Deadline for Submitting Abstracts
December 14, 2018
Submit today!

Topic Close-up #1

Symposium G02: Processes at the Semiconductor Solution Interface 8

Symposium Focus: This symposium will address the most recent developments in processes at the semiconductor/solution interface including etching, oxidation, passivation, film growth, electrochemical and photoelectrochemical processes, water splitting, electrochemical surface science, electroluminescence, photoluminescence, surface texturing, and compound semiconductor electrodeposition, for photovoltaics, energy conversion, and related topics. It will include both invited and contributed papers on both fundamental and applied topics of both bulk and nanoscale materials.

(more…)

Moon PalaceOver 2,100 abstracts across 53 symposia from the upcoming AiMES 2018 Meeting in Cancun, Mexico are now available for download in the ECS Digital Library!

ECS Meeting Abstracts contain extended abstracts of the technical papers presented at the ECS biannual meetings, ECS joint meetings, and ECS-sponsored meetings. This publication offers a first look into the current research in the field. ECS Meeting Abstracts are freely available to all visitors of the ECS Digital Library.  Learn more about our other open access publishing opportunities here!

(more…)

Deadline for Submitting Abstracts
March 16, 2018
Submit today!

Meeting speakerTopic Close-up #9

Symposium G03: SiGe, Ge, and Related Compounds: Materials, Processing, and Devices 8

Symposium Focus: This meeting is the 8th International ECS SiGe Symposium for the past 16 years (www.sigesymposium.com). It will provide a forum for people from industry, research institutions, and academics around the world to gather together in an unique and relaxed environment, reviewing and discussing materials and device related aspects of SiGe, Ge, and Related Compounds (Group IV incl. C and Sn alloys, and III/V on Si, as well as 2D materials). There are 10 areas of interests covering very broad spectrum from devices to fundamental material characterization, to stimulate information exchange and innovations, 1) Heterojunction Bipolar Transistors, 2) FET Technology, 3) Optoelectronics, 4) Epitaxy, 5) Emerging Applications, 6) Processing, 7) Strain Engineering, 8) Surfaces and Interfaces, 9) Related Compounds, 10) Metrology and Characterization.

(more…)

Deadline for Submitting Abstracts
March 16, 2018
Submit today!

Meeting SpeakerTopic Close-up #8

Symposium G01: Semiconductor Wafer Bonding: Science, Technology, and Applications 15

Symposium Focus: The fifteenth symposium solicits original theoretical and experimental papers that document new developments and cover the full range of basic science, process technologies, and product applications of semiconductor wafer bonding (direct, anodic, thermo-compression, eutectic, adhesive bonding). Besides permanent bonding, temporary wafer bonding technique deserves also to be discussed regarding all the recent development in many 3D applications. Fundamental aspects of interest include surface preparations for bonding, film transferring, low temperature bonding, surface activation at bonding interfaces, bonding techniques, novel material composites to synthesize heterostructures. Presentations characterizing currently utilized materials and processes, as well as novel approaches to new materials systems and modeling and process simulations are encouraged. Practical aspects of interest include innovative developments in product architecture and new integration and processing schemes for microelectronics, photonics, MEMS, microtechnologies, nanotechnologies and other relevant applications.

Invited Speakers from CEA-Leti, imec, EVG, KTH, Qromis, and more will be featured during the symposium.

Deadline for Submitting Abstracts
March 16, 2018
Submit today!

Speaker at ECS meetingTopic Close-up #7

Symposium H07: Electronic, Thermal, and Electrochemical Properties of Metal Organic Frameworks (MOFs): Technology, Applications, and Emerging Devices

Symposium Focus: The 1st International Symposium sponsored by the Electronics and Photonics Division of the Electrochemical Society brings together researchers in chemistry, materials science, physics, devices and process engineers and related interdisciplinary areas, to seek and capture the state-of-the art in MOF based fundamental aspects and latest technological applications. This symposium offers a new interdisciplinary and international platform, and aims to contribute towards advancing the fundamental understanding of the layered MOF thin films and aiming to improve technological applications thereof. Original contributions are solicited that cover all fundamental and applied aspects including electronic, thermal and electrochemical transport properties and phenomena, device/ system fabrication and integration of MOF thin films into emerging technological device applications. All oral presentations will be grouped into topical sessions. Invited Keynote speakers will present critical reviews covering recent advances and future directions in the diverse field of fundamental and applied MOF properties.

