203rd Meeting - Paris, France
April 27-May 2, 2003
PROGRAM INFORMATION
H2 - Science and Applications of Additives in Electrochemical Processes
Electrodeposition
Monday, April 28, 2003
Room 342, Level 3, Le Palais des Congres
Co-Chairs: D.P. Barkey and M. Alodan
Co-Chairs: K. Kondo and P. Vereecken
Time | Abs# | Title |
13:40 | 606 |
Effect of Differential Additive Concentrations in Damascene Copper Electroplating - P. Vereecken (IBM Research Division), J. Long (The Johns Hopkins University), E. Cooper, H. Deligianni, P. Andricacos (IBM Research Division), R. Binstead, J. Wu, R. Mikkola, and J. Calvert (Shipley Company) |
14:20 | 607 |
Pattern-Recognition Studies of Copper Electrodeposition on Cu(100) in the Presence of Additives - A. Wu and D. Barkey (University of New Hampshire) |
14:40 | 608 |
Effect of Additives on Copper Electroplating: Vibrational Spectroscopic And AFM Measurements - A. Gewirth, M. Kang, V. Feng, X. Li, and M.E. Biggin (University of Illinois) |
15:00 | 609 |
A Model of Galvanostatic Pulse with Reverse Plating in the Presence of Additives - K.-M. Yin (Yuan-Ze University) |
15:20 | 610 |
Acceleration Effect of Copper Damascene Electrodeposition - K. Watanabe, T. Matsumoto, S.J. Oh, and K. Kondo (Okayama University) |
15:40 | |
Twenty-Minute Intermission |
16:00 | 611 |
Role of Additives in the Bright Copper Plating from Acid Copper Sulfate Bath and the History - M. Yokoi and T. Hayashi (Osaka Prefecture University) |
16:40 | 612 |
Synergistic and Transient Effects of Plating Additives in Copper Metallization of Semiconductor Interconnects - U. Landau, R. Akolkar (Case Western Reserve University), M. Bubnick (Abrasive Technology), and J. D'Urso (Motorola) |
17:00 | 613 |
The Electrochemical Copper(II) Reduction in the Presence of Polyethylene glycol (PEG) and Chloride Ions - K. Doblhofer, S. Wasle, D. Soares, and K. Weil (Fritz-Haber Institut der Max-Planck-Gesellschaft) |
17:20 | 614 |
Influence of Organic Additives on the Interface Width of Electrodeposited Cu-Co Multilayers - S. Merkourakis, M. Walls, M. Hytch (CNRS), Y. Leprince-Wang (Universite de Marne-la-Vallee), and E. Chassaing (CNRS) |
17:40 | 615 |
Influence of Additive Adsorption on Properties of Electrodeposited Soft High Magnetic Moment CoNiFe Alloys - S. Brankovic, T. Klemmer, and E. Johns (Seagate Technology) |
Tuesday, April 29, 2003
Hall Maillot, Level 2, Le Palais des Congres
Technical Exhibit and Tuesday Evening Poster Session
Co-Chairs: K. Kondo and D.P. Barkey
Time | Abs# | Title |
o | 616 |
Spontaneous Potential Oscillations in the Cu(II)-Citrate System During Cu and Cu2O Deposition - J. Eskhult and M. Herranen (Uppsala University) |
o | 617 |
Electrodeposition of Through Chip Copper Plug for Three Dimensional Packaging (2) - S. Oh, T. Yonezawa, K. Kondo (Okayama University), M. Tomisaka, H. Yonemura, M. Hoshino, and K. Takahashi (ASET) |
o | 618 |
Adsorption of Polyethylene Glycol Molecule on Electrodeposited Copper Surfaces - T. Matsumoto, K. Kondo, S. Jin, and K. Watanabe (University of Okayama) |
o | 619 |
The Surfactants Influence on the Copper Electrodeposition Process in Nitrate Solutions - M. Donchenko, O. Sribna, R. Redko, and V. Yudina (National Technical University of Ukraine) |
o | 620 |
Ligand Complexation in Electrodeposition and Copper Superfilling of Interconnects - J. Jorne (University of Rochester) and E.E. Jorne (Caltech) |
o | 621 |
Effect of NH_4Cl on Microstructure and Magnetic Properties of Electrodeposited Co(P) Alloy - K.H. Lee and W.Y. Jeung (Korea Institute of Science and Technology) |
o | 622 |
Effect of Organic Additives on Pulsed Current Plating of CoFe Alloy and Consequences on Properties of Deposits - L. Ricq, F. Lallemand, P. Bercot, M.-P. Gigandet, M. Wery, and J. Pagetti (UFR ST) |
o | 623 |
Electrochemical Growth and Properties of Single Crystals in La2O3 – MnO – CoO System - S. Shiryaev, S. Barilo, G. Bychkov, D. Khalyavin, A. Soldatov (National Academy of Science of Belarus), A. Furrer, P. Allenspach (Paul Scherrer Institute), H. Szymczak, R. Szymczak, and M. Baran (PAN) |
o | 624 |
Effects of Sodium Lauryl Sulfate (SLS) on Zinc-Nickel Alloy for Corrosion Resistance Improvement - S. Suwattana, N. Tareelap, C. Nitipanyawong, N. Srisukhumbowornchai, C. Koompai, and N. Thavarungkul (King Mongkut's University of Technology Thonburi) |
o | 625 |
Studies on Electrodeposited Zn-Ni-X (X=Cu, Cd, Fe and SiO2) Coatings As a Replacement for Cadmium Coatings - S.P. Kumaraguru, B. Veeraraghavan, and B. Popov (University of South Carolina) |
o | 626 |
Influence of Organic Additives on Electrocrystallization Mechanism and Structure of Zinc Deposits - A. Silveri and E. Chassaing (CNRS) |
o | 627 |
Effect of Anodic Additives on Passivation of Chromium-Iron Alloys - N. Vyazovikina and N. Mandich (National Academy of Science) |
o | 628 |
Effects of Organic Additives on Electroplated Iron-Group Metals and Alloys - F. Lallemand, L. Ricq, P. Bercot, and J. Pagetti (UFR ST) |
o | 629 |
A New Cathode Film Mechanism for Hexavalent Chromium (Cr) Electrodeposition Using Hybrid Additives - S. Guan (University of Minnesota-Twin cities), Q. Zhang, and R. Hu (Beijing University of Aeronautics and Astronautics) |
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