Two discoveries could provide a simple and effective way to “stencil” high-quality 2D materials in precise locations and overcome a barrier to their use in next-generation electronics.

In 2004, the discovery of a way to isolate a single atomic layer of carbon—graphene —opened a new world of 2D materials with properties not necessarily found in the familiar 3D world. Among these materials are a large group of elements—transition metals—that fall in the middle of the periodic table.

When atoms of certain transition metals, for instance molybdenum, are layered between two layers of atoms from the chalcogenide elements, such as sulfur or selenium, the result is a three-layer sandwich called a transition metal dichalcogenide. TMDs have created tremendous interest among materials scientists because of their potential for new types of electronics, optoelectronics and computation.

“What we have focused on in this paper is the ability to make these materials over large areas of a substrate in precisely the places we want them,” says Joshua Robinson, associate professor of materials science and engineering at Penn State. “These materials are of interest for a variety of next-generation electronics, not necessarily to replace silicon, but to augment current technologies and ultimately to bring new chip functionality to silicon that we never had before.”

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ElectronicsNew research demonstrates the development of the first stretchable integrated circuit, made entirely using an inkjet printer.

The team behind this research believes this development could lead to the manufacturing of inexpensive “smart fabric.” Potential applications include wallpaper that can turn an entire wall into an electronic display and electronics that could be scaled up and down easily.

“We can conceivably make the costs of producing flexible electronics comparable to the costs of printing newspapers,” says Chuan Wang, co-author of the paper and former ECS member. “Our work could soon lead to printed displays that can easily be stretched to larger sizes, as well as wearable electronics and soft robotics applications.”

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Nano-chimney to Cool Circuits

Overheating has emerged as a primary concern in the development of new electronic devices. A new study from Rice University looks to provide a solution to that, offering a strategy to vent heat away from nano-electronics through cone-like chimneys.

By putting these “chimneys” between the graphene and nanotube, the researchers effectively eliminate a barrier that typically blocks heat from escaping.

This from Rice University:

Researchers at Rice University discovered through computer simulations that removing atoms here and there from the two-dimensional graphene base would force a cone to form between the graphene and the nanotube. The geometric properties of the graphene-to-cone and cone-to-nanotube transitions require the same total number of heptagons, but they are more sparsely spaced and leave a clear path of hexagons available for heat to race up the chimney.

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The Future of Electronics is Light

By: Arnab Hazari, University of Michigan

ElectronicsFor the past four decades, the electronics industry has been driven by what is called “Moore’s Law,” which is not a law but more an axiom or observation. Effectively, it suggests that the electronic devices double in speed and capability about every two years. And indeed, every year tech companies come up with new, faster, smarter and better gadgets.

Specifically, Moore’s Law, as articulated by Intel cofounder Gordon Moore, is that “The number of transistors incorporated in a chip will approximately double every 24 months.” Transistors, tiny electrical switches, are the fundamental unit that drives all the electronic gadgets we can think of. As they get smaller, they also get faster and consume less electricity to operate.

In the technology world, one of the biggest questions of the 21st century is: How small can we make transistors? If there is a limit to how tiny they can get, we might reach a point at which we can no longer continue to make smaller, more powerful, more efficient devices. It’s an industry with more than US$200 billion in annual revenue in the U.S. alone. Might it stop growing?

Getting close to the limit

At the present, companies like Intel are mass-producing transistors 14 nanometers across – just 14 times wider than DNA molecules. They’re made of silicon, the second-most abundant material on our planet. Silicon’s atomic size is about 0.2 nanometers.

Today’s transistors are about 70 silicon atoms wide, so the possibility of making them even smaller is itself shrinking. We’re getting very close to the limit of how small we can make a transistor.

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InSeNewly developed semiconductor materials are showing promising potential for the future of super-fast electronics.

A new study out of the University of Manchester details a new material called Indium Selenide (InSe). Like graphene, InSe if just a few atoms thick, but it differs from the “wonder material” in a few critical ways. While graphene has been hailed for its electronic properties, researchers state that it does not have an energy gap – making graphene behave more like a metal than a semiconductor.

