203rd Meeting - Paris, France
April 27-May 2, 2003
PROGRAM INFORMATION
F1 - Science and Technology of Dielectrics in Emerging Fields
Dielectric Science and Technology/Electronics
Monday, April 28, 2003
Room 353, Level 3, Le Palais des Congres
Biosystems and Microsystems
Co-Chairs: D. Misra and K. Worhoff
Time | Abs# | Title |
10:00 | |
Introductory Remarks |
10:05 | 350 |
Ion Track Nanostructuring of Dielectrics - K. Hjort (Uppsala University), E. Balanzat (Centre Interdisciplinaire de Recherche Ions Lasers), E. Ferain, R. Legras (Universite Catholique de Louvain), C. Trautmann (GSI), M. Toulemonde (Centre Interdisciplinaire de Recherche Ions Lasers), and A. Weidinger (Hahn-Meitner-Institut Berlin) |
10:20 | 351 |
Design, Integration and Performance Evaluation of Optical Detection Elements for Miniaturized Biochemical Devices - K.B. Mogensen, A.M. Jorgensen, N.J. Petersen, O. Geschke, and J.P. Kutter (Technical University of Denmark) |
10:40 | 352 |
Silicon-Based Field-Effect Structures - From Dielectrics to Bioelectronics - M.J. Schoening (University of Applied Sciences Aachen) |
11:00 | 353 |
Neurotransistors for Biomedical Technology - V.J. Kapoor (The University of Toledo) |
11:20 | 354 |
Biosensors Based On Standard Dielectric Materials - J. Bausells (Centro Nacional de Microelectronica), A. Errachid (Parc Cientific de Barcelona), and N. Zine (Centro Nacional de Microelectronica) |
11:40 | 355 |
Barrier Films on Paper and Cellulose using Fluorocarbon Plasmas - S. Vaswani (Georgia Institute of Technology), J. Koskinen (Institute of Paper Science and Technology), S. Zauscher (Duke University), and D. Hess (Georgia Institute of Technology) |
12:00 | 356 |
Controlled Filling of Silicon Trenches with Doped Oxide for MEMS - A. Agarwal and R. N. (Institute of Microelectronics) |
Integrated Optics and Optical Applications
Co-Chairs: P. Mascher and D. Poitras
Time | Abs# | Title |
13:30 | 357 |
Photonic Crystal and Photonic Wire Technologies and Devices - R.M. De La Rue, N. Johnson, B. Treble, C. Jin, A.S. Jugessur, I. Ntakis, E. Camargo, H. Chong, P. Pottier (The University of Glasgow), D.W. McComb, and M. McLachlan (University of Glasgow) |
13:50 | 358 |
Optical and Electronic Properties of Nanoscale Si/SiO_2 Superlattices - D.J. Lockwood (National Research Council) |
14:10 | 359 |
MOCVD-Deposited Dielectric Films for Integrated Optical and Microelectronic Circuits - J. Mueller (Technical University Hamburg- Harburg) |
14:30 | 360 |
Optical Characaterization of LPCVD SiOxNy Thin Films - M. Modreanu (National Microelectronics Research Centre (NMRC)), M. Gartner (Institute of Physical Chemistry), and N. Tomozeiu (Utrecht University) |
14:50 | 361 |
Material Consideration for Integrated Optics in Silica-on-Silicon Technology - L. Wosinski, M. Dainese, and H. Fernando (Royal Institute of Technology) |
15:10 | |
Ten-Minute Intermission |
Integrated Optics and Optical Applications (cont'd)
Co-Chairs: R.M. De La Rue and D.J. Lockwood
Materials Processing
Co-Chairs: A. Kholkin and B. Sopori
Time | Abs# | Title |
16:40 | 366 |
Temporal Pulse Shaping and Optimization in Ultrafast Laser Ablation of Materials - R. Stoian, S. Winkler, M. Hildebrand, M. Boyle, A. Thoss, A. Rosenfeld, and I.V. Hertel (Max-Born Institut fur Nichtlineare Optik und Kurzzeitspektroskopie) |
17:00 | 367 |
Development and Characterization of KOH Resistant PECVD Silicon Nitride for Microsystems Applications - F.E. Rasmussen, B. Geilman, M. Heschel, O. Hansen, and A.M. Jorgensen (Technical University of Denmark) |
17:15 | 368 |
The Influence of Grain Boundary Impedances on the Electrical Properties of CaCu3Ti4O12 Ceramics - D. Sinclair, T. Adams, and A. West (University of Sheffield) |
17:35 | 369 |
Ferroelectric Properties of Pb-Excess PZT Thin Films Prepared by Zirconium Oxyacetate-Based Sol-Gel Process - K. Nakano, G. Sakai, K. Sakai, and N. Yamazoe (Kyushu University) |
Tuesday, April 29, 2003
Progress in Electronics
Co-Chairs: M.W. Cole and L. Tsybeskov
Time | Abs# | Title |
8:00 | 370 |
Nanocrystalline Silicon Superlattices: Novel Structures for Electron Device Applications - L. Tsybeskov (New Jersey Institute of Technology) |
