Call for Papers

The ECS Journal of Solid State Science and Technology is publishing a focus issue on molecular electronics. It also includes selected papers from the 10th International Conference on Molecular Electronics held from November 29–December 2, 2021, in Lyon, France. The first International Conference on Molecular Electronics (ElecMol) was organized in 2004. Three successful conferences in 2004, 2005, and 2006 led to scheduling this event biennially. Molecular electronics is a widely interdisciplinary field at the frontiers of chemistry, physics, biology, electronics, and their many interfaces. The design and use of electronic components and devices at the nanometer scale stands as a major challenge for the near future.

This virtual issue focuses on papers covering the following topics: 

• Single Molecule Junctions: Memories and Switches
• Large Area Junctions: Memories and Switches
• Organic Electronics and Spintronics: Molecules and Devices
• Organic Optoelectronics and Photonics: Molecules and Devices
• 2D Systems, Nanotubes, Nanowires, Nanosheets
• Self-Assembly and Supramolecular Architectures
• Scanning Probe Microscopies and Near Field Approaches
• Carrier Transport and Device Theoretical Simulation and Modelling

Reviews, critical reviews, and perspective papers are welcomed. (more…)

Call for Papers 

The ECS Journal of Solid State Science and Technology is publishing a focus issue dedicated to the memory of Professor George Blasse: Recent Developments in Theory, Materials, and Applications of Luminescence. On December 30, 2020, Prof. Blasse passed away unexpectedly at the age of 86, in Munich, Germany, where he lived since his retirement in 1996. Prof. Blasse was highly recognized internationally and shaped the field of luminescent materials research. He combined groundbreaking fundamental discoveries with societal relevance including the discovery of the phosphor that enabled white light LEDs. He had a deep and also intuitive understanding of luminescence phenomena, and often relied on clever chemical variations in host composition and structure to obtain insight into the underlying physics of luminescence and energy transfer phenomena of ions in solids. (more…)

Call for Papers 

Accepting Submissions: February 5, 2021 | Submission Deadline: May 5, 2021

The ECS Journal of Solid State Science and Technology is publishing a special collection of invited papers which were presented at the 6th International Conference on Nanoscience and Nanotechnology (ICONN-2021). (more…)

Call for Papers

This focus issue of the ECS Journal of Solid State Science and Technology aims to cover emerging solid state electronic devices and materials for compound semiconductors, novel materials, Si-based processing, devices and integration, and photonic materials/devices. Solid state devices and materials have shown great potential in wide applications including electronics, photonics, and sensors. This focus issue addresses the development of novel materials with superior properties and technology shrinkage for industrial mass production. (more…)

Call for Papers

ECS Journal of Solid State Science and Technology
Focus Issue on Photovoltaics for the 21^st Century II

The ECS Journal of Solid State Science and Technology is publishing a special collection of invited and innovative papers which were presented at the 30th International Photovoltaic Science and Engineering Conference (PVSEC-30) & Global Photovoltaic Conference 2020 (GPVC 2020). (more…)

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Call for Papers

ECS Journal of Solid State Science and Technology
Focus Issue on Semiconductor Wafer Bonding: Science, Technology, and Applications

The ECS Journal of Solid State Science and Technology is publishing a focus issue in connection with the Semiconductor Wafer Bonding: Science, Technology, and Applications 16 Symposium that took place during PRiME 2020.

Submissions are open to all authors working in this field, including authors who presented during PRiME 2020.

Wafer bonding as stacking and joining of semiconductor and similar wafers is an important process step in microelectronics, microsystems, and related technologies. It allows the realization of engineered substrates like SOI wafers for modern microelectronics, 3D integration for very high-density electronics, capping and integration of MEMS, silicon based micro fluidics, and thin wafer processing, for example. Wafer bonding processes are typically very complex. The materials of the substrates and bonding layers, the physical understanding of the actual wafer bonding process, and its successful and reproducible execution in product development and production, specialized equipment, characterizations and metrology are all very important. The significance of wafer bonding and the complexity of the related technologies ensures that it is a very interesting field of research and development, which attracts many industry and institutional researchers. (more…)