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Copper Electrodeposition for Via Filling
Osaka Prefecture University – Sakai, Japan
The researcher will be engaged in the development of new electrodeposition process for three dimensional packaging including TSV process; design copper deposition bath containing appropriate additives and fabricate copper filled deep vias on silicon wafer; use analytical techniques such as cyclic voltammetry, chronoamperometry, SEM, XRD, and so on. Presents of research at international conferences and publish in peer-reviewed journals are encouraged upon approval from collaborating companies and institutes.
Battery Applications Development Professional
Molecular Rebar Design – Austin, Texas
We are seeking a skilled, dedicated professional to join our technical team to focus on the application development of our battery applications. Applications Development is a market-driven role requiring customer intimacy and technical depth. It marries fundamental science with a deep understanding of the lead acid and li-ion battery markets. Application development, product development and new business development are part of this role.
Postdoctoral Research Position
New Mexico State University – Las Cruces, New Mexico
A postdoctoral position supported by NSF in the general area of electrocatalysis at nanoparticle ensembles of ultramicrodimensions and at single nanoparticles is available immediately in the Department of Chemistry and Biochemistry at New Mexico State University. Candidates must have a Ph.D. in Chemistry with a strong background in electrochemistry/electroanalytical chemistry. Expertise in the use of scanning electrochemical microscopy (SECM), ultramicroelectrodes, nanoparticle collision experiments, and Comsol Multiphysics simulations is desired.