Call for Papers 

Accepting Submissions: February 5, 2021 | Submission Deadline: May 5, 2021

The ECS Journal of Solid State Science and Technology is publishing a special collection of invited papers which were presented at the 6th International Conference on Nanoscience and Nanotechnology (ICONN-2021). (more…)

Call for Papers

This focus issue of the ECS Journal of Solid State Science and Technology aims to cover emerging solid state electronic devices and materials for compound semiconductors, novel materials, Si-based processing, devices and integration, and photonic materials/devices. Solid state devices and materials have shown great potential in wide applications including electronics, photonics, and sensors. This focus issue addresses the development of novel materials with superior properties and technology shrinkage for industrial mass production. (more…)

Call for Papers

ECS Journal of Solid State Science and Technology
Focus Issue on Photovoltaics for the 21st Century II

The ECS Journal of Solid State Science and Technology is publishing a special collection of invited and innovative papers which were presented at the 30th International Photovoltaic Science and Engineering Conference (PVSEC-30) & Global Photovoltaic Conference 2020 (GPVC 2020). (more…)

Call for Papers

ECS Journal of Solid State Science and Technology
Focus Issue on Semiconductor Wafer Bonding: Science, Technology, and Applications

The ECS Journal of Solid State Science and Technology is publishing a focus issue in connection with the Semiconductor Wafer Bonding: Science, Technology, and Applications 16 Symposium that took place during PRiME 2020.

Submissions are open to all authors working in this field, including authors who presented during PRiME 2020.

Wafer bonding as stacking and joining of semiconductor and similar wafers is an important process step in microelectronics, microsystems, and related technologies. It allows the realization of engineered substrates like SOI wafers for modern microelectronics, 3D integration for very high-density electronics, capping and integration of MEMS, silicon based micro fluidics, and thin wafer processing, for example. Wafer bonding processes are typically very complex. The materials of the substrates and bonding layers, the physical understanding of the actual wafer bonding process, and its successful and reproducible execution in product development and production, specialized equipment, characterizations and metrology are all very important. The significance of wafer bonding and the complexity of the related technologies ensures that it is a very interesting field of research and development, which attracts many industry and institutional researchers. (more…)

Call for Papers

Journal of The Electrochemical Society
Focus Issue on Future of Intercalation Chemistry for Energy Storage and Conversion in Honor of M. Stanley Whittingham

The Journal of The Electrochemical Society is publishing a focus issue in connection with the Intercalation Chemistry for Electrochemical Energy Storage Technologies: In Honor of M. Stanley Whittingham Symposium taking place during PRiME 2020. (more…)

Call for Papers

Journal of The Electrochemical Society
Focus Issue on Recent Advances in Chemical and Biological Sensors & Micro-Nanofabricated Sensors and Systems

The Journal of The Electrochemical Society is publishing a focus issue in connection with the Sensors Symposia (M01, M02 & M03) taking place during PRiME 2020.

This focus issue highlights recent advances in the field of chemical sensors (gas, liquid, and other types), including molecular recognition surfaces, transduction methods, and integrated micro-nano-sensor systems.

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Volume one of this focus issue is a collection of papers accepted to the International Meeting on Chemical Sensors (IMCS) which has been postponed to 2021. The deadline to submit papers for volume one has been extended to September 18, 2020.

Volume one of this focus issue is accepting papers covering topics related to the planned symposia from IMCS, which includes: (more…)

Call for Papers

ECS Journal of Solid State Science and Technology
Focus Issue on 4D Materials and Systems + Soft Robotics

The ECS Journal of Solid State Science and Technology is publishing a focus issue in connection with the 4DMS+SoRo: 4D Materials & Systems + Soft Robotics Symposium that took place during PRiME 2020.

This focus issue accepts submissions on all aspects of additive manufacturing (3D and 4D printing) of solid state materials and systems with a focus on soft robotics. Topics of interest include, but are not limited to, innovative technologies and materials, materials processing, energy storage, batteries, energy harvesting, power transmission, electronic displays, artificial intelligence, sensors and actuators for soft robotics, etc. (more…)

Call for Papers

ECS Journal of Solid State Science and Technology
Focus Issue on Solid State Reviews

The ECS Journal of Solid State Science and Technology is publishing a collection of reviews, critical reviews (CRES3T), and perspective articles in the field of solid state science and technology.

The journal is accepting submissions across all technical areas. This includes:

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The Electrochemical Society is pleased to announce that in lieu of IMLB 2020, the IMLB organizing committee has decided to publish papers of invited speakers to the 20th International Meeting on Lithium Batteries in a focus issue of the Journal of The Electrochemical Society (JES) dedicated to this meeting.

IMLB 2020 is the premier international conference on the state of lithium battery science and technology, as well as current and future related battery systems for application in transportation, industry, grid storage, aviation, aerospace, biomedical, and other promising sectors. Planned to convene in Berlin, Germany, the conference was expected to draw more than 1,000 experts, researchers, and company representatives. (more…)

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