204th Meeting of The Electrochemical Society, Co-sponsored in Part by the Electronics Division of The American Ceramic Society
October 12-October 16, 2003
PROGRAM INFORMATION
J1 - Characterization, Mechanistic Models, and Transport Aspects of Cathodic and Anodic Processes, In Honor of Dieter Landolt
Electrodeposition/Corrosion
Monday, October 13, 2003
Emerald Room, Ground Level
Electrodeposition of Nanostructures
Co-Chairs: M. Matlosz and E. Podlaha
New Developments and High Aspects Ratio Deposition
Co-Chairs: W. Plieth, J. Kelly, and C. Bonhote
| Time | Abs# | Title |
|---|
| 2:00 | 678 |
Electrodeposited of Alumina-NiCu, FeW and NiW Nanocomposites - E. Podlaha, A. Panda, J. Armstrong, and G. Sanchez (Louisiana State University) |
| 2:30 | 679 |
Pulse Plating of Ni-W Alloys - S. Franz (Politecnico di Milano), A. Marlot, and D. Landolt (Swiss Federal Institute of Technology Lausanne) |
| 2:45 | 680 |
Effects of Additives on Copper Electrodeposition in Submicrometer Trenches - M. Hasegawa, Y. Negishi, T. Yokoshima, T. Nakanishi, and T. Osaka (Waseda University) |
| 3:00 | 681 |
Electrochemical Investigation of Electroless Deposition from DMAB Based Solutions - D. Casey, K. Reynolds, M. O'Connell, and J. Rohan (NMRC) |
| 3:15 | |
Fifteen-Minute Intermission |
| 3:30 | 682 |
Alloys and Intermetallic Compounds: The Development of Crystallographic Structure - W. Plieth (Dresden University of Technology) |
| 4:00 | 683 |
Residual Stress and Magnetic Properties of Pulse-Reverse Electrodeposited High Aspect Ratio CoNiP Micro-arrays Magnets - S. Guan (University of Minnesota-Twin Cities) and B. Nelson (Swiss Federal Institute of Technology) |
| 4:15 | 684 |
High Rate Through-Mask Deposition of Copper for MEMS and WL-CSP Applications - B. Kim, D. Erickson, T. Ritzdorf (Semitool, Inc.), S. Christian, and R. Forman (Shipley Company, L.L.C.) |
| 4:30 | 685 |
Properties of Nanocrystalline Ni-Fe Alloys Using Microelectroforming in Mold Insert - K.-L. Ou (Taippei Medical University), Y.-M. Yeh (National Chiao Tung University), S.-Y. Chiou (National Kaohsiung University of Applied Science), and S. Lee (Taippei Medical University) |
| 4:45 | 686 |
Texture, Microstructure, and Mechanical Properties of NiMn Alloy Electrodeposits - A. Talin, J. Kelly, S. Goods, G. Lucadamo, and N. Yang (Sandia National Laboratories) |
| 5:00 | 687 |
Low-Stress High Performance Soft Magnetic Materials For MEMS From Additive-Free Chloride Baths - N. Myung, E. Urgiles, K.-A. Son, C.-S. Lee, and T. George (California Institute of Technology) |
Tuesday, October 14, 2003
Experimental Development in Electrodeposition Processes and Surface Structuring
Co-Chairs: S. Roy and T. Osaka
| Time | Abs# | Title |
|---|
| 8:30 | 688 |
Electrochemical Microfabrication without Photolithography - J.D. Whitaker and D.T. Schwartz (University of Washington) |
| 9:00 | 689 |
Triggering Local Reactivity on Semiconductor Surfaces - P. Schmuki (University of Erlangen-Nuremberg), R. Gassilloud (Swiss Federal Laboratories for Materials Testing and Research (EMPA)), L. Santinacci (University of Erlangen-Nuremberg), J. Michler (Swiss Federal Laboratories for Materials Testing and Research (EMPA)), and M. Hueppe (University of Erlangen-Nuremberg) |
| 9:15 | 690 |
Fabrication of Metal Dot Array on Aluminum by AFM Probe Processing - Z. Kato, M. Sakairi, and H. Takahashi (Hokkaido University) |
| 9:30 | |
Thirty-Minute Intermission |
| 10:00 | 691 |
Superconformal Film Growth - T. Moffat, D. Wheeler, B. Baker, and D. Josell (NIST) |
| 10:30 | 692 |
Electrode Reactions of Group 4 Transition Metal Ions in Lewis Acidic AlCl3-EtMeImCl Ionic Liquids - T. Tsuda, C. Hussey (The University of Mississippi), and G. Stafford (National Institute of Standards and Technology) |
| 10:45 | 693 |
Electrodeposition of Cs and Sr Ions from the Tri-n-butylmethylammonium Triflate Ionic Liquid - P.-Y. Chen and C. Hussey (The University of Mississippi) |
| 11:00 | 694 |
