Focus Issue on Emerging Trends in CMP

Call for Papers

The ECS Journal of Solid State Science and Technology is publishing a focus issue on Emerging Trends in CMP. Chemical Mechanical Planarization (CMP) is a widely accepted global planarization technology that has been deployed by integrated circuit (IC) manufacturers across the globe. It is considered a critical and enabling step in IC manufacturing. A CMP process requires a correct combination of CMP consumables such as slurry, pad, pad conditioner, and cleaning chemistries, along with equipment and end point technology. As device fabrication advances to sub-7 nm nodes, it is critical that advances in CMP can meet future challenges for these advanced CMP processes. A lot of research is being performed in the CMP area. This focus issue is intended to bring high quality research articles to the scientific community.

This virtual issue focuses on papers covering the following topics: 

  • CMP consumables such as slurries, brushes, pads, pad conditioners, etc.;
  • Cleaning technologies and chemistries;
  • Equipment and endpoint technologies;
  • CMP of emerging materials;
  • Advances in metrology for a CMP process;
  • Future challenges and growth opportunities for CMP.

Reviews, critical reviews, and perspective papers are welcomed.

Accepting Submissions: December 2, 2021 | Submission Deadline: March 2, 2022

(At the time of submission, indicate that the paper is intended for the Emerging Trends in CMP focus issue.)

Guest Editors

Duane Boning, Massachusetts Institute of Technology, U.S. |
Pradeep Veera, Intel Corporation, U.S. |
Knut Gottfried, Fraunhofer ENAS, Germany |
Abhudaya Mishra, ASM, U.S. |
Veera Raghava Kakireddy, Applied Materials, Inc., U.S |
Jingoo Park, Nano-bio Electronic Materials and Processing Lab (NEMPL), Hanyang University, South Korea |
Jichul Yang, Ebara Technologies, Inc., South Korea |
Gowrisankar Damarla, Micron Technology, Inc., U.S |
Taesung Kim, Sungkyunkwan University, South Korea |
Xinchun Lu, Tsinghua University, China |
Arthur Chen, National Taiwan University of Science and Technology, Taiwan |
Bahar Basim, Intel Corporation, U.S. |

Technical Editor

Aniruddh Jagdish Khanna, Applied Materials, Inc., U.S. |


Krishnan Rajeshwar, The University of Texas at Arlington, U.S. |

Articles are published in a standard issue of the journal as they are accepted. If selected at submission, accepted papers are published online in the ECS Digital Library within 24 hours of scheduling for publication. The version of record is published online within approximately 10 days of final acceptance.

Visit the ECS website for author submission instructions and requirements of each article type.

OPEN ACCESS: If open access is selected at the time of submission, authors must agree to pay an article processing charge (APC) if the paper is accepted. ECS members receive a 75 percent discount on all APCs. All discounts are applied at the time of payment. Authors from ECS Plus subscribing institutions are eligible to have APCs waived. Check if your institution subscribes to ECS Plus. 


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