Session chairs serve as an integral role in the ECS meetings. We try our best to encourage early career risers, post-grads, and young authors to get involved in the meetings by acting as session chairs. Although this is a volunteer-based program, it is a great networking opportunity, as it puts you in front of other scientists, engineers, and researchers sharing their work.

Interested in being a session chair at a symposium in Dallas? Check out the Call for Papers and reach out to the lead organizer!

Read the guidelines for session chairs.

Deadline for Submitting Abstracts
December 14, 2018
Submit today!

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Symposium A04: Battery Student Slam 3

Symposium Focus: This special symposium is dedicated to students working on energy storage and energy conversion. In the student slam, we offer an opportunity for students to present flash oral presentations of their work in a 10-minute time slot. All students enrolled at any valid degree-granting institution may submit an abstract describing the presentation. Of particular interest are new materials and designs, performance studies, and modeling of all types of batteries, supercapacitors and fuel cells, including aqueous, non-aqueous, polymer electrolytes, solid electrolytes, and flow systems. We strongly encourage students to submit their papers to this symposium instead of other symposia sponsored by the Battery Division at this meeting. (more…)

Deadline for Submitting Abstracts
December 14, 2018
Submit today!

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Symposium I05: Heterogeneous Functional Materials for Energy Conversion and Storage 2

Symposium focus: This symposium will focus on the science that controls emergent properties in heterogeneous functional materials as a foundation for the design of functional material devices with performance not bounded by constituent properties.

Providing a unique venue for both contributed and invited speakers to present the latest advances in novel modeling approaches, advanced 3-D imaging and characterization techniques, novel material synthesis and manufacturing methods to create highly ordered material structure, and applications of heterogeneous functional materials in devices for energy conversion and storage.

This symposium especially encourages and welcomes contributed presentations. (more…)

Submit Your Abstract for ECEE 2019

Abstract submission for ECEE 2019 is now open!

Join us at the Electrochemical Conference on Energy and the Environment (ECEE 2019): Bioelectrochemistry and Energy Storage, which will be held in Glasgow, Scotland from July 21-26, 2019 at the Scottish Exhibition and Conference Center.

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Deadline for Submitting Abstracts
December 14, 2018
Submit today!

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Symposium G02: Processes at the Semiconductor Solution Interface 8

Symposium Focus: This symposium will address the most recent developments in processes at the semiconductor/solution interface including etching, oxidation, passivation, film growth, electrochemical and photoelectrochemical processes, water splitting, electrochemical surface science, electroluminescence, photoluminescence, surface texturing, and compound semiconductor electrodeposition, for photovoltaics, energy conversion, and related topics. It will include both invited and contributed papers on both fundamental and applied topics of both bulk and nanoscale materials.

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Moon PalaceOver 2,100 abstracts across 53 symposia from the upcoming AiMES 2018 Meeting in Cancun, Mexico are now available for download in the ECS Digital Library!

ECS Meeting Abstracts contain extended abstracts of the technical papers presented at the ECS biannual meetings, ECS joint meetings, and ECS-sponsored meetings. This publication offers a first look into the current research in the field. ECS Meeting Abstracts are freely available to all visitors of the ECS Digital Library.  Learn more about our other open access publishing opportunities here!

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Deadline for Submitting Abstracts
March 16, 2018
Submit today!

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Symposium G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8

Symposium Focus: This meeting is the 8th International ECS SiGe Symposium for the past 16 years (www.sigesymposium.com). It will provide a forum for people from industry, research institutions, and academics around the world to gather together in an unique and relaxed environment, reviewing and discussing materials and device related aspects of SiGe, Ge, and Related Compounds (Group IV incl. C and Sn alloys, and III/V on Si, as well as 2D materials). There are 10 areas of interests covering very broad spectrum from devices to fundamental material characterization, to stimulate information exchange and innovations, 1) Heterojunction Bipolar Transistors, 2) FET Technology, 3) Optoelectronics, 4) Epitaxy, 5) Emerging Applications, 6) Processing, 7) Strain Engineering, 8) Surfaces and Interfaces, 9) Related Compounds, 10) Metrology and Characterization.

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Deadline for Submitting Abstracts
March 16, 2018
Submit today!

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Symposium G01: Semiconductor Wafer Bonding: Science, Technology, and Applications 15

Symposium Focus: The fifteenth symposium solicits original theoretical and experimental papers that document new developments and cover the full range of basic science, process technologies, and product applications of semiconductor wafer bonding (direct, anodic, thermo-compression, eutectic, adhesive bonding). Besides permanent bonding, temporary wafer bonding technique deserves also to be discussed regarding all the recent development in many 3D applications. Fundamental aspects of interest include surface preparations for bonding, film transferring, low temperature bonding, surface activation at bonding interfaces, bonding techniques, novel material composites to synthesize heterostructures. Presentations characterizing currently utilized materials and processes, as well as novel approaches to new materials systems and modeling and process simulations are encouraged. Practical aspects of interest include innovative developments in product architecture and new integration and processing schemes for microelectronics, photonics, MEMS, microtechnologies, nanotechnologies and other relevant applications.

Invited Speakers from CEA-Leti, imec, EVG, KTH, Qromis, and more will be featured during the symposium.

Deadline for Submitting Abstracts
March 16, 2018
Submit today!

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Symposium H07: Electronic, Thermal, and Electrochemical Properties of Metal Organic Frameworks (MOFs): Technology, Applications, and Emerging Devices

Symposium Focus: The 1st International Symposium sponsored by the Electronics and Photonics Division of the Electrochemical Society brings together researchers in chemistry, materials science, physics, devices and process engineers and related interdisciplinary areas, to seek and capture the state-of-the art in MOF based fundamental aspects and latest technological applications. This symposium offers a new interdisciplinary and international platform, and aims to contribute towards advancing the fundamental understanding of the layered MOF thin films and aiming to improve technological applications thereof. Original contributions are solicited that cover all fundamental and applied aspects including electronic, thermal and electrochemical transport properties and phenomena, device/ system fabrication and integration of MOF thin films into emerging technological device applications. All oral presentations will be grouped into topical sessions. Invited Keynote speakers will present critical reviews covering recent advances and future directions in the diverse field of fundamental and applied MOF properties.

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Deadline for Submitting Abstracts
March 16, 2018
Submit today!

Speaker at ECS meetingTopic Close-up #6

Symposium G05: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB

Symposium Focus: This symposium focuses on issues pertinent to advances in semiconductor interconnects beyond the 20 nm technology node as well as novel materials and integration methods for 2.5D and 3D interconnects. An emerging technology or device architecture called 2.5D and 3D integration is based on the system performance gains that is achieved by chip stacking and vertically interconnecting distinct device layers. Since electrochemical processes are the ultimate solution to create smaller size and lower cost devices, both practical and fundamental aspects of electrochemical processes are of high demand. Ideally, this symposium will bring researchers together to discuss various aspects of device architecture, novel materials, chemical formulation, packaging approaches and nano-scale fabrication methodologies.

(more…)

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