203rd Meeting - Paris, France

April 27-May 2, 2003


H2 - Science and Applications of Additives in Electrochemical Processes


Monday, April 28, 2003

Room 342, Level 3, Le Palais des Congres

Co-Chairs: D.P. Barkey and M. Alodan

10:20601 Superconformal Film Growth - T. Moffat, D. Wheeler, B. Baker, and D. Josell (NIST)
10:40602 Electrically Mediated Through-Mask Deposition of Solder Bumps for Wafer Level Packaging - B. Kim and T. Ritzdorf (Semitool, Inc.)
11:00603 Mn as an Additive in Ni Electrodeposition for High Performance Microsystem Applications - J. Kelly, S. Goods, T. Headley, A. Talin, and N. Yang (Sandia National Labs)
11:20604 Investigation of Copper Removal Efficiency on Reclaimed Wafers with HF-Based Solutions - A. Abbadie (CEA/LETI)
11:40605 Effect of Additives on Morphology of Copper Deposits During Pulse Plating - N. Tantavichet and M. Pritzker (University of Waterloo)

Co-Chairs: K. Kondo and P. Vereecken

13:40606 Effect of Differential Additive Concentrations in Damascene Copper Electroplating - P. Vereecken (IBM Research Division), J. Long (The Johns Hopkins University), E. Cooper, H. Deligianni, P. Andricacos (IBM Research Division), R. Binstead, J. Wu, R. Mikkola, and J. Calvert (Shipley Company)
14:20607 Pattern-Recognition Studies of Copper Electrodeposition on Cu(100) in the Presence of Additives - A. Wu and D. Barkey (University of New Hampshire)
14:40608 Effect of Additives on Copper Electroplating: Vibrational Spectroscopic And AFM Measurements - A. Gewirth, M. Kang, V. Feng, X. Li, and M.E. Biggin (University of Illinois)
15:00609 A Model of Galvanostatic Pulse with Reverse Plating in the Presence of Additives - K.-M. Yin (Yuan-Ze University)
15:20610 Acceleration Effect of Copper Damascene Electrodeposition - K. Watanabe, T. Matsumoto, S.J. Oh, and K. Kondo (Okayama University)
15:40 Twenty-Minute Intermission
16:00611 Role of Additives in the Bright Copper Plating from Acid Copper Sulfate Bath and the History - M. Yokoi and T. Hayashi (Osaka Prefecture University)
16:40612 Synergistic and Transient Effects of Plating Additives in Copper Metallization of Semiconductor Interconnects - U. Landau, R. Akolkar (Case Western Reserve University), M. Bubnick (Abrasive Technology), and J. D'Urso (Motorola)
17:00613 The Electrochemical Copper(II) Reduction in the Presence of Polyethylene glycol (PEG) and Chloride Ions - K. Doblhofer, S. Wasle, D. Soares, and K. Weil (Fritz-Haber Institut der Max-Planck-Gesellschaft)
17:20614 Influence of Organic Additives on the Interface Width of Electrodeposited Cu-Co Multilayers - S. Merkourakis, M. Walls, M. Hytch (CNRS), Y. Leprince-Wang (Universite de Marne-la-Vallee), and E. Chassaing (CNRS)
17:40615 Influence of Additive Adsorption on Properties of Electrodeposited Soft High Magnetic Moment CoNiFe Alloys - S. Brankovic, T. Klemmer, and E. Johns (Seagate Technology)

Tuesday, April 29, 2003

Hall Maillot, Level 2, Le Palais des Congres

Technical Exhibit and Tuesday Evening Poster Session

Co-Chairs: K. Kondo and D.P. Barkey

o616 Spontaneous Potential Oscillations in the Cu(II)-Citrate System During Cu and Cu2O Deposition - J. Eskhult and M. Herranen (Uppsala University)
o617 Electrodeposition of Through Chip Copper Plug for Three Dimensional Packaging (2) - S. Oh, T. Yonezawa, K. Kondo (Okayama University), M. Tomisaka, H. Yonemura, M. Hoshino, and K. Takahashi (ASET)
o618 Adsorption of Polyethylene Glycol Molecule on Electrodeposited Copper Surfaces - T. Matsumoto, K. Kondo, S. Jin, and K. Watanabe (University of Okayama)
o619 The Surfactants Influence on the Copper Electrodeposition Process in Nitrate Solutions - M. Donchenko, O. Sribna, R. Redko, and V. Yudina (National Technical University of Ukraine)
o620 Ligand Complexation in Electrodeposition and Copper Superfilling of Interconnects - J. Jorne (University of Rochester) and E.E. Jorne (Caltech)
o621 Effect of NH_4Cl on Microstructure and Magnetic Properties of Electrodeposited Co(P) Alloy - K.H. Lee and W.Y. Jeung (Korea Institute of Science and Technology)
o622 Effect of Organic Additives on Pulsed Current Plating of CoFe Alloy and Consequences on Properties of Deposits - L. Ricq, F. Lallemand, P. Bercot, M.-P. Gigandet, M. Wery, and J. Pagetti (UFR ST)
o623 Electrochemical Growth and Properties of Single Crystals in La2O3 MnO CoO System - S. Shiryaev, S. Barilo, G. Bychkov, D. Khalyavin, A. Soldatov (National Academy of Science of Belarus), A. Furrer, P. Allenspach (Paul Scherrer Institute), H. Szymczak, R. Szymczak, and M. Baran (PAN)
o624 Effects of Sodium Lauryl Sulfate (SLS) on Zinc-Nickel Alloy for Corrosion Resistance Improvement - S. Suwattana, N. Tareelap, C. Nitipanyawong, N. Srisukhumbowornchai, C. Koompai, and N. Thavarungkul (King Mongkut's University of Technology Thonburi)
o625 Studies on Electrodeposited Zn-Ni-X (X=Cu, Cd, Fe and SiO2) Coatings As a Replacement for Cadmium Coatings - S.P. Kumaraguru, B. Veeraraghavan, and B. Popov (University of South Carolina)
o626 Influence of Organic Additives on Electrocrystallization Mechanism and Structure of Zinc Deposits - A. Silveri and E. Chassaing (CNRS)
o627 Effect of Anodic Additives on Passivation of Chromium-Iron Alloys - N. Vyazovikina and N. Mandich (National Academy of Science)
o628 Effects of Organic Additives on Electroplated Iron-Group Metals and Alloys - F. Lallemand, L. Ricq, P. Bercot, and J. Pagetti (UFR ST)
o629 A New Cathode Film Mechanism for Hexavalent Chromium (Cr) Electrodeposition Using Hybrid Additives - S. Guan (University of Minnesota-Twin cities), Q. Zhang, and R. Hu (Beijing University of Aeronautics and Astronautics)


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