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An ECS Institutional Membership admits organizations to an elite group of scientists, academics, and professionals. Join and open the door to a vast array of information, people, and breaking research in electrochemistry and solid state science and technology.

Learn how customizable benefits packages save your organization up to 25 percent on the ECS Institutional Membership Program.

RENEW – JOIN today!
Contact Anna Olsen for more information.

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Upcoming maintenance to the JES and JSS ScholarOne sites will result in the submission system being unavailable from Wednesday, September 30, from 1900h ET until 2100h ET. A maintenance notice will be in place when users try to access the site.

Below are specific times that ScholarOne will be unavailable in your time zone.

  • Los Angeles, U.S.  |  Sep 30, 2020  | 1600h – 1800h PT
  • New York, U.S.  |  Sep 30, 2020  | 1900h – 2100h ET
  • Greenwich Mean Time  | Sep 30, 2020 – Oct 1,2020  | 2300h – 100h GMT
  • New Delhi, India  |  Oct 1, 2020  | 430h – 630h IST
  • Beijing, China  | Oct 1, 2020  | 700h – 900h CST 
  • Tokyo, Japan  |  Oct 1, 2020  | 800h – 1000h JST 
  • Sydney, Australia  |  Oct 1, 2020  | 900h – 1100h AEST

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Science’s Time to Shine

Greg Jackson on changing perceptions and new opportunities

In our series, The ECS Community Adapts and Advances, Greg Jackson reflects on changing perceptions of science and difficulties meeting goals in the shadow of COVID-19. Greg is professor of mechanical engineering at the Colorado School of Mines (CSM). His research group focuses on solar energy storage in solid-oxide electrochemical systems. Greg received his PhD from Cornell University. After working at Precision Combustion, Inc., he spent 15 years in the Department of Mechanical Engineering at the University of Maryland where he was Associate Director of the Energy Research Center. At ECS, Greg chaired the High-Temperature Energy, Materials & Processes Division, and served on the Board. He recently stepped back from administrative positions to teach more and spend time with his kids. (more…)

Interface Fall Issue is Here!

Fall is here and with the changing of the leaves comes the arrival of Interface. As we are still affected by the impact of the global COVID-19 pandemic, we decided to publish the fall 2020 issue of Interface in a digital format only. As a member of the Society, I’m thrilled to give you a first glimpse into our most recent issue. Published today, it focuses on a very timely topic, Electrochemistry for a Sustainable World, guest edited by Paul Kenis.

Read Now (more…)

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ECS is proud to present Prof. Dr. Shelley D. Minteer via webinar on October 14, 2020, at 1300 EST.

Bioelectrocatalysis for Electrosynthesis

Dr. Shelley D. Minteer
Professor 
Departments of Chemistry and Materials Science and Engineering
University of Utah

Date: October 14, 2020

Time: 1300-1400h EST (more…)

5 Questions with Dr. Nam-Gyu Park

Dr. Nam-Gyu ParkThe PRiME Lecture will take place as an online event on Monday, October 5, 2020, starting at 2000h EDT / Tuesday, October 6, 2020, at 0900h JST & KST. Visit here to register for this event.

Dr. Nam-Gyu Park, Professor and SKKU-Fellow at the School of Chemical Engineering at Sungkyunkwan University, will lead the PRiME 2020 plenary this year as the featured lecturer, presenting his talk, “Perovskite Solar Cells: Past 10 Years and Next 10 Years.”

What’s it all about? Dr. Park, a solid-state perovskite solar cell pioneer, chatted with ECS and shared the message behind his talk, including his work with perovskite solar cells, the materials significance to the science community as a whole, and the future of the promising material. (more…)

Trust in Peer Review

Peer Review Week 2020 is underway. This yearly global event celebrates the essential role that peer review plays in maintaining scientific quality. This year’s theme, Trust in Peer Review, centers on how the peer review process works and why it helps build trust in scholarly research.

Join the global conversation about peer review by tweeting @PeerRevWeek and following #PeerRevWeek20 and #TrustinPeerReview.

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Spread the News about PRiME 2020

Enjoy free, unlimited access!

ECS is reaching out to the community—our volunteer leaders, people registered to attend PRiME 2020, and people presenting during PRiME—to help spread the news that it’s free for attendees to register for the online meeting. Attendees can access all symposia and live events at no charge. However, registration for the event is required. Thank you to PRiME 2020 presenters whose nominal registration fee helps fund free access for the global community. (more…)

Coping with Chaos

Alice Suroviec on juggling home, work—and a transformed tomorrow

For our series, The ECS Community Adapts and Advances, Alice Suroviec describes pandemic-related challenges—and benefits—of being a mother, professor, scientist, researcher, administrator, homeschooler, and crisis manager. Alice is Professor of Bioanalytical Chemistry and Dean of the College of Medical and Natural Sciences at Berry College, Georgia, U.S. Her research focuses on enzymatically modified electrodes for use as biosensors and the use of self-assembled monolayers on gold nanoparticles. Alice is associate editor of the Journal of The Electrochemical Society and guest editor of Interface. Formerly chair of the Division of Physical and Analytical Electrochemistry, Alice now chairs the ECS Ad Hoc Committee on Diversity and Inclusivity, and serves on the ECS Individual Membership Committee and the Interdisciplinary Science and Technology Subcommittee. (more…)

Call for Papers

ECS Journal of Solid State Science and Technology
Focus Issue on Semiconductor Wafer Bonding: Science, Technology, and Applications

The ECS Journal of Solid State Science and Technology is publishing a focus issue in connection with the Semiconductor Wafer Bonding: Science, Technology, and Applications 16 Symposium taking place during PRiME 2020.

Submissions are open to all authors including authors presenting during PRiME 2020.

Wafer bonding as stacking and joining of semiconductor and similar wafers is an important process step in microelectronics, microsystems, and related technologies. It allows the realization of engineered substrates like SOI wafers for modern microelectronics, 3D integration for very high-density electronics, capping and integration of MEMS, silicon based micro fluidics, and thin wafer processing, for example. Wafer bonding processes are typically very complex. The materials of the substrates and bonding layers, the physical understanding of the actual wafer bonding process, and its successful and reproducible execution in product development and production, specialized equipment, characterizations and metrology are all very important. The significance of wafer bonding and the complexity of the related technologies ensures that it is a very interesting field of research and development, which attracts many industry and institutional researchers. (more…)