Co-Chairs: Y. Tsukada and P. Kohl
Time | Abs# | Title |
---|---|---|
10:00 | 1089 | Recent Trends in Electrodeposited Lead-Free Solders for Flip-Chip Interconnects - T. Ritzdorf and B. Kim (Semitool, Inc.) |
10:40 | 1090 | Nucleation Kinetics of Tin and Tin-Silver Electrodeposition on Copper and Nickel - D. Barkey and Z. Zhang (University of New Hampshire) |
11:00 | 1091 | Effects of deposition conditions on the feature-scale growths of through-mask deposited metals - B. Kim, T. Ritzdorf, C. Sharbono, and G. Saveskie (Semitool Inc.) |
11:20 | 1092 | Multi-Scale Modeling of Through-Mask, Electrochemical Deposition - G. Wilson and P. McHugh (Semitool, Inc) |
11:40 | 1093 | High Deposition Rate Cu Plating for Pillar Bump Application - B.(Q. Wu, Z. Liu, A. Keigler, and J. Harrell (Nexx Systems, Inc.) |
Co-Chairs: H. Honma and M. Datta
Co-Chairs: Y. Tsukada and K. Kondo
Time | Abs# | Title |
---|---|---|
10:00 | 1103 | Ubiquitous Network - A Brave New Communication World - - T. Asami (KDDI R&D Labs., Inc.) |
10:40 | 1104 | Compliant, High-Density Electrical/Optical Input-Output Connections. - M. Bakir, A. He, K. Martin, J. Meindl, S.A. Allen, and P. Kohl (Georgia Institute of Technology) |
11:00 | 1105 | High Density Interconnect Using Transient Liquid Bonding Technology for High Speed Microelectronic Packages - K.-C. Liu and M. Lee (Fujitsu Laboratories of America) |
11:20 | 1106 | Fabrication of Air Channels for Microelectromechanical and Microelectronic Applications - P.J. Joseph, H.A.R. Kelleher, P.A. Kohl, and S.A. Bidstrup Allen (Georgia Tech) |
11:40 | 1107 | Multi-band Integrated RF/Wireless Functions in Liquid Crystal Polymer (LCP) System-On-Package Technology - E.(M. Tentzeris, J. Papapolymerou, and J. Laskar (School of ECE, Georgia Tech) |
Co-Chairs: H. Honma and D. Barkley
Co-Chairs: D. Barkley and K. Kondo
Time | Abs# | Title |
---|---|---|
o | 1118 | Acceleration Effect of Copper Damascene Electrodeposition -2.Monitoring by R.R.D.E- - K. Watanabe and K. Kondo (Graduate School of Engineering, Osaka Prefecture University) |
o | 1119 | Copper Core Bump Attached with Lead Free Solder for High Density Interconnection - D. Mu, K. Kondo, and J. Maeda (Okayama Univeristy) |
o | 1120 | Chip-Bonding for Integrated Circuit by using Micro-spring Probe - C. Kaneshiro and K. Hohkawa (Kanagawa Institute of Technology) |