8:20 | 371 |
Growth of GaN Nanorods with Low Carrier Concentration - T.W. Kang and H.-M. Kim (Dongguk University) |
8:40 | 372 |
New Trends in Silicon Thin Films and Applications - J.-P. Kleider (SUPELEC), P. Roca i Cabarrocas (Ecole Polytechnique), and C. Guedj (CEA-Grenoble) |
9:00 | 373 |
Novel Dielectric Thin Films for Frequency Agile Microwave Devices - M.W. Cole, W. Nothwang, C. Hubbard, E. Ngo, M. Ervin, M. Wood (U.S. Army research Laboratory), and R.G. Geyer (National Institute of Standards and Technology) |
9:20 | 374 |
Materials Challenges for Ultrathin Gate Dielectrics for CMOS and Other Applications - S. Guha, V. Narayanan, N.A. Bojarczuk, and E. Gousev (IBM) |
9:40 | 375 |
Material Aspects in Emerging Nonvolatile Memories - T. Mikolajick (Infineon Technologies Dresden) |
10:00 | 376 |
Investigation of RU Thin Films Prepared by Chemical Vapor Deposition as Bottom Electrodes for Memory Applications - S.Y. Kang, H.J. Lim, C.S. Hwang, and H.J. Kim (Seoul National University) |
10:15 | |
Ten-Minute Intermission |
Low-K and High-K Dielectrics
Co-Chairs: S. Guha and A. Grill
Time | Abs# | Title |
10:25 | 377 |
Characterization of Low-k to Extreme Low-k SiCOH Dielectrics - A. Grill (IBM) |
10:45 | 378 |
Challenges for the Application of High-k Gate Dielectrics in Future CMOS Technologies - E. Cartier (IBM Research Division) |
11:05 | 379 |
High-throughput Screening of Binary and Ternary Dielectric Oxides by Combinatorial Technology - H. Koinuma (Tokyo Institute of Technology) |
11:25 | 380 |
Progress in Novel Oxides for Gate Dielectrics And Surface Passivation of GaN/AlGaN Heterostructure Field Effect Transistors - C.R. Abernathy, B.P. Gila, A.H. Onstine, S.J. Pearton, J. Kim, B. Luo, R. Mehandru, F. Ren (University of Florida), J.K. Gillespie, R.C. Fitch, J. Sewell, R. Dettmer, G.D. Via, A. Crespo, T.J. Jenkins (Air Force Research Laboratory), and Y. Irokawa (Toyota Central Research and Development Laboratories, Inc.) |
11:45 | 381 |
Atomic Layer Deposition of High-K Dielectrics for Metal-Oxide-Semiconductor Devices - Y.-S. Lin, R. Puthenkovilakam, and J. Chang (UCLA) |
12:00 | 382 |
Investigation of Slow/Fast Interface States of Al2O3/Si MOS system using Deep Level Transient Spectroscopy - I.S. Jeon, D. Eom, M. Cho, H.B. Park, J. Park, and C.S. Hwang (Seoul National University) |
12:15 | 383 |
Influence of the 5 A TaNx Interface Layer on Doped Metal Oxide High-k Dielectric Characteristics - Y. Kuo and J. Lu (Texas A and M University) |
12:30 | 384 |
Research Of HfO_2 Film Deposited On SOI Substrate - K. Tao (Chinese Academy of Science) |
12:45 | 385 |
Characterization of a Potential Gate Dielectric: MOCVD-grown Erbium Oxide on Silicon - M.P. Singh, C.S. Thakur, N. Bhat, and S.A. Shivashankar (Indian Institute of Science) |
Hall Maillot, Level 2, Le Palais des Congres
Technical Exhibit and Tuesday Evening Poster Session
Co-Chairs: K. Worhoff and P. Mascher
Time | Abs# | Title |
o | 386 |
Conduction Mechanisms in Fluorocarbon Thin Films - A. Sylvestre and P. Gonon (LEMD-CNRS) |
o | 387 |
Potential Fluctuations in High-k Based Dielectric MOS Devices - J.-L. Autran, D. Munteanu, and M. Houssa (UMR CNRS 6137) |
o | 388 |
Characterization of Thermally Evaporated ZrO2 - M. Bhaskaran, P. Swain (Sarnoff Corporation), and D. Misra (New Jersey Institute of Technology) |
o | 389 |
Synthesis and Characterization of Zinc Titanate Doped with Magnesium - Y.S. Chang, Y.H. Chang, I.G. Chen (National Cheng Kung University), and G.J. Chen (I-Shou University) |
o | 390 |
Investigation of High Dielectric Film on the Plastic Substrate by Novel Liquid-Phase Heterojunction - C.J. Huang, W.R. Chen, P.H. Chiu, C.Z. Chen, M.S. Lin, S.L. Lee, and Z.Y. Lin (Southern Taiwan University of Technology) |
o | 391 |
Thickness and Temperature Dependence of the AC Electrical Conductivity of Porous Silicon Thin Films - M. Theodoropoulou, S.N. Georgia, C.A. Krontiras, N. Xanthopoulos, M.N. Pisanias (University of Patras), C. Tsamis, and A.G. Nassiopoulou (IMEL/NCSR Demokritos) |
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