ECS Sensors Plus

About ECSSP

ECS Sensors Plus is a multidisciplinary, gold open-access journal dedicated to advancing the science and engineering of sensors and sensing systems. The journal provides an international platform for publishing high-quality, impactful research and serves as a comprehensive “one-stop” venue for innovations spanning sensing concepts, materials, system integration, and application-driven design.

The journal welcomes scholarly content on:
Detection approaches, including but not limited to optical, electrochemical, quartz crystal microbalance (QCM), force microscopy, and related methodologies;
Sensing principles, including but not limited to affinity-based sensing, biocatalysis, electrocatalysis, catalysis, DNA nanotechnology, single-entity detection, and related mechanisms;
Sensor materials and fabrication, including but not limited to 2D/3D/4D printing, microfluidics, nanomaterials, quantum materials, and advanced fabrication strategies;
Sensor systems and artificial intelligence, including but not limited to sensor arrays, interdigitated platforms, networked sensors, AI integration, and quantum-enabled sensing architectures;
Deployment of platforms, including but not limited to benchtop, wearable, implantable, portable, and lab-on-a-chip systems;
Applications, including but not limited to biomedical, environmental, infrastructural, fitness and activity monitoring, energy systems, and other emerging application domains.

Journal Links
» Read ECSSP Articles
» Technical Scope
» Journal Submission Instructions
» Submit an article to ECSSP
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Journal Editorial Board

Interim Editor-in-Chief

Netz Arroyo
University of North Carolina at Chapel Hill
Chapel Hill, NC US

Associate Editors

Michael Adachi
Simon Fraser University
Vancouver, BC, Canada
Trisha Andrew
University of Massachusetts Amherst
Amherst, MA US
Thiagarajan Soundappan
Navajo Technical University
Crownpoint, NM US
Jeffrey Bell
Washington State University
Pullman, WA US
Itthipon Jeerapan
Prince of Songkla University
Hat Yai, Thailand
 

 

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