201st Meeting - Philadelphia, PA
May 12-17, 2002
PROGRAM INFORMATION
L1 - Electrodeposition: Historical Perspective and Future Directions
Electrodeposition
Monday, May 13, 2002
Salon K, Level 5
Co-Chairs: T.P. Moffat and A.A. Gewirth
Nanostructures
Co-Chairs: A.A. Gewirth and S.L. Yau
Tuesday, May 14, 2002
Roughness Evolution
Co-Chairs: T.P. Moffat and W. Schwartzacher
Time | Abs# | Title |
8:00 | 478 |
Scaling Analysis of Roughness Evolution in Electrodeposited Films - W. Schwarzacher (H H Wills Physics Laboratory) |
8:40 | 479 |
Evolution of Island Distributions during Submonolayer Potential-Pulse Electrodeposition: Dynamical Monte Carlo Simulations - P.A. Rikvold and
D.E. Roberts (Florida State University) |
9:00 | 480 |
Microstructured Electrodeposition of Copper using Pulse Plating - E.
Pircher, G. Telias, P. Pessenda-Garcia, S. Hansal, W.E.G. Hansal, B. Mollay (ECHEM),
J.O. Besenhard (Graz University of Technology), H. Kronberger (Vienna University of Technology), and
G.E. Nauer (University of Vienna) |
9:20 | 481 |
Superconformal Electrodeposition - T.
Moffat, D. Wheeler, D. Josell, and D. Josell (NIST) |
9:40 | 482 |
Effect of Additives on Copper Electroplating: Vibrational Spectroscopic and AFM Measurements - M. Kang,
T.Y.B. Leung, M.E. Biggin, and A. Gewirth (University of Illinois) |
10:00 | 483 |
Inhibition of Copper Electrodepostion by Polyethylene Glycol and Chlorine Ion - M.
Hayase, M. Taketani, T. Hatsuzawa (Tokyo Institute of Technology), and K. Hayabusa (Ebara Research Co., LTD) |
10:20 | 484 |
Spectroelectrochemical Studies of Organic Additives for the Electrodeposition of Au - B. Bozzini
(Universita di Lecce) |
10:40 | |
Thirty-Minute Intermission - |
Co-Chairs: P.C. Searson and J. Stickney
Time | Abs# | Title |
1:40 | 485 |
Nonlinear Electrochemical Oscillations during Tin Electrodeposition in the Presence of Surface Surfactant - S. Nakanishi, S.-I. Sakai, K.
Fukami, and Y. Nakato (Osaka University) |
2:00 | 486 |
Electrodeposition of Semiconductors - D. Lincot
(Ecole Nationale Superieure de Chimie de Paris) |
2:40 | 487 |
Electrodeposition of Epitaxial ZnSe Films on (11) InP and (100) GaAs from an Aqueous Selenosulfate Solution - G. Riveros
(Universidad Catolica de Valparaiso), H. Rodrigo, D. Lincot, J.-F. Guillemoles
(ENSCP), H. Gomez-Meier (Universidad Catolica de Valparaiso), and M. Froment (Universite Pierre et Marie Curie) |
3:00 | 488 |
New Facets of CdTe Electrodeposition as Revealed by Working Under Fast Growth Rate Conditions - C.
Lepiller, J. Kurdi, P. Poizot, J. Vedel, and D. Lincot (Ecole Nationale Superieure de Chimie de Paris) |
3:20 | 489 |
Compound Semiconductor Electrodeposition, A Historical Perspective - J. Stickney (University of Georgia) |
4:00 | 490 |
Electrodeposition of Tungsten and Titanium Oxides from Peroxo Precursors - T.
Pauporte, D. Lincot (UMR), K. Rajeshwar, and N. De Tacconi (University of Texas) |
4:20 | 491 |
Cobalt Hexacuanoferrate: Compound Stoichiometry and Photoinduced Electron Transfer - N. de
Tacconi, K. Rajeshwar (The University of Texas at Arlington), R. Lezna (Universidad Nacional de La Plata), and R. Romagnoli
(CIDEPINT) |
Franklin Hall, Level 4
Co-Chairs: A.A. Gewirth and T.P. Moffat
Time | Abs# | Title |
o | 492 |
Reduction of Silver Ions with Polyhydroxy Alcohols - S. Djokic (The Westaim Corporation) |
o | 493 |
Optimization of Novel Silver Alloy Electroless Deposition Solution for ULSI Applications - A.
