Co-Chairs: P. Hesketh and D. Misra
Time | Abs# | Title |
---|---|---|
10:00 | Introductory Remarks- P. Hesketh | |
10:05 | 2571 | Polymer MEMS: From Microbiodegradables to Microfilters to Microcombustors - M. Allen (Georgia Institute of Technology) |
10:45 | 2572 | Processing Challenges in the Fabrication of Advanced MEMS - A. Kornblit, V. Aksyuk, G. Bogart, C. Bolle, J.E. Bower, R. Cirelli, E. Ferry, L. Fetter, A. Gasparyan, R. Keller, F. Klemens, W. Lai, O.D. Lopez, W. Mansfield, J. Miner, C.-S. Pai, F. Pardo, S. Pau, M. Simon, T. Sorsch, J.A. Taylor, D. Tennant, and G.P. Watson (Lucent Technologies Bell Labs) |
11:15 | 2573 | Fabrication of 3-D Micromesh Ni Structures Using Electroplating - H. Sato, T. Otsuka, and S. Shoji (Waseda University) |
11:35 | 2574 | Single High Aspect Ratio Pillar Support Structures - M. Northen and K. Turner (University of California at Santa Barbara) |
Co-Chairs: S. Shoji and M. Allen
Time | Abs# | Title |
---|---|---|
14:00 | 2575 | CuS and AgS Solid-Electrochemical Cells as Non-Volatile Memory Devices - M. Tabib-Azar (Case Western Reserve University) |
14:30 | 2576 | Electroformed Microelectrode Array for a Human Retinal Prosthesis Interface - P. Skeath (SFA, Inc.), K. Perkins (Naval Research Lab, Code 6876), L. Wasserman (SFA, Inc.), R. Schoonmaker, J. Peele (Naval Research Lab, Code 5675), and L. Johnson (SFA, Inc.) |
14:50 | 2577 | Dynamic Electrochemical Simulation and Testing of Micromachined Electrodes for Neural Stimulation - A. Hung (University of California, Los Angeles), D. Zhou, B. Greenberg (Second Sight Medical Products, Inc.), and J. Judy (University of California, Los Angeles) |
15:10 | 2578 | Simulations of Transient Signals in Micro-Galvanic Processes - G. Fafilek (ECHEM Center of Competence in Applied Electrochemistry), J. Besenhard (University of Technology, Graz Institut of Chemical Technology of inorganic materials), H. Kronberger (University of Technology, Institute of Chemical Technology and Analytics), and G. Nauer (University Vienna, Institute of Physical Chemistry) |
15:30 | 2579 | On the Modeling of Anisotropic Electroforming- and Micromachining - Processes - B. Mollay (ECHEM Center of Competence in Applied Electrochemistry), G. Nelissen, B. Van den Bossche (ELSYCA NV), J. Besenhard (TU Graz), G. Fafilek, H. Kronberger (TU Vienna), J. Deconinck (Vrije Universiteit Brussel), and G. Nauer (University Vienna) |
15:50 | Twenty-Minute Intermission | |
16:10 | 2580 | High-Aspect-Ratio Inductively Coupled Plasma Etching of Bulk Titanium for MEMS Applications - E. Parker, M. Aimi, B. Thibeault, M. Rao, and N. MacDonald (University of California, Santa Barbara) |
16:30 | 2581 | Three-Dimensional Microstructures in Silicon via the Combination of Light-Ion Beam Writing and Electrochemical Etching - D. Blackwood, E.J. Teo, M. Breese, and A. Bettiol (National University of Singapore) |
16:50 | 2582 | Microfabrication of Graphitic Carbon Materials via Electrochemical Etching - M. McDermott, S. Ssenyange, and R. Du (University of Alberta) |
17:10 | 2583 | Characterization of a Batch HF Vapor Processor for MEMS Release Etching - J. Chiaroni, H. Grange (LETI-CEA), O. Pollet, and E. Bergman (Semitool, Inc.) |
17:30 | 2584 | A Novel Process for Singulating Fragile Devices - A. Agarwal, M. Soundarapandan, P. CSankarapillai, and J. Singh (Institute of Microelectronics) |
17:50 | 2585 | Sources of Stress Gradients in Electrodeposited Ni MEMS - S. Hearne, J. Floro, and C. Dyck (Sandia National Labs.) |
Co-Chairs: M. Tabib-Azar and A. Kornblit
Time | Abs# | Title |
---|---|---|
09:00 | 2586 | Advancements in the Gas-Phase MicroChemLab (TM) - R.P. Manginell, P.R. Lewis, D.R. Adkins, R.J. Kottenstette, D. Wheeler, D. Trudell, J. Byrnes, M. Okandan, J.M. Bauer, and R. Manley (Sandia National Labs) |
09:35 | 2587 | Electrostatic Discharge Protection for Embedded-Sensor Systems-on-a-Chip - J.A. Salcedo, J.J. Liou (University of Central Florida), M.Y. Afridi, A.R. Hefner (NIST), and A. Varma (University of Maryland) |
10:10 | Twenty-Minute Intermission | |
