Topic Close-up #1
Symposium D03—Advanced 3D Interconnect Technologies and Packaging
Extended abstract deadline:
April 21, 2023
Symposium focus: Advanced 3D Interconnect Technologies and Packaging focuses on recent developments in 3D interconnects and advanced packaging. The aim of this symposium is to discuss the various aspects of 3D integration from design to reliability, process/integration, and the various enabling materials, processes, and capabilities required to bring the technology into full commercialization.
Who should attend?
Students, engineers, and managers involved with any aspect of the electronics industry, should attend this symposium. It is equally suited for R&D professionals and scientists.
For more information, please consult the Call for Papers.