Influence of Ferric Ion on Magnetic Properties of High Moment CoFe Electrodeposited Thin Films - K. Imai, T. Yokoshima, and T. Osaka (Waseda University) |
| 11:15 | 695 |
Characterization of Mass Transfer During Copper Electrodeposition - M. Alodan, F. Almubaddal, F. Abdullaleem, and M. Imtiaz (King Saud University) |
| 11:30 | 696 |
Analysis of CV Hysteresis by PEG and Chloride Ion in Copper Electroplating - M. Hayase, M. Taketani, T. Hatsuzawa (Tokyo Institute of Technology), and K. Hayabusa (Ebara Research Company) |
Modeling of Electrodeposition Processes
Co-Chairs: T. Moffat and A. West
| Time | Abs# | Title |
|---|
| 2:00 | 697 |
Simulation of the Influence of Reactant Depletion On Nucleation Rate in Electrodeposition - M. Zheng and A. West (Columbia University) |
| 2:30 | 698 |
Parameter Estimation of a Copper Electrodeposition Additive Mechanism using Data Obtained from a D-Optimal Experimental Design - T. Drews, F. Xue, X. Li (University of Illinois at Urbana-Champaign), H. Deligianni, P. Vereecken, E. Cooper, P. Andricacos (IBM Research), R. Braatz, and R. Alkire (University of Illinois at Urbana-Champaign) |
| 2:45 | 699 |
Atomic-Scale Kinetic Monte Carlo Simulations of Copper Nucleation: Investigation of Attachment Limited Rate Laws - T. Drews (University of Illinois at Urbana-Champaign), A. Radisic, J. Erlebacher (Johns Hopkins University), R. Braatz (University of Illinois at Urbana-Champaign), P. Searson (Johns Hopkins University), and R. Alkire (University of Illinois at Urbana-Champaign) |
| 3:00 | 700 |
Controlled Current Methods in Studies of Nucleation and Growth - P. Adcock (Los Alamos National Laboratory) |
| 3:15 | |
Fifteen-Minute Intermission |
| 3:30 | 701 |
Use of High Performance Computingn Tools to Integrate Experimental Data with Multi-Scale Simulations of Copper Electrodeposition with Additives - R. Alkire (University of Illinois) |
| 4:00 | 702 |
A Comprehensive Electrochemical Modeling Tool for Simulating Tertiary Current Distributions - J.-C. Sheu, S. Lowry (CFD Research Corporation), and L. Gochberg (Novellus Systems, Inc.) |
| 4:15 | 703 |
Electrodeposited Ni-Zn-P Coatings as Substitute for Cadmium/Experimental Studies and Mathematical Modeling - S.P. Kumaraguru, B. Veeraraghavan, and B. Popov (University of South Carolina) |
| 4:30 | 704 |
Electrodeposition of a Combinatorial Library of Binary Cu_1-xZnx Alloys - S. Beattie and J. Dahn (Dalhousie University) |
| 4:45 | 705 |
Combinatorial Electrodeposition of Ternary Alloys - S. Beattie and J. Dahn (Dalhousie University) |
Wednesday, October 15, 2003
In-Situ Characterization of Surface Stability, Oxidation, or Deposition
Co-Chairs: P. Schmutz and M. Seo
| Time | Abs# | Title |
|---|
| 10:00 | 706 |
EQCM Studies of Anodic Film Growth - C. Olsson (EPFL) |
| 10:30 | 707 |
EQCM and Stress Analyses of Electrodeposition Process Accompanying Potential Oscillations - M. Seo and M. Hagioi (Hokkaido University) |
| 10:45 | 708 |
Titanium Oxide Film Growth Studied with the RRD/EQCM Technique - M.-G. Vergé, C. Olsson, and D. Landolt (Ecole Polytechnique Federale de Lausanne) |
| 11:00 | 709 |
EQCM and Switch-Flow Cell Set Up Applied to Adsorption Studies - F. Galliano, C. Olsson, and D. Landolt (EPFL - Institut des Matériaux - LMCH) |
| 11:15 | 710 |
Anodically Deposited Oxygen Evolution Anodes for Seawater Electrolysis - K. Hashimoto (Tohoku Institue of Technology), K. Izumiya (Mitsui Shipbuilding and Engineering Co.Ltd), N. Kumagai (Daiki Engineering Co. Ltd.), S. Meguro (Tohoku Institue of Technology), K. Asami (Tohoku University), and N. Abdel Ghany (Tohoku Institue of Technology) |
| 11:30 | 711 |
The Concentration and Temperature Borders of Copper Local Corrosion in Hydrocarbonate-Formiate Solutions - E. Neupokoeva, S. Kaluzhina, and I. Ryzhkova (Voronezh State University) |
Surface Characterization and Microstructuration
Co-Chairs: C. Olsson and H.H. Strehblow
| Time | Abs# | Title |
|---|
| 2:00 | 712 |
Passivation Mechanisms Emerging From Surface Chemical and Structural Analysis by XPS and STM and Atomic Scale Modeling - P. MARCUS (CNRS) |
