201st Meeting - Philadelphia, PA

May 12-17, 2002


L1 - Electrodeposition: Historical Perspective and Future Directions


Monday, May 13, 2002

Salon K, Level 5

Co-Chairs: T.P. Moffat and A.A. Gewirth

10:00469 A History of Electroplating - D.R. Turner (Unknown)
10:40470 Electrodeposition Science and Technology in the last Quarter of the Twentieth Century - D. Landolt (Swiss Federal Institute of Technology Lausanne)
11:20516 New Tools for Electrodeposition Studies: Scanning Probe Microscopies - D.M. Kolb (University of Ulm)


Co-Chairs: A.A. Gewirth and S.L. Yau

1:40471 Atom-Size Contacts and Gaps Between Electrodes Fabricated by Electrodeposition - S. Boussaad and N. Tao (Arizona State University)
2:20472 Epitaxial Electrodeposition of Metals by Defect Mediated Growth and its Application - S. Hwang, I. Oh, and J. Kwak (KAIST)
3:00473 In Situ Scanning Tunneling Microscopy of Underpotential Deposition of Lead on Cu(100) in Sulfuric Acid Solutions - S.-L. Yau and H.-C. Wu (National Central University)
3:20474 Ab initio Calculations for the c(2\times2) Structure of the Br/Ag(100) and Br/Au(100) Surfaces - S. Wang and P.A. Rikvold (Florida State University)
3:40475 Lattice-Gas Model for Cl on Ag(100) Single-Crystal Surfaces - I. Abou-Hamad, P.A. Rikvold (Florida State University), S.J. Mitchell (Eindhoven Technical University), and T. Wandlowski (Forschungszentrum Julich)
4:00 Discussion by K. Sieradzki -
4:40476 IM Plating: A New Micro-Electrodeposition Method for Manufacturing 3-D MEMS - G. Zhang and A. Cohen (MEMGen Corporation)
5:00477 Electrodeposition of Au Thin Films and Au/Ag Multilayers on Silicon - C. Ji, G. Oskam, and P. Searson (Johns Hopkins University)

Tuesday, May 14, 2002

Roughness Evolution

Co-Chairs: T.P. Moffat and W. Schwartzacher

8:00478 Scaling Analysis of Roughness Evolution in Electrodeposited Films - W. Schwarzacher (H H Wills Physics Laboratory)
8:40479 Evolution of Island Distributions during Submonolayer Potential-Pulse Electrodeposition: Dynamical Monte Carlo Simulations - P.A. Rikvold and D.E. Roberts (Florida State University)
9:00480 Microstructured Electrodeposition of Copper using Pulse Plating - E. Pircher, G. Telias, P. Pessenda-Garcia, S. Hansal, W.E.G. Hansal, B. Mollay (ECHEM), J.O. Besenhard (Graz University of Technology), H. Kronberger (Vienna University of Technology), and G.E. Nauer (University of Vienna)
9:20481 Superconformal Electrodeposition - T. Moffat, D. Wheeler, D. Josell, and D. Josell (NIST)
9:40482 Effect of Additives on Copper Electroplating: Vibrational Spectroscopic and AFM Measurements - M. Kang, T.Y.B. Leung, M.E. Biggin, and A. Gewirth (University of Illinois)
10:00483 Inhibition of Copper Electrodepostion by Polyethylene Glycol and Chlorine Ion - M. Hayase, M. Taketani, T. Hatsuzawa (Tokyo Institute of Technology), and K. Hayabusa (Ebara Research Co., LTD)
10:20484 Spectroelectrochemical Studies of Organic Additives for the Electrodeposition of Au - B. Bozzini (Universita di Lecce)
10:40 Thirty-Minute Intermission -

Co-Chairs: P.C. Searson and J. Stickney

1:40485 Nonlinear Electrochemical Oscillations during Tin Electrodeposition in the Presence of Surface Surfactant - S. Nakanishi, S.-I. Sakai, K. Fukami, and Y. Nakato (Osaka University)
2:00486 Electrodeposition of Semiconductors - D. Lincot (Ecole Nationale Superieure de Chimie de Paris)
2:40487 Electrodeposition of Epitaxial ZnSe Films on (11) InP and (100) GaAs from an Aqueous Selenosulfate Solution - G. Riveros (Universidad Catolica de Valparaiso), H. Rodrigo, D. Lincot, J.-F. Guillemoles (ENSCP), H. Gomez-Meier (Universidad Catolica de Valparaiso), and M. Froment (Universite Pierre et Marie Curie)
3:00488 New Facets of CdTe Electrodeposition as Revealed by Working Under Fast Growth Rate Conditions - C. Lepiller, J. Kurdi, P. Poizot, J. Vedel, and D. Lincot (Ecole Nationale Superieure de Chimie de Paris)
3:20489 Compound Semiconductor Electrodeposition, A Historical Perspective - J. Stickney (University of Georgia)
4:00490 Electrodeposition of Tungsten and Titanium Oxides from Peroxo Precursors - T. Pauporte, D. Lincot (UMR), K. Rajeshwar, and N. De Tacconi (University of Texas)
4:20491 Cobalt Hexacuanoferrate: Compound Stoichiometry and Photoinduced Electron Transfer - N. de Tacconi, K. Rajeshwar (The University of Texas at Arlington), R. Lezna (Universidad Nacional de La Plata), and R. Romagnoli (CIDEPINT)

