201st Meeting - Philadelphia, PA

May 12-17, 2002


G1 - Solid-State General Poster Session

Dielectric Science and Technology/Electrodeposition

Tuesday, May 14, 2002

Franklin Hall, Level 4

Co-Chairs: C.L. Claeys and A. Bergendahl

o352 Impact of Interface Nitridation and Remote-Plasma-Assisted Oxidation (RPAO) Thickness on Breakdown Phenomena and Reliability of Stacked Oxide/Nitride and Oxynitride Dielectrics under Constant Voltage Stress (CVS) - Y. Lee (North Carolina State University), Y. Wu (Advanced Micro Devices Inc.), J.G. Hong, and G. Lucovsky (North Carolina State University)
o353 Characteristics of Complexes of Poly(ethylene oxide) with Lithium Salts - Y.-C. Liu, L.-H. Lin, Y.-S. Liang, and C.-J. Tsai (Van Nung Institute of Technology)
o354 Electrical and Reliability Characteristics of High-K HfO2 Gate Dielectrics - D. Han, J. Kang, X. Liu, and R. Han (Peking University)
o355 XPS and TEM Studies of Steam-Grown Oxynitride - W. Cai (ON Semiconductor Co.)
o356 Ab-initio Calculations of Infra-Red Absorption in Nitrogen Doped Czochralski Silicon - F.S. Karoui, A. Karoui, G.A. Rozgonyi (North Carolina State University), N. Inoue, and H. Harada (Osaka Prefecture University)
o357 Analysis of Leakage Current of Low-k Materials for Use As ILD - T. Fukuda, H. Nishino, and H. Yanazawa (ASET)
o358 Investigation of Oxygen Precipitation in Photovoltaic Polycrystalline Sheet Silicon - J. Lu, M. Wagener, G. Rozgonyi (North Carolina State University), and J. Rand (Astropower, Inc.)
o359 Self-Grown Hydrophobic Nano Molecule Films on the Low Dielectric Materials as an Organic Diffusion Barrier - J.C. Hu, C.W. Wu, W.C. Gua (National Tsing Hua University), T.C. Chang (National Sun Yat-Sen University), and L.J. Chen (National Tsing Hua University)
o360 In situ FTIR Analysis of Growth Process and Structure Properties of MOCVD Tantalum Nitride by Terbutylimidotris(diethylamido)tantalum - C.W. Wu, W.C. Gau, J.C. Hu (National Tsing Hua University), T.C. Chang (National Sun Yat-Sen University), C.J. Chu (Nanmat Technology Co., LTD.), and L.J. Chen (National Tsing Hua University)
o361 Microstructural Study of Cured HSQ Resin Coated on a Patterned Wafer Using Scanning Transmission Electron Microscopy (STEM) with Electron Energy Loss Spectroscopy (EELS) - G. Kim, D. Wyman, M. Spaulding, Z. Li, and E. Moyer (Dow Corning Corporation)
o362 Characterization of Ultra-Thin Oxynitride Films by Time-of-Flight Secondary Ion Mass Spectrometry - B. Schueler, S. Bryan (Physical Electronics), D. Hockett, P. Lindley, and I. Mowat (Charles Evans & Associates)
o363 Directional Pore Arrays on Anodic Aluminum Oxide Template - W.-J. Cho (Korea Institute of Science and Technology), S. Lee (Sogang University), J.G. Park, Y.J. Park, and E.K. Kim (Korea Institute of Science and Technology)
o364 TPD Study on the Decomposition Mechanism of 2,2,6,6-tetramethyl-3,5-heptadione - Y. Cho and S. Moon (Seoul National University)