Call for Papers

This focus issue of the ECS Journal of Solid State Science and Technology aims to cover emerging solid state electronic devices and materials for compound semiconductors, novel materials, Si-based processing, devices and integration, and photonic materials/devices. Solid state devices and materials have shown great potential in wide applications including electronics, photonics, and sensors. This focus issue addresses the development of novel materials with superior properties and technology shrinkage for industrial mass production. (more…)

Beginning January 1, 2021, The Electrochemical Society journals will accept submission of graphical abstracts for inclusion in the online publication of papers. The goal is to facilitate browsing within the tables of contents and to encourage interdisciplinary research among the topical interest areas.

Submitted graphics should present an easy-to-comprehend synopsis of the work reported in the paper, allowing readers to easily identify papers relevant to their particular research interests, without providing the specific results or any conclusions reached. Ideally, the image should be a single snapshot of the research presented which allows an expert in the field to understand the significance of the work while simultaneously encouraging the non-expert to read the paper. (more…)

Call for Papers

ECS Journal of Solid State Science and Technology
Focus Issue on Semiconductor Wafer Bonding: Science, Technology, and Applications

The ECS Journal of Solid State Science and Technology is publishing a focus issue in connection with the Semiconductor Wafer Bonding: Science, Technology, and Applications 16 Symposium that took place during PRiME 2020.

Submissions are open to all authors working in this field, including authors who presented during PRiME 2020.

Wafer bonding as stacking and joining of semiconductor and similar wafers is an important process step in microelectronics, microsystems, and related technologies. It allows the realization of engineered substrates like SOI wafers for modern microelectronics, 3D integration for very high-density electronics, capping and integration of MEMS, silicon based micro fluidics, and thin wafer processing, for example. Wafer bonding processes are typically very complex. The materials of the substrates and bonding layers, the physical understanding of the actual wafer bonding process, and its successful and reproducible execution in product development and production, specialized equipment, characterizations and metrology are all very important. The significance of wafer bonding and the complexity of the related technologies ensures that it is a very interesting field of research and development, which attracts many industry and institutional researchers. (more…)

Call for Papers

ECS Journal of Solid State Science and Technology
Focus Issue on 4D Materials and Systems + Soft Robotics

The ECS Journal of Solid State Science and Technology is publishing a focus issue in connection with the 4DMS+SoRo: 4D Materials & Systems + Soft Robotics Symposium that took place during PRiME 2020.

This focus issue accepts submissions on all aspects of additive manufacturing (3D and 4D printing) of solid state materials and systems with a focus on soft robotics. Topics of interest include, but are not limited to, innovative technologies and materials, materials processing, energy storage, batteries, energy harvesting, power transmission, electronic displays, artificial intelligence, sensors and actuators for soft robotics, etc. (more…)

Call for Papers

ECS Journal of Solid State Science and Technology
Focus Issue on Solid State Reviews

The ECS Journal of Solid State Science and Technology is publishing a collection of reviews, critical reviews (CRES3T), and perspective articles in the field of solid state science and technology.

The journal is accepting submissions across all technical areas. This includes:

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ECS Journal of Solid State Science and TechnologyTo recognize the innovative research gaining attention across the diverse span of its topical interest areas, the Society highlights the top five most-read journal articles in each area during each quarter of the year.

The most-read ECS Journal of Solid State Science and Technology articles by topical interest area during the second quarter of 2019 (April through June) are listed below.

Highlights are based on articles published since January 1, 2017.

Articles marked OA are open access.

 

(more…)

The Electrochemical Society has some exciting news! ECS has selected IOP Publishing (IOPP) as its journals publishing partner.

Starting in 2020, IOPP will partner with ECS in the publication of the Journal of the Electrochemical Society and the ECS Journal of Solid State Science and Technology and the hosting of ECS Transactions, ECS Meeting Abstracts, and Interface as well as the hosting of the archives for ECS’s retired publications—ECS Electrochemistry Letters, ECS Solid State Letters, Electrochemical and Solid State Letters, and ECS Proceedings Volumes.

Christopher Jannuzzi, executive director and CEO of ECS, said: “ECS has a 117+ year reputation for creating outstanding, peer-reviewed periodicals, conference proceedings, and magazines. We have a long-standing commitment to ensure the technical quality of the works published, as well as the integrity and validity of the peer review our community provides. (more…)

ECS Journal of Solid State Science and TechnologyTo recognize the innovative research gaining attention across the diverse span of its topical interest areas, the Society highlights the top five most-read journal articles in each area during each quarter of the year.

The most-read ECS Journal of Solid State Science and Technology articles by topical interest area during the first quarter of 2019 (January through March) are listed below.

Highlights are based on articles published since January 1, 2017.

ALL of the articles listed below are open access.

 

(more…)

Free the Science with ECS Plus

Free the Science Week wraps up this coming Sunday, April 7, but Free the Science—as a movement—continues all year round, propelled in large part by the institutions and authors that take advantage of the benefits of ECS Plus.

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ECS Supports Green Open Access

Free the Science Week celebrates those working to eliminate barriers to access for researchers around the world.

Yesterday’s blog post discussed ECS’s Author Choice Open Access program, which enables many authors to publish open access at no cost to them.

But did you know that the Society also supports green open access?

ECS’s green open access policy allows you to freely and immediately share the articles you publish in ECS journals without using an open access article credit or paying an article processing charge.

(more…)

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