(more…)

Deadline for Submitting Abstracts
March 16, 2018
Submit today!

Speaker at ECS meetingTopic Close-up #6

Symposium G05: Materials, Formulation, and Processes for Semiconductor, 2.5 and 3D Chip Packaging, and High Density Interconnection PCB

Symposium Focus: This symposium focuses on issues pertinent to advances in semiconductor interconnects beyond the 20 nm technology node as well as novel materials and integration methods for 2.5D and 3D interconnects. An emerging technology or device architecture called 2.5D and 3D integration is based on the system performance gains that is achieved by chip stacking and vertically interconnecting distinct device layers. Since electrochemical processes are the ultimate solution to create smaller size and lower cost devices, both practical and fundamental aspects of electrochemical processes are of high demand. Ideally, this symposium will bring researchers together to discuss various aspects of device architecture, novel materials, chemical formulation, packaging approaches and nano-scale fabrication methodologies.

(more…)

Deadline for Submitting Abstracts
March 16, 2018
Submit today!

ECS meeting speakerTopic Close-up #5

Symposium D06: Surface Characterization and Manipulation for Electronic Applications

Symposium Focus: The properties of interfaces underpin many of the advances and emerging applications in electronics. From studies of charge transport in molecular electronics to interactions between biomolecules in bioelectronics sensing, the ability to understand and control interfacial properties is more important than ever. This symposium aims to address interfacial properties in a variety of electronic applications, where the functionalization of interfaces is demonstrated and characterized in order to advance understanding and to enable new devices and device applications.

(more…)

Deadline for Submitting Abstracts
March 16, 2018
Submit today!

ECS Topic Close-up #4

Symposium A07: Battery Safety and Failure Modes

Symposium Focus: Long life, high power, reliable and safe lithium-ion batteries are needed for new consumer electronics, vehicle and grid storage applications. Demands for increased battery functionality, makes the severity of a potential battery safety incident a growing risk for emerging lithium-ion battery technologies. The objective of this symposium is to address lithium-ion battery durability, reliability and safety from a materials and cell design perspective with the goal of reducing the severity of an energetic safety incident. Better understanding of battery failure modes and effects could enable cell and system design improvements, performance enhancements and facilitate regulatory approvals of advanced lithium-ion battery power systems.

(more…)

Deadline for Submitting Abstracts
March 16, 2018
Submit today!

Michel ArmandTopic Close-up #3

Symposium A02: Challenges in Novel Electrolytes, Organic Materials, and Innovative Chemistries for Batteries – in Honor of Michel Armand

Symposium Focus: On polymer electrolytes, ionic liquid electrolytes, new electrolyte salts, conductive layer-coated electrode materials, electrode materials for organic batteries, metal/electrolyte interfaces, fuel cells made with previous materials and/or electrolytes, anode metal based rechargeable batteries, and any innovative cell design and chemistry.

Both theoretical and experimental papers are accepted, and contributions from industry and students are encouraged.

(more…)

Deadline for Submitting Abstracts
March 16, 2018
Submit today!

Meeting speakerTopic Close-up #2

Symposium C02: Pits & Pores 8: Nanomaterials – Fabrication, Properties, and Applications

Symposium Focus: This symposium is aimed at the fabrication of all kinds of porous structures, their physical and chemical properties as well as their applications. It is a continuous attempt to integrate the diverse research in different fields such as localized metal corrosion, semiconductor electrochemistry, pore-filling, matrix materials, optical spectroscopy and characterization of magnetic properties in order to develop a highly transdisciplinary approach to the topic. Emphasis will be on pit and pore formation, porous-structure/surface-property relations, work relevant to the formation of advanced materials and their characterization, and applications of these materials in different areas of science such as biomedicine, energy storage and conversion, optics and magnetism.

The symposium brings together scientists from various research fields such as material science, electrochemistry, physics, chemistry, engineering and biology.

(more…)

  • Page 1 of 2
    • 1
    • 2