Similarly, InSe can be nearly as thin as graphene while exhibiting electronic properties higher than that of silicon. Most importantly, InSe has a large energy gap, which could open the door to super-fast, next-gen electronic devices.

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Biomedical innovations have helped shape the world of modern medicine. From pacemakers to auto-dispensing medications, advances in medical technology have revolutionized the world we live in.

But what happens when some of these devices need to be removed?

That’s where “transient electronics” come in. The concept behind this new technology is that rather than removing medical devices through surgery, scientists could simply develop the device so it could just disappear when the time is appropriate.

The latest development in transient electronics comes from Iowa State University, where researchers have made a breakthrough in the development of a dissolving battery that could power these disappearing devices.

The lithium-ion battery can deliver 2.5 volts and dissipate in 30 minutes when dropped into water. The power generated from the battery could power a desktop calculator for about 15 minutes.

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From televisions screens we can roll up like newspapers to see-through batteries, researchers are moving electronics toward a more flexible, more transparent future.

The most recent development in this area comes from a group that has developed transparent, flexible supercapacitors made of carbon nanotube films. But this development goes far beyond wearable electronics, with potential applications in both energy storage and harvesting.

“Potential applications can be roughly divided into two categories: high-aesthetic-value products, such as activity bands and smart clothes, and inherently transparent end-uses, such as displays and windows,” co-author of the study Tanja Kallio, told Phys.org. “The latter include, for example, such future applications as smart windows for automobiles and aerospace vehicles, self-powered rolled-up displays, self-powered wearable optoelectronics, and electronic skin.”

With the thin films demonstrating 92 percent transparency and high efficiency compared to other carbon-based counterparts, the researchers believe that further improvements to the supercapacitors durability and energy density could make the product commercially viable.

The Death of Moore’s Law

The future of technology

The iconic Moore’s law has guided Silicon Valley and the technology industry at large for over 50 years. Moore’s prediction that the number of transistors on a chip would double every two years (which he first articulated at an ECS meeting in 1964) bolstered businesses and the economy, as well as took society away from the giant mainframes of the 1960s to today’s era of portable electronics.

But research has begun to plateau and keeping up with the pace of Moore’s law has proven to be extremely difficult. Now, many tech-based industries find themselves in a vulnerable position, wondering how far we can push technology.

Better materials, better chips

In an effort to continue Moore’s law and produce the next generation of electronic devices, researchers have begun looking to new materials and potentially even new designs to create smaller, cheaper, and faster chips.

“People keep saying of other semiconductors, ‘This will be the material for the next generation of devices,’” says Fan Ren, professor at the University of Florida and technical editor of the ECS Journal of Solid State Science and Technology. “However, it hasn’t really changed. Silicon is still dominating.”

Silicon has facilitated the growth predicted by Moore’s law for the past decades, but it is now becoming much more difficult to continue that path.

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A research team, including ECS members Stephen Doorn and Erik H Hároz, has created flexible, wafer-scale films of highly aligned and closely packed carbon nanotubes thanks to a simple filtration process. In a discovery that was previously though impossible, the researchers found that in the right solution and under the right conditions, the tubes can assemble themselves by the millions into long rows.

(ICYMI: Get the freshman 101 on carbon nanotubes from nanocarbons expert Bruce Weisman.)

This development could help bring flexible electronics to actuality, especially with the special electronic properties of the nanotubes.

“Once we have centimeter-sized crystals consisting of single-chirality nanotubes, that’s it,” said Junichiro Kono, Rice University physicist leading the study. “That’s the holy grail for this field. For the last 20 years, people have been looking for this.”

penn-state-materialA new material developed at Penn State could mean big things for everything from smartphones to solar cells.

For over 60 years, the main material used in transparent conductor display has been indium tin oxide. With over 90 percent of the display market utilizing this material, it has left very little room for competitor materials.

While indium tin oxide has provided solid efficiency levels at a decent price point for the past half decades, expenses have recently skyrocketed on this material.

Current electronic devices, such as smart phones and tables, are primarily priced according to display material costs. Displays and touch screen modules make up 40 percent of the cost to produce a device, greatly outpacing other essential pieces such as chips and processors. It hasn’t been until now that researchers have found a material that could potential replace indium tin oxide and potentially reduce device costs.

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