2004 Joint International Meeting

October 3-October 8, 2004


AG1 - Microfabricated Systems and MEMS VII

Sensor/Dielectric Science and Technology/Electronics

Monday, October 4, 2004

Hibiscus 1 & 2, Level 2, Kalia Executive Conference Center

Microstructures and MEMS

Co-Chairs: P. Hesketh and D. Misra

10:00 Introductory Remarks- P. Hesketh
10:052571 Polymer MEMS: From Microbiodegradables to Microfilters to Microcombustors - M. Allen (Georgia Institute of Technology)
10:452572 Processing Challenges in the Fabrication of Advanced MEMS - A. Kornblit, V. Aksyuk, G. Bogart, C. Bolle, J.E. Bower, R. Cirelli, E. Ferry, L. Fetter, A. Gasparyan, R. Keller, F. Klemens, W. Lai, O.D. Lopez, W. Mansfield, J. Miner, C.-S. Pai, F. Pardo, S. Pau, M. Simon, T. Sorsch, J.A. Taylor, D. Tennant, and G.P. Watson (Lucent Technologies Bell Labs)
11:152573 Fabrication of 3-D Micromesh Ni Structures Using Electroplating - H. Sato, T. Otsuka, and S. Shoji (Waseda University)
11:352574 Single High Aspect Ratio Pillar Support Structures - M. Northen and K. Turner (University of California at Santa Barbara)


Co-Chairs: S. Shoji and M. Allen

14:002575 CuS and AgS Solid-Electrochemical Cells as Non-Volatile Memory Devices - M. Tabib-Azar (Case Western Reserve University)
14:302576 Electroformed Microelectrode Array for a Human Retinal Prosthesis Interface - P. Skeath (SFA, Inc.), K. Perkins (Naval Research Lab, Code 6876), L. Wasserman (SFA, Inc.), R. Schoonmaker, J. Peele (Naval Research Lab, Code 5675), and L. Johnson (SFA, Inc.)
14:502577 Dynamic Electrochemical Simulation and Testing of Micromachined Electrodes for Neural Stimulation - A. Hung (University of California, Los Angeles), D. Zhou, B. Greenberg (Second Sight Medical Products, Inc.), and J. Judy (University of California, Los Angeles)
15:102578 Simulations of Transient Signals in Micro-Galvanic Processes - G. Fafilek (ECHEM Center of Competence in Applied Electrochemistry), J. Besenhard (University of Technology, Graz Institut of Chemical Technology of inorganic materials), H. Kronberger (University of Technology, Institute of Chemical Technology and Analytics), and G. Nauer (University Vienna, Institute of Physical Chemistry)
15:302579 On the Modeling of Anisotropic Electroforming- and Micromachining - Processes - B. Mollay (ECHEM Center of Competence in Applied Electrochemistry), G. Nelissen, B. Van den Bossche (ELSYCA NV), J. Besenhard (TU Graz), G. Fafilek, H. Kronberger (TU Vienna), J. Deconinck (Vrije Universiteit Brussel), and G. Nauer (University Vienna)
15:50 Twenty-Minute Intermission
16:102580 High-Aspect-Ratio Inductively Coupled Plasma Etching of Bulk Titanium for MEMS Applications - E. Parker, M. Aimi, B. Thibeault, M. Rao, and N. MacDonald (University of California, Santa Barbara)
16:302581 Three-Dimensional Microstructures in Silicon via the Combination of Light-Ion Beam Writing and Electrochemical Etching - D. Blackwood, E.J. Teo, M. Breese, and A. Bettiol (National University of Singapore)
16:502582 Microfabrication of Graphitic Carbon Materials via Electrochemical Etching - M. McDermott, S. Ssenyange, and R. Du (University of Alberta)
17:102583 Characterization of a Batch HF Vapor Processor for MEMS Release Etching - J. Chiaroni, H. Grange (LETI-CEA), O. Pollet, and E. Bergman (Semitool, Inc.)
17:302584 A Novel Process for Singulating Fragile Devices - A. Agarwal, M. Soundarapandan, P. CSankarapillai, and J. Singh (Institute of Microelectronics)
17:502585 Sources of Stress Gradients in Electrodeposited Ni MEMS - S. Hearne, J. Floro, and C. Dyck (Sandia National Labs.)