| 2:30 | 713 |
Influence of Additive Elements on Passive Films on Fe-18Cr Alloy - H. Tsuchiya, S. Fujimoto (Osaka University), and T. Shibata (Fukui University of Technology) |
| 2:45 | 714 |
Characterization of the Region around MnS Inclusions in Stainless Steels - Q. Meng, G. Frankel, H. Colijn, and S. Goss (The Ohio State University) |
| 3:00 | 715 |
Electrochemical Surface Nitriding of SUS 304 Austenitic Stainless Steel - H. Tsujimura, T. Goto, and Y. Ito (Kyoto University) |
| 3:15 | |
Fifteen-Minute Intermission |
| 3:30 | 716 |
From the Electrochemical Double Layer to Duplex Anodic Films, a Summary on the Application of XPS and other Surface Analytical Methods in Electrochemistry and Corrosion Science - H.-H. Strehblow (Heinrich-Heine-Universitaet) |
| 4:00 | 717 |
Snapshots of an Electrochemical Interface: A Study of the Interfacial Structure at Cu(111) from Hydrogen Evolution through Initial Stages of Oxide Formation with DFT - C. Taylor, R. Kelly, and M. Neurock (University of Virginia) |
| 4:15 | 718 |
Electrochemical Micromachining of Metals through an Electrophoretically Deposited Epoxy Mask - P. Kern (Swiss Federal Laboratories for Materials Testing and Research (EMPA)), P.-F. Chauvy, and D. Landolt (Swiss Federal Institute of Technology Lausanne (EPFL)) |
| 4:30 | 719 |
Electrochemical Micromachining of Titanium using Oxide Film Laser Lithography - P.-F. Chauvy and D. Landolt (EPFL) |
| 4:45 | 720 |
Scale-Resolved Electrochemical Surface Structuring of Titanium for Biological Applications - O. Zinger (Swiss Federal Institute of Technology Lausanne), K. Anselme (University of Littoral Cote d'Opale), P. Habersetzer (Institut Straumann AG), P.-F. Chauvy, and D. Landolt (Swiss Federal Institute of Technology Lausanne) |
Thursday, October 16, 2003
Localized Corrosion: Tribological and Mechanical Aspects
Co-Chairs: S. Mischler and M. Stack
| Time | Abs# | Title |
|---|
| 8:30 | 721 |
Some Views on the Construction of Tribo-Corrosion Maps in Aqueous Environments - M.M. Stack (University of Strathclyde) |
| 9:00 | 722 |
Fretting Corrosion Behavior of a Titanium Alloy in a Sodium Chloride Solution - S. Barril, S. Mischler, and D. Landolt (Ecole Polytechnique Federale de Lausanne) |
| 9:15 | 723 |
Modelling the Transient Current from two Scratch Electrode Configurations - C. Olsson (EPFL) and M. Stemp (Stuart Energy Systems) |
| 9:30 | |
Thirty-Minute Intermission |
| 10:00 | 724 |
Corrosive Wear of a Stainless Steel in Pressurized High Temperature Water - J.M. Georges (Ecole Centrale de Lyon), D. Kaczoroswki (Framatome), S. Bec, B. Vannes (Ecole Centrale de Lyon), J.P. Vernot, and P. Combrade (Framatome) |
| 10:30 | 725 |
A Local Approach of the Synergy Between Local Heterogeneities, Mechanical Stresses and the Passive Film in Pitting Corrosion of Stainless Steels Part I : Experimental Results - B. Malki (LTPCM), V. Vignal, R. Oltra (LRRS), B. Baroux, L. Peguet (LTPCM), J.M. Olive, H. Saadaoui (LMP), and N. Mary (LRRS) |
| 10:45 | 726 |
A Local Approach of the Synergy Between Local Heterogeneities, Mechanical Stresses and the Passive Film in Pitting Corrosion of Stainless Steels Part II : Computer Simulations at Open Circuit Potential - B. Malki (LTPCM), V. Vignal, R. Oltra (LRRS), B. Baroux, L. Peguet (LTPCM), J.M. Olive, H. Saadaoui (LMP), and N. Mary (LRRS) |
| 11:00 | 727 |
Algorithms and Computing Architectures for Solving Differential-Algebraic Equation Systems Typically Encountered in Models of Corrosion Pit Initiation - J. Gray (University of Illinois at Urbana-Champaign), C. Homescu, L. Petzold (University of California, Santa Barbara), and R. Alkire (University of Illinois at Urbana-Champaign) |
| 11:15 | 728 |
Interaction of Mechanical and Electrochemical Factors in the Tribocorrosion of Stainless Steel in Sulphuric Adic - S. Mischler, M. Stemp, and D. Landolt (Swiss Federal Institute of Technology) |
Characterization of Corrosion Processes
Co-Chairs: G. Frankel and M. Orazem
|