Focus Issue on Semiconductor Wafer Bonding: Science, Technology, and Applications

Call for Papers

ECS Journal of Solid State Science and Technology
Focus Issue on Semiconductor Wafer Bonding: Science, Technology, and Applications

The ECS Journal of Solid State Science and Technology is publishing a focus issue in connection with the Semiconductor Wafer Bonding: Science, Technology, and Applications 16 Symposium taking place during PRiME 2020.

Submissions are open to all authors including authors presenting during PRiME 2020.

Wafer bonding as stacking and joining of semiconductor and similar wafers is an important process step in microelectronics, microsystems, and related technologies. It allows the realization of engineered substrates like SOI wafers for modern microelectronics, 3D integration for very high-density electronics, capping and integration of MEMS, silicon based micro fluidics, and thin wafer processing, for example. Wafer bonding processes are typically very complex. The materials of the substrates and bonding layers, the physical understanding of the actual wafer bonding process, and its successful and reproducible execution in product development and production, specialized equipment, characterizations and metrology are all very important. The significance of wafer bonding and the complexity of the related technologies ensures that it is a very interesting field of research and development, which attracts many industry and institutional researchers.

Topics covered in this focus issue include, but are not limited to: 

  • All kinds of wafer bonding processes like semiconductor direct, anodic, thermo-compression (glass, polymer, metal), and surface activated wafer bonding
  • Wafer bonding technologies techniques for electronics and MEMS fabrication
  • 3D integration (wafer to wafer and chip-wafer or micro-transfer printing) using wafer bonding techniques
  • Industrial applications of wafer-bonding (e.g. automotive, medical, industrial or optical applications)
  • Interaction of wafer-bonded MEMS with subsequent fabrication steps (singulation, wire bonding, soldering, molding)
  • Characterization and reliability of wafer-bonded MEMS (yield, quality, strength, fatigue, hermeticity)
  • Metrology in wafer bonding processes (IR, acoustic and other inspections or measurements before during and after wafer bonding)
  • Wafer bonding of non-semiconductor materials (polymers, glasses, ceramics)
  • Markets, trends, standardization, wafer bonding equipment and services (excluding commercial advertising)

Accepting Submissions: December 17, 2020 | Submission Deadline: March 17, 2021

SUBMIT TO JSS

(At the time of submission, indicate that the paper is intended for the Semiconductor Wafer Bonding focus issue.)


Guest Editors

Roy Knechtel, Schmalkalden University of Applied Science, Germany | r.knechtel@hs-sm.de
Chuan Seng Tan, Nanyang Technological University, Singapore | tancs@ntu.edu.sg
Tadatomo Suga, Meisei University, Japan | suga@gakushikai.jp
Helmut Baumgart, Old Dominion University, U.S. | hbaumgar@odu.edu
Frank Fournel, CEA-LETI, France | frank.fournel@cea.fr
Mark Goorsky, University of California Los Angeles, U.S. | goorsky@seas.ucla.edu
Karl D. Hobart, Naval Research Laboratory, U.S. | karl.hobart@nrl.navy.mil

Technical Editor

Jennifer A. Bardwell, National Research Council (retired), Canada | Jennifer.Bardwell@electrochem.org

Editor-in-Chief

Krishnan Rajeshwar, The University of Texas at Arlington, U.S. | rajeshwar@uta.edu

If selected at submission, accepted papers are published online in the ECS Digital Library within 24 hours of scheduling for publication. The version of record is published online within approximately 10 days of final acceptance. Articles are published in a standard issue of the journal as they are accepted. The focus issue is curated online with the final article published by August 2021.

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