Inberg, V. Bogush, N. Croitoru (Tel-Aviv University), V. Dubin (Intel), and Y. Shacham-Diamand (Tel-Aviv University) |
o | 494 |
The Study of the Electrodeposition of Nickel-alumina Composite - P.-H. Hsieh and M.-C. Yang (National Cheng Kung University) |
o | 495 |
Characterization of Initial Stages of the Electrodeposition of Ni, Zn and Ni-Zn Alloy by EQCM - K.-D. Song and K.-B. Kim
(Yonsei University) |
o | 496 |
Influence of Additives on the Electrodeposition of Zinc-Nickel-Iron Alloys - M.
Sundar, A.V. Raajaraajan, A. Arunprasath (Central Electrochemical Research Inst.), V.
Venkataram, M. Puahpavanam (Central Electrochemical Research Inst), and G. Sheela (Central Electrochemical Research Inst.) |
o | 497 |
Effect of Additives on the Electrodeposition of Zn-Ni-Co Alloys - A.
Arunprasath, V. Venkataram, M. Sundar, A.V. Raajaraajan, M. Pushpavanam, and G. Sheela (Central Electrochemical Research Institute) |
o | 498 |
Magnetic Studies of Low-dimensionality Electrodeposited Metal Structures - K.
Poduska, E. Lin, and S. Morin (York University) |
o | 499 |
Nitrate Reduction Catalyzed by Surface Bimetallic Composite on Au(111) - S. Hwang, J. Lee, and J. Kwak (Korea Advanced Institute of Science and Technology) |
o | 500 |
Scanning Tunneling Microscopy Study of Silver upon Au (111) in the Presence of Chloride - J. Lee, S. Hwang, and J. Kwak (Korea Advanced Institute of Science and Technology) |
o | 501 |
Cathodic Reactivity of Alkaline Metal Iodides Toward Platinum and Palladium. The Formation of New Thick Reducing Phases - J. Simonet and C. Cougnon
(Universite de Rennes 1) |
Wednesday, May 15, 2002
Salon K, Level 5
Magnetic Materials
Co-Chairs: K. Attenborough and T. Osaka
Electroless Deposition and Other Materials
Co-Chairs: S. Djokic and K. Attenborough
Time | Abs# | Title |
1:40 | 508 |
Magnetic Field Effect on Electrodeposition of Copper Nanowire Arrays - Y. Konishi, M. Motoyama, H. Matsushima, Y. Fukunaka, Y. Ito, and Y. Ito (Kyoto University) |
2:00 | 509 |
Future Prospective on Electroless Plating - Some Applications in the Electronics Field - - T. Osaka and T. Yokoshima (Waseda University) |
2:40 | 510 |
Effect of Sulfide Ions on Accelerating the Process of Direct Copper Plating - C.-C. Wan, Y.-Y. Wang, and Y.-J. Hung (Tsing Hua University) |
3:00 | 511 |
Electroless Metallization of Dielectrics, Semiconductors and Powder-Like Particles - T. Khoperia, T. Zedginidze, and N. Khoperia (Institute of Physics Georgian Academy of Sciences) |
3:20 | 512 |
Electrodeposition and Characterization of Sacrificial Copper-Manganese Alloy Coatings - J. Gong (The University of Alabama), F. Xu (University of Pittsburgh), G. Wei (The University of Alabama), J. Barnard (University of Pittsburgh), and G. Zangari (The University of Alabama) |
3:40 | 513 |
Wear Resistant Nickel Dispersion Layers Produced Using Pulse Plating - A. Staudinger, S. Hansal, W. Hansal, J. Kolndorfer, T. Steck, C. Suarez-Ramon (ECHEM), J.O. Besenhard (Graz University of Technology), H. Kronberger (Vienna University of Technology), and G.E. Nauer (University of Vienna) |
4:00 | 514 |
Electrodeposition of Aluminum in 1-Methyl-3- Hexyl Imidazolium Chloride Ionic Liquid at Low Temperatures - V. Kamavaram and R.G. Reddy (The University of Alabama) |
4:20 | 515 |
Preparation and Characterization of PdAg Layer on Al2O3 Substrate by Electroless Co-deposition - C.-Y. Chu and H.-I. Chen (National Cheng Kung University) |
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