Call for Papers
The ECS Journal of Solid State Science and Technology is publishing a focus issue on Emerging Trends in CMP. Chemical Mechanical Planarization (CMP) is a widely accepted global planarization technology that has been deployed by integrated circuit (IC) manufacturers across the globe. It is considered a critical and enabling step in IC manufacturing. A CMP process requires a correct combination of CMP consumables such as slurry, pad, pad conditioner, and cleaning chemistries, along with equipment and end point technology. As device fabrication advances to sub-7 nm nodes, it is critical that advances in CMP can meet future challenges for these advanced CMP processes. A lot of research is being performed in the CMP area. This focus issue is intended to bring high quality research articles to the scientific community.
This virtual issue focuses on papers covering the following topics:
- CMP consumables such as slurries, brushes, pads, pad conditioners, etc.;
- Cleaning technologies and chemistries;
- Equipment and endpoint technologies;
- CMP of emerging materials;
- Advances in metrology for a CMP process;
- Future challenges and growth opportunities for CMP.
Reviews, critical reviews, and perspective papers are welcomed.
Accepting Submissions: December 2, 2021 | Submission Deadline: March 2, 2022
(At the time of submission, indicate that the paper is intended for the Emerging Trends in CMP focus issue.)
Duane Boning, Massachusetts Institute of Technology, U.S. | firstname.lastname@example.org
Pradeep Veera, Intel Corporation, U.S. | email@example.com
Knut Gottfried, Fraunhofer ENAS, Germany | Knut.Gottfried@enas.fraunhofer.de
Abhudaya Mishra, ASM, U.S. | firstname.lastname@example.org
Veera Raghava Kakireddy, Applied Materials, Inc., U.S | email@example.com
Jingoo Park, Nano-bio Electronic Materials and Processing Lab (NEMPL), Hanyang University, South Korea | firstname.lastname@example.org
Jichul Yang, Ebara Technologies, Inc., South Korea | email@example.com
Gowrisankar Damarla, Micron Technology, Inc., U.S | firstname.lastname@example.org
Taesung Kim, Sungkyunkwan University, South Korea | email@example.com
Xinchun Lu, Tsinghua University, China | firstname.lastname@example.org
Arthur Chen, National Taiwan University of Science and Technology, Taiwan | email@example.com
Bahar Basim, Intel Corporation, U.S. | firstname.lastname@example.org
Aniruddh Jagdish Khanna, Applied Materials, Inc., U.S. | email@example.com
Krishnan Rajeshwar, The University of Texas at Arlington, U.S. | firstname.lastname@example.org
Articles are published in a standard issue of the journal as they are accepted. If selected at submission, accepted papers are published online in the ECS Digital Library within 24 hours of scheduling for publication. The version of record is published online within approximately 10 days of final acceptance.
Visit the ECS website for author submission instructions and requirements of each article type.
OPEN ACCESS: If open access is selected at the time of submission, authors must agree to pay an article processing charge (APC) if the paper is accepted. ECS members receive a 75 percent discount on all APCs. All discounts are applied at the time of payment. Authors from ECS Plus subscribing institutions are eligible to have APCs waived. Check if your institution subscribes to ECS Plus.