Franklin Hall, Level 4

Co-Chairs: A.A. Gewirth and T.P. Moffat

o492 Reduction of Silver Ions with Polyhydroxy Alcohols - S. Djokic (The Westaim Corporation)
o493 Optimization of Novel Silver Alloy Electroless Deposition Solution for ULSI Applications - A. Inberg, V. Bogush, N. Croitoru (Tel-Aviv University), V. Dubin (Intel), and Y. Shacham-Diamand (Tel-Aviv University)
o494 The Study of the Electrodeposition of Nickel-alumina Composite - P.-H. Hsieh and M.-C. Yang (National Cheng Kung University)
o495 Characterization of Initial Stages of the Electrodeposition of Ni, Zn and Ni-Zn Alloy by EQCM - K.-D. Song and K.-B. Kim (Yonsei University)
o496 Influence of Additives on the Electrodeposition of Zinc-Nickel-Iron Alloys - M. Sundar, A.V. Raajaraajan, A. Arunprasath (Central Electrochemical Research Inst.), V. Venkataram, M. Puahpavanam (Central Electrochemical Research Inst), and G. Sheela (Central Electrochemical Research Inst.)
o497 Effect of Additives on the Electrodeposition of Zn-Ni-Co Alloys - A. Arunprasath, V. Venkataram, M. Sundar, A.V. Raajaraajan, M. Pushpavanam, and G. Sheela (Central Electrochemical Research Institute)
o498 Magnetic Studies of Low-dimensionality Electrodeposited Metal Structures - K. Poduska, E. Lin, and S. Morin (York University)
o499 Nitrate Reduction Catalyzed by Surface Bimetallic Composite on Au(111) - S. Hwang, J. Lee, and J. Kwak (Korea Advanced Institute of Science and Technology)
o500 Scanning Tunneling Microscopy Study of Silver upon Au (111) in the Presence of Chloride - J. Lee, S. Hwang, and J. Kwak (Korea Advanced Institute of Science and Technology)
o501 Cathodic Reactivity of Alkaline Metal Iodides Toward Platinum and Palladium. The Formation of New Thick Reducing Phases - J. Simonet and C. Cougnon (Universite de Rennes 1)

Wednesday, May 15, 2002

Salon K, Level 5

Magnetic Materials

Co-Chairs: K. Attenborough and T. Osaka

8:00502 Electroplating Technology: The Immense Impact on Magnetic Storage and Electronics - L.T. Romankiw (IBM)
8:40503 Underlayer Effects on the Magnetic Properties of Electrodeposited, High Moment Fe-Co-Ni Thin Films - X. Liu and G. Zangari (The University of Alabama)
9:00504 Fabrication and Characteristics of Magnetic Films from the Room Temperature Molten Salt Electrolytes - S. Min-Fong, W. Te-Ho, and Y. Chao-Chen (National Yunlin University of Science and Technology)
9:20505 A Study of Anions Effects in FeCoNi Electrodeposition - X. Liu and G. Zangari (The University of Alabama)
9:40506 Surface Roughness Evolution of Co Electrodeposits on Si - M.L. Sartorelli, M.L. Munford (Universidade Federal de Santa Catarina), M. Santos (Universidade do Vale do Itajai), W. Figueiredo (Universidade Federal de Santa Catarina), W. Schwarzacher (Bristol University), and A.A. Pasa (Universidade Federal de Santa Catarina)
10:00507 Fabrication of Highly Ordered Structures Using Anodic Porous Alumina - H. Masuda (Tokyo Metropolitan University)
10:40 Thirty-Minute Intermission -

Electroless Deposition and Other Materials

Co-Chairs: S. Djokic and K. Attenborough

1:40508 Magnetic Field Effect on Electrodeposition of Copper Nanowire Arrays - Y. Konishi, M. Motoyama, H. Matsushima, Y. Fukunaka, Y. Ito, and Y. Ito (Kyoto University)
2:00509 Future Prospective on Electroless Plating - Some Applications in the Electronics Field - - T. Osaka and T. Yokoshima (Waseda University)
2:40510 Effect of Sulfide Ions on Accelerating the Process of Direct Copper Plating - C.-C. Wan, Y.-Y. Wang, and Y.-J. Hung (Tsing Hua University)
3:00511 Electroless Metallization of Dielectrics, Semiconductors and Powder-Like Particles - T. Khoperia, T. Zedginidze, and N. Khoperia (Institute of Physics Georgian Academy of Sciences)
3:20512 Electrodeposition and Characterization of Sacrificial Copper-Manganese Alloy Coatings - J. Gong (The University of Alabama), F. Xu (University of Pittsburgh), G. Wei (The University of Alabama), J. Barnard (University of Pittsburgh), and G. Zangari (The University of Alabama)
3:40513 Wear Resistant Nickel Dispersion Layers Produced Using Pulse Plating - A. Staudinger, S. Hansal, W. Hansal, J. Kolndorfer, T. Steck, C. Suarez-Ramon (ECHEM), J.O. Besenhard (Graz University of Technology), H. Kronberger (Vienna University of Technology), and G.E. Nauer (University of Vienna)
4:00514 Electrodeposition of Aluminum in 1-Methyl-3- Hexyl Imidazolium Chloride Ionic Liquid at Low Temperatures - V. Kamavaram and R.G. Reddy (The University of Alabama)
4:20515 Preparation and Characterization of PdAg Layer on Al2O3 Substrate by Electroless Co-deposition - C.-Y. Chu and H.-I. Chen (National Cheng Kung University)