Call for Papers
ECS Journal of Solid State Science and Technology
Focus Issue on Semiconductor Wafer Bonding: Science, Technology, and Applications
The ECS Journal of Solid State Science and Technology is publishing a focus issue in connection with the Semiconductor Wafer Bonding: Science, Technology, and Applications 16 Symposium taking place during PRiME 2020.
Submissions are open to all authors including authors presenting during PRiME 2020.
Wafer bonding as stacking and joining of semiconductor and similar wafers is an important process step in microelectronics, microsystems, and related technologies. It allows the realization of engineered substrates like SOI wafers for modern microelectronics, 3D integration for very high-density electronics, capping and integration of MEMS, silicon based micro fluidics, and thin wafer processing, for example. Wafer bonding processes are typically very complex. The materials of the substrates and bonding layers, the physical understanding of the actual wafer bonding process, and its successful and reproducible execution in product development and production, specialized equipment, characterizations and metrology are all very important. The significance of wafer bonding and the complexity of the related technologies ensures that it is a very interesting field of research and development, which attracts many industry and institutional researchers. (more…)