204th Meeting of The Electrochemical Society, Co-sponsored in Part by the Electronics Division of The American Ceramic Society
October 12-October 16, 2003
PROGRAM INFORMATION
R1 - LTCC Based Electronic Devices
High Temperature Materials/Electronics Division of The American Ceramic Society
Tuesday, October 14, 2003
Exhibit Hall, Ground Level
Technical Exhibit and Poster Session
Co-Chair: W. Wong-Ng
Wednesday, October 15, 2003
Knave Room, Lobby Level
Processing and Reliability I
Co-Chair: M. Nair
Thermoelectric Materials
Co-Chair: G. Nolas
Thursday, October 16, 2003
Processing and Reliability II
Co-Chair: P. Clem
Time | Abs# | Title |
8:00 | 1152 |
Design of Integrated Modules for Wireless and RF Applications using Multi-Mix Microtechnology and Green Tape™ LTCC Materials - D. Amey, T. Mobley (E.I. DuPont), and J. Logothetis (Merrimac Industries) |
8:30 | 1153 |
Novel LTCC Fabrication Techniques Applied to a Rolled Micro Ion Mobility Spectrometer - K. Peterson, S. Rohde, K. Pfeifer, and T. Turner (Sandia National Laboratories) |
9:00 | 1154 |
Sol-Gel Derived Barium Zirconium Titanate Thin Films for Capacitor Applications - A. Dixit, S.B. Majumder, R.S. Katiyer (University of Puerto Rico), and A.S. Bhalla (Pennsylvania State University) |
9:30 | |
Thirty-Minute Intermission |
10:00 | 1155 |
Thermomechanical Reliability of LTCC Solder Attachments - C.-Y. Fu (Motorola Labs) |
10:30 | 1156 |
Interfacial Reactions in LTCC Materials - L. Cook, W. Wong-Ng, and J. Suh (National Institute of Standards and Technology) |
11:00 | 1157 |
LTCC's Role as the Preferred Medium for Integration of RF Modules - M. Ehlert (National Semiconductor Corporation) |
Devices and Applications
Co-Chair: T. Armstrong
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