The ECS Journal of Solid State Science and Technology is publishing a focus issue in connection with the 245th ECS Meeting Chemical Mechanical Polishing 17 symposium honoring Professor S .V. Babu, who celebrates his 80th birthday in 2024. This issue presents state of the art and reviews of approaches that will reduce the gap between our understanding of fundamentals and practice of CMP and should help accelerate beneficial changes in related hardware and consumables.
Prof. Babu has played an important role in advancing these domains through extensive research publications and patents, mentorship of 50 PhD students, and collaboration with the industry. He has contributed to various improvements in CMP processes, materials, and equipment for the last three decades. Prof. Babu edited the first focus issue on CMP in 2015 and the first (2016) and second editions (2022) of the book Advances in Chemical Mechanical Planarization. He received lifetime achievement awards from ICPT (International Conference on Planarization/CMP Technology) in Leuven, Belgium, and from Clarkson University, U.S., both in 2018, as well as several awards from IBM and Intel. Prof. Babu was the lead organizer of the International CMP conferences held in Lake Placid, U.S., for 22 years.
Honoring Prof. Babu’s long-lasting contributions, this focus issue covers recent advances and explores recent as well as new and novel developments in CMP and post-CMP cleaning processes for advanced technology nodes, featuring contributions from leading researchers and engineers across academia and industry. The focus is on materials, characterization, design, modeling, equipment, metrology, and the fundamental science relevant to CMP.
Reviews, critical reviews, perspectives, methods, communications, and original research articles are welcomed.
Accepting Submissions: January 5, 2023 | Submission Deadline: September 5, 2024
Jihoon Seo, Clarkson University, U.S. | Jseo@clarkson.edu
Matthew Prince, Intel Corporation, U.S. | firstname.lastname@example.org
Manabu Tsujimura, Ebara Corporation, Japan | email@example.com
Mark Buehler, Intel Corporation, U.S. | firstname.lastname@example.org
Suresh Ramarajan, Micron Technology, U.S. | email@example.com
Taesung Kim, Sungkyunkwan University, South Korea | firstname.lastname@example.org
Sameer Deshpande, Applied Materials Inc., U.S. | email@example.com
Michael White, Entegris Inc., U.S. | firstname.lastname@example.org
Nandan Kenchappa, Applied Materials Inc., U.S. | Nandan_kenchappa@amat.com
Gautam Banerjee, Air Products and Chemicals, U.S. | email@example.com
Yaw S Obeng, NIST, U.S. | firstname.lastname@example.org
Aniruddh Jagdish Khanna, Applied Materials, Inc., U.S. | email@example.com
Krishnan Rajeshwar, The University of Texas at Arlington, U.S. | firstname.lastname@example.org
Articles are published in a standard issue of the journal as they are accepted. If selected at submission, accepted papers are published online in the ECS Digital Library on IOPscience within 24 hours of scheduling for publication. The version of record is published online within approximately 10 days of final acceptance.
Visit the ECS website for author submission instructions and requirements for each article type.
OPEN ACCESS: Authors choosing to publish open access agree to pay an article processing charge (APC) if their papers are accepted. APCs are discounted by 75 percent for ECS members and waived for authors from ECS Plus subscribing institutions. Check if your institution subscribes to ECS Plus. Discounts are applied at the time of payment.