10:30 | 2588 | Low-Power Micro-Scale CMOS-Compatible Silicon Sensor on a Suspended Membrane - A. Kovalgin, G. Iordache, and J. Holleman (University of Twente) |
10:50 | 2589 | Performance of Miniature Parylene Gas Chromatographic Column - H.-S. Noh, C. Timmons, P.J. Hesketh, and D.W. Hess (Georgia Institute of Technology) |
11:10 | 2590 | Effect of Micro-Gap Electrode in Nitrogen Dioxide Sensor Using Tungsten Oxide Thin Film - A. Miyaji, S. Ogura, S. Konishi, and J. Tamaki (Ritsumeikan University) |
11:30 | 2591 | An Interface Circuitry for CMOS-Compatible, Micromachined-Chemical Sensor Arrays - E. Ayranci and Y. Gurbuz (Sabanci University) |
Co-Chairs: R. Manginell and J.J. Liou
Time | Abs# | Title |
---|---|---|
14:00 | 2592 | CVD Diamond Sensing Devices - W.P. Kang and J.L. Davidson (Vanderbilt University) |
14:30 | 2593 | Piezoresistive Cantilever Array for Chemical and Biological Detection - T. Thundat, L. Pinnaduwage, S. Jeon, and K. Hansen (Oak Ridge National Laboratory) |
14:50 | 2594 | Thin Film Thermal Sensor for Polymer Electrolyte Fuel Cells - S. He, M.M. Mench, and S. Tadigadapa (The Pennsylvania State University) |
15:10 | 2595 | A Quick, Reliable, and Versatile Method for Creating Microneedles for Bio-Harvesting - S.H. Kravitz, J.H. Flemming, C.F. Schmidt, and D. Ingersoll (Sandia National Labs) |
15:30 | 2596 | Modification of the Surface Roughness of Platinum Thin Film Electrodes by Alloy Formation with Aluminum - P. van der Wal, M. Dadras, M. Koudelka-Hep, and N. de Rooij (University of Neuchatel) |
15:50 | Ten-Minute Intermission | |
16:00 | 2597 | Microfabrication Processes for the Realisation of a Matrix of Solid-Propellant Microthrusters - D. Briand, P.Q. Pham, and N.F. de Rooij (University of Neuchatel) |
16:20 | 2598 | Piezoelectric MEMS Actuators Fabricated by Chemical Solution Deposition and Surface Micromachining Technologies - C. Kuegeler, U. Boettger (RWTH Aachen), and R. Waser (Research Center Juelich) |
16:40 | 2599 | High Resolution Force and Displacement Sensing with MEMS - A. Desai and A. Haque (Pennsylvania State University) |
17:00 | 2600 | Vibration and Displacement Testing of the Microvalve Actuator under Air Damping - J.S. Bintoro, A.D. Papania, Y.H. Berthelot, and P.J. Hesketh (Georgia Institute of Technology) |
17:20 | 2601 | Fabrication of Fine Plastic Microchannel by Using Hot Embossing - M. Ishizuka, J. Mizuno, T. Harada, and S. Shoji (Waseda University) |
17:40 | 2602 | Study of Patterned La0.8Sr0.2MnO3 Electrodes for Solid Oxide Fuel Cells - E. Koep, C. Compson, and M. Liu (Georgia Institute of Technology) |
Co-Chairs: P. Hesketh and J.L. Davidson
Time | Abs# | Title |
---|---|---|
o | 2603 | An Electrochemical Etching Method to Fabricate a Needle Robe With a Sharp Tip and High Aspect-ratio Geometry - C.A. Huang, J.H. Chang, C.C. Hsu, and S.Y. Yang (Chang Gung University) |
o | 2604 | Modeling of Electrochemical Pattern Etching: Influence of Convection - B. Mollay (ECHEM Center of Competence in Applied Electrochemistry), G. Nelissen, B. Van den Bossche (ELSYCA NV), J. Besenhard (Institute for Chemical Technology of Inorganic Materials, TU Graz), G. Fafilek, H. Kronberger (TU Vienna), J. Deconinck (Vrije Universiteit Brussel), and G. Nauer (University Vienna) |
o | 2605 | Evaluation of Undercut and Applicability of a Batch HF Vapor Etching System in MEMS Release Etch Processes - J. Tolomei, B. Timon (Sandia National Laboratories), and E. Bergman (Semitool, Inc.) |
o | 2606 | Advanced SiC Deep Electrochemical Etch in Hydrofluoric Acid Aqueous Solution for the Fabrication of Thin Suspended Monocristalline SiC Membrane - G. D'Arrigo, V. Raineri, and S. Di Franco (Consiglio Nazionale delle Ricerche IMM) |
o | 2607 | Liquid Sensor in Multi-Functional Integrated Circuit - C. Kaneshiro, K. Koh, A. Yamamura, K. Matsumoto, and K. Hohkawa (Kanagawa Institute of Technology) |
o | 2608 | An Easy Fabrication Technique for Micro Paraffin Actuator and Application to Microvalve - T. Kobayashi (National Institute of Advanced Industrial Science and Technology), S. Matsuoka, A. Ueno (TOTO Ltd.), and R. Maeda (National Institute of Advanced Industrial Science and Technology) |