201st Meeting - Philadelphia, PA
May 12-17, 2002
PROGRAM INFORMATION
P1 - Fifth International Symposium On Enviornmental Issues With Materials And Processes For The Electronic And Semiconductors Industries
Electronics/Dielectric Science and Technology/Electrodeposition
Monday, May 13, 2002
Conference Room 301, Level 3
Co-Chair: L. Mendicino
Time | Abs# | Title |
1:40 | 674 |
Electrochemical Removal of Sulfide from Brines - B. Ateya and F. AlKharafi (Kuwait University) |
2:00 | 675 |
Removal of Dissolved Copper from CMP Waste Water by Direct Electroreduction - S.
Tamilmani, W. Huang, S. Raghavan, and J. Farrell (University of Arizona) |
2:20 | 676 |
Fluorocarbon Film and Residue Removal Using Supercritical CO2 Mixtures - S. Myneni and D. Hess (Georgia Institute of Technology) |
2:40 | 677 |
A Summary of Recent Water Conservation Efforts - B. Raley and C. Nauert (Motorola Inc.) |
3:00 | 678 |
Emergency Preparedness and Response for Semiconductor Manufacturing - S. Harris, J.
Heironimus, C. Nauert, R. Meeker, T. McCay, and H. Williams (Motorola) |
3:20 | |
Twenty-Minute Intermission - |
3:40 | 679 |
System Risk Reduction
Utilizing the Enterprise Risk Management Approach -
P.T. Brown, S. Trammell, J. Heironimus, and L. Mendicino (Motorola) |
4:00 | 680 |
Environmental Health and Safety (EHS) Investigation on CVD Exhaust System: Identification and Mitigation of Potential Release of Process Gases and Byproducts - L.
Chandna, A. Reynoso, C. Nauert, and K. Hendricksen (Motorola) |
4:20 | 681 |
Partnerships to Address EHS Aspects of Chemical Management in the Semiconductor Industry: Lessons from the PFAS Experience -
M.J. Bowden (Arch Chemicals, Microelectronics Materials), L. Beu, P.E. (Motorola), and S. Pawsat (International
SEMATECH) |
4:40 | 682 |
PFAS: Treatment Options and Sampling Methods - B. Raley (Motorola) |
Tuesday, May 14, 2002
Co-Chair: P.T. Brown
Time | Abs# | Title |
8:00 | 683 |
Post Oxide Etching Cleaning Process Using Integrated Ashing and HF Vapor Process - O. Kwon and H. Sawin (MIT) |
8:20 | 684 |
Point of Use Abatement Unit Bypass for NF3- Based CVD chamber Clean Applications -
D.R. Babbitt, P.T. Brown, V. Vartanian, and L. Mendicino (Motorola) |
8:40 | 685 |
Managing Fluorine Emissions at Semiconductor Fabrication Facilities - M. Smylie (ENVIRON International Corporation) |
9:00 | 686 |
Characterization of Plasma-Etched RuO_2 Substrates - V.
Vartanian, B. Goolsby, L. Mendicino (Motorola), S. Dakshina-Murthy (Advanced Micro Devices), S.
Samavedam, J. Lee (Motorola), and C. Sparks (International Sematech) |
9:20 | |
Twenty-Minute Intermission - |
9:40 | 687 |
Potential COO Reduction for a Nitride Furnace POU Abatement Device - B.
Goolsby, V. Vartanian, L. Mendicino, B. Davis, and M. Rossow (Motorola SPS) |
10:00 | 688 |
Etch Product Characterization for High-K and Low-K Plasma Etching Processes - M. Radtke and D. Graves (University of California at Berkeley) |
10:20 | 689 |
Emission Characterization of Advanced CVD Processes and Abatement Performance - V.
Vartanian, B. Goolsby, C. Reddy, V. Arunachalam, and L. Mendicino (Motorola) |
10:40 | |
Thirty-Minute Intermission - |
1:40 | 690 |
Evaluation of Ozone Emissions Destruction Units for Applied Materials' SACVD Chambers - C.
Nauert, B. Day, J. Fox, R. Camacho, H.-A. Kwong, and R. Lathrop (Motorola) |
2:00 | 691 |
Thermal Reductive Destruction of Perfluorocarbons into Safe Products through In-situ Generation of Alkali Metals in Heated Solid Mixtures -
M.C. Lee and W. Choi (Pohang University of Science and Technology) |
2:20 | 692 |
Development and Evaluation of the ATMI CDO TM 865 for Abatement of Low-K Process Effluents - B. Flippo and R. Vermeulen
(ATMI) |
2:40 | 693 |
Post-Pump PFC Abatement by Atmospheric Microwave Plasmas: Completion of Metal Etch Beta Test - J.-C.
Rostaing, D. Guerin, C. Larquet, A. El-Krid, C.-H. Ly, M. Moisan (Air Liquide Research and Development), H.
Dulphy, P. Moine (Air Liquide Electronics Systems), and J. Wiechers (CS Clean Systems AG) |
3:00 | 694 |
Effective Management of Process Exhaust form Low- CVD Processes - J. Van
Gompel, A. Seeley, and S. Carss (BOC Edwards) |
3:20 | |
Twenty-Minute Intermission - |
3:40 | 695 |
The Evaluation of Hexafluoro-1,3 Butadiene as an Environmentally Benign Dielectric Etch Chemistry in a Medium-Density Etch Chamber - R.
Chatterjee, R. Reif (MIT), T. Sparks, V. Vartanian, B. Goolsby, and L. Mendicino (Motorola) |
4:00 | 696 |
Reduction of PFC Emissions through Process Advances in CVD Chamber Cleaning - S. Hsu, C.
Allgood, and M. Mocella (Dupont) |
4:20 | 697 |
Characterization of NF_3 Chamber Cleans on Multiple CVD Platforms - B.
Goolsby, V. Vartanian, L. Mendicino, J. Rivers, J. Vires (Motorola), M. Turner, S.-P. Sun, and C. Esber (Advanced Micro Devices) |
4:40 | 698 |
PFC Emissions Reduction and Process Improvements with Remote Plasma CVD Chamber Cleans - L.
Mendicino, P.T. Brown, S. Filipiak, C. Nauert, H. Estep, and M. Fletcher (Motorola) |
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