T. Shibata (Fukui University of Technology)
2:45714 Characterization of the Region around MnS Inclusions in Stainless Steels - Q. Meng, G. Frankel, H. Colijn, and S. Goss (The Ohio State University)
3:00715 Electrochemical Surface Nitriding of SUS 304 Austenitic Stainless Steel - H. Tsujimura, T. Goto, and Y. Ito (Kyoto University)
3:15 Fifteen-Minute Intermission
3:30716 From the Electrochemical Double Layer to Duplex Anodic Films, a Summary on the Application of XPS and other Surface Analytical Methods in Electrochemistry and Corrosion Science - H.-H. Strehblow (Heinrich-Heine-Universitaet)
4:00717 Snapshots of an Electrochemical Interface: A Study of the Interfacial Structure at Cu(111) from Hydrogen Evolution through Initial Stages of Oxide Formation with DFT - C. Taylor, R. Kelly, and M. Neurock (University of Virginia)
4:15718 Electrochemical Micromachining of Metals through an Electrophoretically Deposited Epoxy Mask - P. Kern (Swiss Federal Laboratories for Materials Testing and Research (EMPA)), P.-F. Chauvy, and D. Landolt (Swiss Federal Institute of Technology Lausanne (EPFL))
4:30719 Electrochemical Micromachining of Titanium using Oxide Film Laser Lithography - P.-F. Chauvy and D. Landolt (EPFL)
4:45720 Scale-Resolved Electrochemical Surface Structuring of Titanium for Biological Applications - O. Zinger (Swiss Federal Institute of Technology Lausanne), K. Anselme (University of Littoral Cote d'Opale), P. Habersetzer (Institut Straumann AG), P.-F. Chauvy, and D. Landolt (Swiss Federal Institute of Technology Lausanne)

Thursday, October 16, 2003

Localized Corrosion: Tribological and Mechanical Aspects

Co-Chairs: S. Mischler and M. Stack

8:30721 Some Views on the Construction of Tribo-Corrosion Maps in Aqueous Environments - M.M. Stack (University of Strathclyde)
9:00722 Fretting Corrosion Behavior of a Titanium Alloy in a Sodium Chloride Solution - S. Barril, S. Mischler, and D. Landolt (Ecole Polytechnique Federale de Lausanne)
9:15723 Modelling the Transient Current from two Scratch Electrode Configurations - C. Olsson (EPFL) and M. Stemp (Stuart Energy Systems)
9:30 Thirty-Minute Intermission
10:00724 Corrosive Wear of a Stainless Steel in Pressurized High Temperature Water - J.M. Georges (Ecole Centrale de Lyon), D. Kaczoroswki (Framatome), S. Bec, B. Vannes (Ecole Centrale de Lyon), J.P. Vernot, and P. Combrade (Framatome)
10:30725 A Local Approach of the Synergy Between Local Heterogeneities, Mechanical Stresses and the Passive Film in Pitting Corrosion of Stainless Steels Part I : Experimental Results - B. Malki (LTPCM), V. Vignal, R. Oltra (LRRS), B. Baroux, L. Peguet (LTPCM), J.M. Olive, H. Saadaoui (LMP), and N. Mary (LRRS)
10:45726 A Local Approach of the Synergy Between Local Heterogeneities, Mechanical Stresses and the Passive Film in Pitting Corrosion of Stainless Steels Part II : Computer Simulations at Open Circuit Potential - B. Malki (LTPCM), V. Vignal, R. Oltra (LRRS), B. Baroux, L. Peguet (LTPCM), J.M. Olive, H. Saadaoui (LMP), and N. Mary (LRRS)
11:00727 Algorithms and Computing Architectures for Solving Differential-Algebraic Equation Systems Typically Encountered in Models of Corrosion Pit Initiation - J. Gray (University of Illinois at Urbana-Champaign), C. Homescu, L. Petzold (University of California, Santa Barbara), and R. Alkire (University of Illinois at Urbana-Champaign)
11:15728 Interaction of Mechanical and Electrochemical Factors in the Tribocorrosion of Stainless Steel in Sulphuric Adic - S. Mischler, M. Stemp, and D. Landolt (Swiss Federal Institute of Technology)

Characterization of Corrosion Processes

Co-Chairs: G. Frankel and M. Orazem

2:00729 Current and Potential Distributions for Submerged Stationary Disk and Hemispherical Electrodes under Jet impingement - P. Shukla and M. Orazem (University of Florida)
2:30730 Analysis of Electrochemical Impedance Data for Alloy C-22 in Prototypical High Level Nuclear Waste Environments - D. Macdonald, A. Sun (Pennsylvania State University), N. Priyantha, and P. Jayaweera (SRI International)
2:45731 Analysis of Electrochemical Impedance Data for Iron in Borate Buffer Solutions - J. Liu (ATMI Inc), B. Marx, and D. Macdonald (Pennsylvania State University)
3:00732 Assessment of Pipeline Condition Using Heterogeneous Input Data - C. Qiu and M. Orazem (University of Florida)
3:15 Fifteen-Minute Intermission
3:30733 Electrodissolution of Cobalt in Carbonate/Bicarbonate media - B. Tribollet (UPR)
3:45734 Mechanism of Cathodic Delamination Control of Zinc-Aluminum-Phosphate Pigment in Waterborne Coatings - M. Hernandez (Universidad Nacional Autonoma de Mexico), F. Galliano, and D. Landolt (Ecole Polytechnique Federale de Lausanne)
4:00735 EIS Investigation of CO2/H2S Corrosion - K.-L.J. Lee and S. Nesic (Ohio University)
4:15736 Electrochemical Investigation of CO2 Corrosion of Mild Steel in the Presence of HAc - K. George and S. Nesic (Ohio University)
4:30737 Film Growth and Dissolution of X-65 Steel Exposed in CO2 (aq) and H2S (aq) Under Hydrodynamic Conditions - H. Castaneda, E. Sosa, and C. Angeles (Instituto Mexicano del Petroleo)




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