Tuesday, October 5, 2004

Micro-instruments and Sensors

Co-Chairs: M. Tabib-Azar and A. Kornblit

09:002586 Advancements in the Gas-Phase MicroChemLab (TM) - R.P. Manginell, P.R. Lewis, D.R. Adkins, R.J. Kottenstette, D. Wheeler, D. Trudell, J. Byrnes, M. Okandan, J.M. Bauer, and R. Manley (Sandia National Labs)
09:352587 Electrostatic Discharge Protection for Embedded-Sensor Systems-on-a-Chip - J.A. Salcedo, J.J. Liou (University of Central Florida), M.Y. Afridi, A.R. Hefner (NIST), and A. Varma (University of Maryland)
10:10 Twenty-Minute Intermission
10:302588 Low-Power Micro-Scale CMOS-Compatible Silicon Sensor on a Suspended Membrane - A. Kovalgin, G. Iordache, and J. Holleman (University of Twente)
10:502589 Performance of Miniature Parylene Gas Chromatographic Column - H.-S. Noh, C. Timmons, P.J. Hesketh, and D.W. Hess (Georgia Institute of Technology)
11:102590 Effect of Micro-Gap Electrode in Nitrogen Dioxide Sensor Using Tungsten Oxide Thin Film - A. Miyaji, S. Ogura, S. Konishi, and J. Tamaki (Ritsumeikan University)
11:302591 An Interface Circuitry for CMOS-Compatible, Micromachined-Chemical Sensor Arrays - E. Ayranci and Y. Gurbuz (Sabanci University)


Co-Chairs: R. Manginell and J.J. Liou

14:002592 CVD Diamond Sensing Devices - W.P. Kang and J.L. Davidson (Vanderbilt University)
14:302593 Piezoresistive Cantilever Array for Chemical and Biological Detection - T. Thundat, L. Pinnaduwage, S. Jeon, and K. Hansen (Oak Ridge National Laboratory)
14:502594 Thin Film Thermal Sensor for Polymer Electrolyte Fuel Cells - S. He, M.M. Mench, and S. Tadigadapa (The Pennsylvania State University)
15:102595 A Quick, Reliable, and Versatile Method for Creating Microneedles for Bio-Harvesting - S.H. Kravitz, J.H. Flemming, C.F. Schmidt, and D. Ingersoll (Sandia National Labs)
15:302596 Modification of the Surface Roughness of Platinum Thin Film Electrodes by Alloy Formation with Aluminum - P. van der Wal, M. Dadras, M. Koudelka-Hep, and N. de Rooij (University of Neuchatel)
15:50 Ten-Minute Intermission
16:002597 Microfabrication Processes for the Realisation of a Matrix of Solid-Propellant Microthrusters - D. Briand, P.Q. Pham, and N.F. de Rooij (University of Neuchatel)
16:202598 Piezoelectric MEMS Actuators Fabricated by Chemical Solution Deposition and Surface Micromachining Technologies - C. Kuegeler, U. Boettger (RWTH Aachen), and R. Waser (Research Center Juelich)
16:402599 High Resolution Force and Displacement Sensing with MEMS - A. Desai and A. Haque (Pennsylvania State University)
17:002600 Vibration and Displacement Testing of the Microvalve Actuator under Air Damping - J.S. Bintoro, A.D. Papania, Y.H. Berthelot, and P.J. Hesketh (Georgia Institute of Technology)
17:202601 Fabrication of Fine Plastic Microchannel by Using Hot Embossing - M. Ishizuka, J. Mizuno, T. Harada, and S. Shoji (Waseda University)
17:402602 Study of Patterned La0.8Sr0.2MnO3 Electrodes for Solid Oxide Fuel Cells - E. Koep, C. Compson, and M. Liu (Georgia Institute of Technology)

Coral Lounge, Level 6, Mid Pacific Conference Center

Tuesday Evening Poster Session and Technical Exhibit

Co-Chairs: P. Hesketh and J.L. Davidson

o2603 An Electrochemical Etching Method to Fabricate a Needle Robe With a Sharp Tip and High Aspect-ratio Geometry - C.A. Huang, J.H. Chang, C.C. Hsu, and S.Y. Yang (Chang Gung University)
o2604 Modeling of Electrochemical Pattern Etching: Influence of Convection - B. Mollay (ECHEM Center of Competence in Applied Electrochemistry), G. Nelissen, B. Van den Bossche (ELSYCA NV), J. Besenhard (Institute for Chemical Technology of Inorganic Materials, TU Graz), G. Fafilek, H. Kronberger (TU Vienna), J. Deconinck (Vrije Universiteit Brussel), and G. Nauer (University Vienna)
o2605 Evaluation of Undercut and Applicability of a Batch HF Vapor Etching System in MEMS Release Etch Processes - J. Tolomei, B. Timon (Sandia National Laboratories), and E. Bergman (Semitool, Inc.)
o2606 Advanced SiC Deep Electrochemical Etch in Hydrofluoric Acid Aqueous Solution for the Fabrication of Thin Suspended Monocristalline SiC Membrane - G. D'Arrigo, V. Raineri, and S. Di Franco (Consiglio Nazionale delle Ricerche IMM)
o2607 Liquid Sensor in Multi-Functional Integrated Circuit - C. Kaneshiro, K. Koh, A. Yamamura, K. Matsumoto, and K. Hohkawa (Kanagawa Institute of Technology)
o2608 An Easy Fabrication Technique for Micro Paraffin Actuator and Application to Microvalve - T. Kobayashi (National Institute of Advanced Industrial Science and Technology), S. Matsuoka, A. Ueno (TOTO Ltd.), and R. Maeda (National Institute of Advanced Industrial Science and Technology)