Topic Close-up #6
Symposium: D01—Chemical Mechanical Polishing 17
For more information on 245th ECS Meeting symposia, consult additional topic close-ups.
Deadline for submitting abstracts:
December 1, 2023
Submit today!
Symposium focus: The Chemical Mechanical Polishing (CMP) 17 symposium brings together engineers and scientists from around the world to address both fundamentals and current research topics in this vital planarization and surface finishing technology. The symposium also focuses on emerging applications such as advanced packaging and heterogeneous integration (e.g., chiplets), virtual metrology, digital twin, AI/ML applications, sustainability, and much needed workforce development. Invited talks on workforce development and AI transformation are presented in addition to new trends in economic and technological fronts for CMP.
A special session is held in honor of Prof. S. V. Babu. We encourage submission of all presented papers for consideration for inclusion in the ECS Journal of Solid State Science focus issue, Chemical Mechanical Planarization (CMP): Past, Present, and Future in Honor of S. V. Babu. A Short Course is planned on CMP process design, metrology, cleans, and yield improvement strategies.
Abstracts are solicited in these areas:
- CMP fundamental science and technology
- Heterogeneous integrations enabled by CMP
- CMP surface reactions and electrochemical effects
- Novel abrasives and synthesis techniques
- CMP of SiC and other wide bandgap materials
- CMP of III-V and II-VI materials
- Post CMP cleaning
- Other emerging applications of CMP
For more information, please consult the Call for Papers.
