The Electrochemical Society and Wiley have renewed a publishing partnership to enhance ECS’s book series with the goal of publishing multiple titles per year. ECS’s long-time sponsored series in publishing cooperation with Wiley provides authoritative, detailed accounts on specific topics in electrochemistry and solid state science and technology. Through this partnership, the Society is able to offer the research community access to world-class editors, marketers, and product designers to ensure that from writing the first word to reaching the first reader, the ECS community has a robust support network of publishing professionals to help an author develop and publish their best work. (more…)

ECS is set to participate in its sixth International Open Access Week, an annual event organized by SPARC, the Scholarly Publishing and Academic Resources Coalition. From October 19-26, ECS takes down the paywall to the entire ECS Digital Library on IOPscience, making over 160,000 scientific articles and abstracts free and accessible to everyone.

This year’s theme, “Open with Purpose: Taking Action to Build Structural Equity and Inclusion,” supports ECS’s long-term vision to Free the Science by providing access to all in order to further advance research. ECS publications showcase research that directly addresses the sustainability of the planet. Electrochemistry and solid state science continue to hold the keys to innovation in renewable energy, biomedical applications, water and sanitation, communications, transportation, technology, infrastructure, and beyond.

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Taking Advantage of ECS Plus

ECS Plus launched in 2016, and since its inception has flourished as a transparent read and publish transformative agreement.

If your institution subscribes to ECS Plus, you are granted full access to all the content available in the ECS Digital Library on IOPscience. By claiming one of your unlimited article credits, you may also publish articles free of charge as open access in ECS journals. 

As an author affiliated with an ECS Plus subscriber, publishing your work as open access is easy. (more…)

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Upcoming maintenance to the JES and JSS ScholarOne sites will result in the submission system being unavailable from Wednesday, September 30, from 1900h ET until 2100h ET. A maintenance notice will be in place when users try to access the site.

Below are specific times that ScholarOne will be unavailable in your time zone.

  • Los Angeles, U.S.  |  Sep 30, 2020  | 1600h – 1800h PT
  • New York, U.S.  |  Sep 30, 2020  | 1900h – 2100h ET
  • Greenwich Mean Time  | Sep 30, 2020 – Oct 1,2020  | 2300h – 100h GMT
  • New Delhi, India  |  Oct 1, 2020  | 430h – 630h IST
  • Beijing, China  | Oct 1, 2020  | 700h – 900h CST 
  • Tokyo, Japan  |  Oct 1, 2020  | 800h – 1000h JST 
  • Sydney, Australia  |  Oct 1, 2020  | 900h – 1100h AEST

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Trust in Peer Review

Peer Review Week 2020 is underway. This yearly global event celebrates the essential role that peer review plays in maintaining scientific quality. This year’s theme, Trust in Peer Review, centers on how the peer review process works and why it helps build trust in scholarly research.

Join the global conversation about peer review by tweeting @PeerRevWeek and following #PeerRevWeek20 and #TrustinPeerReview.

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Call for Papers

ECS Journal of Solid State Science and Technology
Focus Issue on Semiconductor Wafer Bonding: Science, Technology, and Applications

The ECS Journal of Solid State Science and Technology is publishing a focus issue in connection with the Semiconductor Wafer Bonding: Science, Technology, and Applications 16 Symposium taking place during PRiME 2020.

Submissions are open to all authors including authors presenting during PRiME 2020.

Wafer bonding as stacking and joining of semiconductor and similar wafers is an important process step in microelectronics, microsystems, and related technologies. It allows the realization of engineered substrates like SOI wafers for modern microelectronics, 3D integration for very high-density electronics, capping and integration of MEMS, silicon based micro fluidics, and thin wafer processing, for example. Wafer bonding processes are typically very complex. The materials of the substrates and bonding layers, the physical understanding of the actual wafer bonding process, and its successful and reproducible execution in product development and production, specialized equipment, characterizations and metrology are all very important. The significance of wafer bonding and the complexity of the related technologies ensures that it is a very interesting field of research and development, which attracts many industry and institutional researchers. (more…)

IOPscience is IOP Publishing (IOPP)’s online publishing platform, and host of ECS content since the beginning of 2020. Users experiencing issues in downloading ECS content from IOPscience should first check that they are using an IOPP preferred browser. IOPP now only works with browsers which receive regular security updates from Microsoft, for example Edge, Chrome, Firefox, and Safari. Internet Explorer (IE) is not an IOPP preferred browser because it is no longer supported by Microsoft and does not receive regular security updates. (more…)

Call for Papers

Journal of The Electrochemical Society
Focus Issue on Future of Intercalation Chemistry for Energy Storage and Conversion in Honor of M. Stanley Whittingham

The Journal of The Electrochemical Society is publishing a focus issue in connection with the Intercalation Chemistry for Electrochemical Energy Storage Technologies: In Honor of M. Stanley Whittingham Symposium taking place during PRiME 2020. (more…)

Call for Papers

Journal of The Electrochemical Society
Focus Issue on Recent Advances in Chemical and Biological Sensors & Micro-Nanofabricated Sensors and Systems

The Journal of The Electrochemical Society is publishing a focus issue in connection with the Sensors Symposia (M01, M02 & M03) taking place during PRiME 2020.

This focus issue highlights recent advances in the field of chemical sensors (gas, liquid, and other types), including molecular recognition surfaces, transduction methods, and integrated micro-nano-sensor systems.

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Third quarter maintenance for the JES and JSS ScholarOne sites is scheduled for August 26, 2020.

Below are specific times that ScholarOne will be unavailable in your time zone.

  • New York, U.S. | Aug 26, 2020 | 7:00 pm – 11:00 pm EDT
  • Los Angeles, U.S. | Aug 26, 2020 | 4:00 pm – 8:00 PDT
  • Greenwich Mean Time | Aug 26-27, 2020 | 11:00 pm – 3:00 am GMT
  • New Delhi, India | Aug 27, 2020 | 4:30 am – 8:30 am IST
  • Beijing, China | Aug 27, 2020 | 7:00 am – 11:00 am CST
  • Tokyo, Japan | Aug 27, 2020 | 8:00 am – noon JST
  • Sydney, Australia | Aug 27, 2020 | 9:00 am – 1:00 pm AEST

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